SynopsisTuning capacitors may have their capacitance changed by mechanical motion. Generally two versions has to be distinguished Variable capacitor – variable capacitor for intentionally and repeatedly tuning an oscillator circuit in a radio or another tuned ci.....
SynopsisA power multiplexer and switch, often referred to as a power mux or power switch, is an electronic component or device used to control and route power supply to multiple devices or circuits. It allows for the selective connection and disconnection of power sou.....
SynopsisThe hyper spectral imaging system (HSI) involves collection and processing of data which is collected across an electromagnetic spectrum. The hyper spectral imaging system enables obtaining spectrum for every pixel in a particular image or a sequence of images.....
SynopsisPress release distribution software is a software that is used by companies’ PR to press releases and other news. The global Press Release Distribution Software market was valued at US$ 3542 million in 2023 and is anticipated to reach US$ 5272.2 million .....
SynopsisHigh-frequency inductors consist of ceramic materials made of glass and internal/external electrodes made of silver. These inductors can be applied usefully for high frequency of 100 MHz or higher because they have high Q characteristics in high frequency, the.....
SynopsisECU are on behalf of electronic control unit，autonomous vehicle ECU are composed of microprocessor (CPU), memory (ROM, RAM), input/output interface (I/O), AD converter (A/D) and large scale integrated circuit (lsi) such as shaping and driving. The global.....
SynopsisAlongside the rise of the industrial internet, every aspect of shipping has been touched by the integration of automation and big data. The ‘connected ship’ represents a model where vessels are tracked and managed via satellite, offering streamlined reporting .....
SynopsisThe global market for Flip-Chip Bumping was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period. North American market for Flip-Chip Bumping is estimated.....
SynopsisThe global App Maker Software market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of App Maker Software in various end use industries. The expanding demands.....
SynopsisBare die is used in a broad array of industries, and markets, including aerospace, military, avionics, automotive and other high-end industries. Hence, bare die is a preferential choice of most of the design engineers and buyers. They provide various advantage.....
