SynopsisEnterprise Fraud Management (EFM) is the collection of processes designed to prevent internal and external fraud in an organization. EFM collects user, account, and device data in order to identify fraud, corruption, or criminal behavior. Global Enterpri.....
SynopsisGlobal Sectional Terminal Blocks market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, hav.....
Synopsis Highlights The global Enterprise Legal Management Software Tools market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The in.....
Synopsis The non-dispersive infrared gas sensor is an optical gas sensor composed of infrared light source, optical path, infrared detector, circuit and software algorithm. Global Non-Dispersive Infrared Gas Sensor market is projected to reach US.....
SynopsisTunable capacitors are the general capacitors that provide an added advantage of achieving a high quality radio frequency link in various consumer electronics. The capability of such antenna tuners to provide radio frequency links of a high quality has led to .....
Synopsis Electronic paper display or e-paper display is a portable, reusable electronic display medium, which has paper-like properties such as wide viewing angle, high flexibility, and no backlight. The global Electronic Paper Screen in .....
SynopsisThe global IoT Solutions Market for Energy market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. According to our research, the number of global connected Io.....
SynopsisDie bonding is the process of attaching a die/chip to a substrate or package. Die bonding is accomplished by using one of the following processes: 1. Eutectic; 2. Solder; 3. Adhesive; 4. Glass or Silver-Glass The global Die Bonding Machine market was val.....
SynopsisMetal bonding wire and ribbon are materials commonly used in the electronics industry for connecting various components in electronic devices, such as integrated circuits (ICs) and semiconductor packages. The global Metal Semiconductor Bonding Wire marke.....
SynopsisA plastic-clad silica fiber is a optical fiber with a glass core and plastic cladding. The global Plastic-Clad Silica Fiber market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the foreca.....
