SynopsisThe global Disperse Textile Fiber Dyes market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Disperse Textile Fiber Dyes is estimat.....
SynopsisPrinting ink is colored glue stick, make of dye, binders and the additives, used for clothing and paper printing, and can be dried on the object to be printed. The global Screen Printing Inks market was valued at US$ 1495.9 million in 2023 and is anticip.....
SynopsisThe Polyphenylene Sulfide (PPS) Resin market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global marke.....
SynopsisThe Ni8 Series Ternary Material refers to a group of advanced materials used in the manufacturing of rechargeable batteries, particularly lithium-ion batteries. This material is a ternary composed of nickel (Ni), cobalt (Co), and manganese (Mn). The Ni8 Series.....
SynopsisPlasticizers,also called Water Reducers，impart plasticizing effect in wetconcrete; are organic substances or combination of organic and inorganicsubstances. The global Superplasticizers market was valued at US$ 4210.7 million in 2023 and is anticipated .....
SynopsisReflection Glass Curtainwall is an outer covering of a building in which the outer walls are non-structural, but merely keep the weather out and the occupants in. The global Exposed Framing Glass Curtain Wall market size is expected to reach US$ million .....
SynopsisNatural polymers are those substances which are derived from natural sources. These polymers are either synthesized by addition polymerization or condensation polymerization. For the purposes of this report, natural polymers refer specifically to biopoly.....
SynopsisThe global Multilayered Chip Coil market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Multilayered Chip Coil in various end use industries. The expanding.....
SynopsisIn integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in mult.....
SynopsisWood Plastic Composite Sheets can be used for building materials, furniture and logistics packaging. The global Wood Plastic Composite Boards & Sheets market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The mar.....
