SynopsisThe global Pressure Sensor Chip market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. Following a strong growth of 26.2 percent in the year 2021, WSTS revise.....
SynopsisThe mechanical interlock is an interference (non-jamming) type, locking at the beginning of the stroke of any starter or contactor. The global Mechanical Interlocking Contactor market was valued at US$ million in 2023 and is anticipated to reach US$ mil.....
SynopsisCalcium fluoride (CaF2) is a kind of high hardness crystal with high impact and thermal impact resistance. The material has good transmittance in the range of ultraviolet, visible and infrared bands. It can eliminate the secondary spectrum and perform well in .....
SynopsisIt's a range of transistor output type general-purpose photocouplers (optocouplers), feature a high isolation voltage, high temperature operation The global Transistor Optocoupler market was valued at US$ 747 million in 2023 and is anticipated to reach .....
SynopsisThe global Virtual Reality 3D Scanning market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Virtual Reality 3D Scanning is estimat.....
SynopsisPiezoceramic Hemispheres is one of electromechanical transducers. They can convert mechanical energy into erlectrical energy and vice-versa. Piezoceramic Hemispheres are used in a variety of electromechanical transducer in a wide frequency range. Piezoceramic .....
SynopsisEquation editors are important for online education or for printing educational books The global Equation Editors market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period .....
SynopsisFPGA Core Boards The global FPGA Core Boards market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for FPGA Core Boards is estima.....
SynopsisHigh Density Interconnect PCB is a multilayer board that are constructed with densely routed layers and the boards are held together through a lamination process. These layers are electrically interconnected using different types of vias. A HDI PCB is usually .....
SynopsisThe global Single Pole Rotary Switch market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Single Pole Rotary Switch is estimated t.....
