SynopsisThe Nickel Titanium Alloy (Ni-Ti Alloy) market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global mar.....
Synopsis4-Hydroxyphenyl Hydantoin is an intermediate mainly used in the production of anti-tumor medicinal products. The global 4-Hydroxyphenyl Hydantoin market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR .....
SynopsisThe global PU Artificial Leather market size is expected to reach US$ 13290 million by 2029, growing at a CAGR of 3.2% from 2023 to 2029. The market is mainly driven by the significant applications of PU Artificial Leather in various end use industries. The ex.....
SynopsisThe Isoeugenol Benzyl Ether (CAS: 120-11-6) market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global.....
SynopsisHigh-temperature superconductor (HTS) wires are made from superconductors with high critical temperature (high-temperature superconductivity), such as YBCO and BSCCO. The global HTS Wire market was valued at US$ million in 2023 and is anticipated to reac.....
Synopsis A safe and reliable pitch system is critical for the wind turbine’s performance and power production. Wind turbine pitch control system can change incidence of rotor blades in a wind power generation system based on real-time win.....
SynopsisStructural steel is a category of steel used as a construction material for making structural steel shapes. A structural steel shape is a profile, formed with a specific cross section and following certain standards for chemical composition and mechanical prop.....
SynopsisThe DL-Pipecolinic Acid market size, estimations, and forecasts are provided in terms of output/shipments (K MT) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments .....
SynopsisWire bonding is the method of making interconnections between an integrated circuit or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or.....
SynopsisSpinel is a transparent ceramic with a cubic crystal structure with an excellent optical transmission from 0.2 to 5.5 micrometers in its polycrystalline form. The global Transparent Ceramic Spinel market was valued at US$ million in 2023 and is anticipat.....
