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Global Wafer Grinding Equipment Market Research Report 2024
Synopsis
This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.
The global Wafer Grinding Equipment market was valued at US$ 875 million in 2023 and is anticipated to reach US$ 1396.7 million by 2030, witnessing a CAGR of 7.8% during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Wafer Grinding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinding Equipment.
Report Scope
The Wafer Grinding Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Grinding Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Grinding Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Okamoto Semiconductor Equipment Division
Strasbaugh
Disco
G&N Genauigkeits Maschinenbau Nürnberg GmbH
GigaMat
Arnold Gruppe
Hunan Yujing Machine Industrial
WAIDA MFG
SpeedFam
Koyo Machinery
ACCRETECH
Daitron
MAT Inc.
Dikema Presicion Machinery
Dynavest
Komatsu NTC
Segment by Type
Wafer Edge Grinder
Wafer Surface Grinder
Segment by Application
Semiconductor
Photovoltaic
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Grinding Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Grinding Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Grinding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
This report covers Wafer Edge Grinder and Wafer Surface Grinder in Semiconductor and Photovoltaic field.
The global Wafer Grinding Equipment market was valued at US$ 875 million in 2023 and is anticipated to reach US$ 1396.7 million by 2030, witnessing a CAGR of 7.8% during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Wafer Grinding Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Grinding Equipment.
Report Scope
The Wafer Grinding Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Grinding Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Grinding Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Okamoto Semiconductor Equipment Division
Strasbaugh
Disco
G&N Genauigkeits Maschinenbau Nürnberg GmbH
GigaMat
Arnold Gruppe
Hunan Yujing Machine Industrial
WAIDA MFG
SpeedFam
Koyo Machinery
ACCRETECH
Daitron
MAT Inc.
Dikema Presicion Machinery
Dynavest
Komatsu NTC
Segment by Type
Wafer Edge Grinder
Wafer Surface Grinder
Segment by Application
Semiconductor
Photovoltaic
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Grinding Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Grinding Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Grinding Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Wafer Grinding Equipment Market Overview
1.1 Product Definition
1.2 Wafer Grinding Equipment Segment by Type
1.2.1 Global Wafer Grinding Equipment Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Wafer Edge Grinder
1.2.3 Wafer Surface Grinder
1.3 Wafer Grinding Equipment Segment by Application
1.3.1 Global Wafer Grinding Equipment Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Semiconductor
1.3.3 Photovoltaic
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Grinding Equipment Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Wafer Grinding Equipment Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Wafer Grinding Equipment Production Estimates and Forecasts (2019-2030)
1.4.4 Global Wafer Grinding Equipment Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Grinding Equipment Production Market Share by Manufacturers (2019-2024)
2.2 Global Wafer Grinding Equipment Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Wafer Grinding Equipment, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Wafer Grinding Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Grinding Equipment Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Wafer Grinding Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Grinding Equipment, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Grinding Equipment, Date of Enter into This Industry
2.9 Wafer Grinding Equipment Market Competitive Situation and Trends
2.9.1 Wafer Grinding Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Grinding Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Grinding Equipment Production by Region
3.1 Global Wafer Grinding Equipment Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Wafer Grinding Equipment Production Value by Region (2019-2030)
3.2.1 Global Wafer Grinding Equipment Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Wafer Grinding Equipment by Region (2025-2030)
3.3 Global Wafer Grinding Equipment Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Wafer Grinding Equipment Production by Region (2019-2030)
3.4.1 Global Wafer Grinding Equipment Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Wafer Grinding Equipment by Region (2025-2030)
3.5 Global Wafer Grinding Equipment Market Price Analysis by Region (2019-2024)
3.6 Global Wafer Grinding Equipment Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Grinding Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Wafer Grinding Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Wafer Grinding Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Wafer Grinding Equipment Production Value Estimates and Forecasts (2019-2030)
4 Wafer Grinding Equipment Consumption by Region
4.1 Global Wafer Grinding Equipment Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Wafer Grinding Equipment Consumption by Region (2019-2030)
4.2.1 Global Wafer Grinding Equipment Consumption by Region (2019-2024)
4.2.2 Global Wafer Grinding Equipment Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Wafer Grinding Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Wafer Grinding Equipment Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Grinding Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Wafer Grinding Equipment Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Grinding Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Wafer Grinding Equipment Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Grinding Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Wafer Grinding Equipment Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Grinding Equipment Production by Type (2019-2030)
5.1.1 Global Wafer Grinding Equipment Production by Type (2019-2024)
5.1.2 Global Wafer Grinding Equipment Production by Type (2025-2030)
5.1.3 Global Wafer Grinding Equipment Production Market Share by Type (2019-2030)
5.2 Global Wafer Grinding Equipment Production Value by Type (2019-2030)
5.2.1 Global Wafer Grinding Equipment Production Value by Type (2019-2024)
5.2.2 Global Wafer Grinding Equipment Production Value by Type (2025-2030)
5.2.3 Global Wafer Grinding Equipment Production Value Market Share by Type (2019-2030)
5.3 Global Wafer Grinding Equipment Price by Type (2019-2030)
6 Segment by Application
6.1 Global Wafer Grinding Equipment Production by Application (2019-2030)
6.1.1 Global Wafer Grinding Equipment Production by Application (2019-2024)
6.1.2 Global Wafer Grinding Equipment Production by Application (2025-2030)
6.1.3 Global Wafer Grinding Equipment Production Market Share by Application (2019-2030)
6.2 Global Wafer Grinding Equipment Production Value by Application (2019-2030)
6.2.1 Global Wafer Grinding Equipment Production Value by Application (2019-2024)
6.2.2 Global Wafer Grinding Equipment Production Value by Application (2025-2030)
6.2.3 Global Wafer Grinding Equipment Production Value Market Share by Application (2019-2030)
6.3 Global Wafer Grinding Equipment Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Okamoto Semiconductor Equipment Division
7.1.1 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Corporation Information
7.1.2 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Product Portfolio
7.1.3 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served
7.1.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
7.2 Strasbaugh
7.2.1 Strasbaugh Wafer Grinding Equipment Corporation Information
7.2.2 Strasbaugh Wafer Grinding Equipment Product Portfolio
7.2.3 Strasbaugh Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Strasbaugh Main Business and Markets Served
7.2.5 Strasbaugh Recent Developments/Updates
7.3 Disco
7.3.1 Disco Wafer Grinding Equipment Corporation Information
7.3.2 Disco Wafer Grinding Equipment Product Portfolio
7.3.3 Disco Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Disco Main Business and Markets Served
7.3.5 Disco Recent Developments/Updates
7.4 G&N Genauigkeits Maschinenbau Nürnberg GmbH
7.4.1 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding Equipment Corporation Information
7.4.2 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding Equipment Product Portfolio
7.4.3 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.4.4 G&N Genauigkeits Maschinenbau Nürnberg GmbH Main Business and Markets Served
7.4.5 G&N Genauigkeits Maschinenbau Nürnberg GmbH Recent Developments/Updates
7.5 GigaMat
7.5.1 GigaMat Wafer Grinding Equipment Corporation Information
7.5.2 GigaMat Wafer Grinding Equipment Product Portfolio
7.5.3 GigaMat Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.5.4 GigaMat Main Business and Markets Served
7.5.5 GigaMat Recent Developments/Updates
7.6 Arnold Gruppe
7.6.1 Arnold Gruppe Wafer Grinding Equipment Corporation Information
7.6.2 Arnold Gruppe Wafer Grinding Equipment Product Portfolio
7.6.3 Arnold Gruppe Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Arnold Gruppe Main Business and Markets Served
7.6.5 Arnold Gruppe Recent Developments/Updates
7.7 Hunan Yujing Machine Industrial
7.7.1 Hunan Yujing Machine Industrial Wafer Grinding Equipment Corporation Information
7.7.2 Hunan Yujing Machine Industrial Wafer Grinding Equipment Product Portfolio
7.7.3 Hunan Yujing Machine Industrial Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Hunan Yujing Machine Industrial Main Business and Markets Served
7.7.5 Hunan Yujing Machine Industrial Recent Developments/Updates
7.8 WAIDA MFG
7.8.1 WAIDA MFG Wafer Grinding Equipment Corporation Information
7.8.2 WAIDA MFG Wafer Grinding Equipment Product Portfolio
7.8.3 WAIDA MFG Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.8.4 WAIDA MFG Main Business and Markets Served
7.7.5 WAIDA MFG Recent Developments/Updates
7.9 SpeedFam
7.9.1 SpeedFam Wafer Grinding Equipment Corporation Information
7.9.2 SpeedFam Wafer Grinding Equipment Product Portfolio
7.9.3 SpeedFam Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.9.4 SpeedFam Main Business and Markets Served
7.9.5 SpeedFam Recent Developments/Updates
7.10 Koyo Machinery
7.10.1 Koyo Machinery Wafer Grinding Equipment Corporation Information
7.10.2 Koyo Machinery Wafer Grinding Equipment Product Portfolio
7.10.3 Koyo Machinery Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Koyo Machinery Main Business and Markets Served
7.10.5 Koyo Machinery Recent Developments/Updates
7.11 ACCRETECH
7.11.1 ACCRETECH Wafer Grinding Equipment Corporation Information
7.11.2 ACCRETECH Wafer Grinding Equipment Product Portfolio
7.11.3 ACCRETECH Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.11.4 ACCRETECH Main Business and Markets Served
7.11.5 ACCRETECH Recent Developments/Updates
7.12 Daitron
7.12.1 Daitron Wafer Grinding Equipment Corporation Information
7.12.2 Daitron Wafer Grinding Equipment Product Portfolio
7.12.3 Daitron Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Daitron Main Business and Markets Served
7.12.5 Daitron Recent Developments/Updates
7.13 MAT Inc.
7.13.1 MAT Inc. Wafer Grinding Equipment Corporation Information
7.13.2 MAT Inc. Wafer Grinding Equipment Product Portfolio
7.13.3 MAT Inc. Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.13.4 MAT Inc. Main Business and Markets Served
7.13.5 MAT Inc. Recent Developments/Updates
7.14 Dikema Presicion Machinery
7.14.1 Dikema Presicion Machinery Wafer Grinding Equipment Corporation Information
7.14.2 Dikema Presicion Machinery Wafer Grinding Equipment Product Portfolio
7.14.3 Dikema Presicion Machinery Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Dikema Presicion Machinery Main Business and Markets Served
7.14.5 Dikema Presicion Machinery Recent Developments/Updates
7.15 Dynavest
7.15.1 Dynavest Wafer Grinding Equipment Corporation Information
7.15.2 Dynavest Wafer Grinding Equipment Product Portfolio
7.15.3 Dynavest Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Dynavest Main Business and Markets Served
7.15.5 Dynavest Recent Developments/Updates
7.16 Komatsu NTC
7.16.1 Komatsu NTC Wafer Grinding Equipment Corporation Information
7.16.2 Komatsu NTC Wafer Grinding Equipment Product Portfolio
7.16.3 Komatsu NTC Wafer Grinding Equipment Production, Value, Price and Gross Margin (2019-2024)
7.16.4 Komatsu NTC Main Business and Markets Served
7.16.5 Komatsu NTC Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Grinding Equipment Industry Chain Analysis
8.2 Wafer Grinding Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Grinding Equipment Production Mode & Process
8.4 Wafer Grinding Equipment Sales and Marketing
8.4.1 Wafer Grinding Equipment Sales Channels
8.4.2 Wafer Grinding Equipment Distributors
8.5 Wafer Grinding Equipment Customers
9 Wafer Grinding Equipment Market Dynamics
9.1 Wafer Grinding Equipment Industry Trends
9.2 Wafer Grinding Equipment Market Drivers
9.3 Wafer Grinding Equipment Market Challenges
9.4 Wafer Grinding Equipment Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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