SynopsisUnderfill adhesive for IC packaging is a high-fluidity, high-filling capacity adhesive material specially used in the semiconductor chip packaging process. Its main function is to form a filling layer between the chip and the substrate to enhance the mechanica.....
SynopsisFlipped learning is a hybrid model that combines aspects of traditional learning and blended learning. This model encourages students to take technology-aided lectures outside of the classroom through videos and simulations. Lessons taken in advance by student.....
Synopsis Global Smart Agriculture Digital Twin market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Rus.....
SynopsisThe global Digital Evidence Management Software market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considere.....
SynopsisA Video Graphics Array (VGA) Connector is a three-row 15-pin DE-15 connector. The 15-pin VGA connector was provided on many video cards, computer monitors, laptop computers, projectors, and high definition television sets. The global VGA Connector market.....
SynopsisThe global Thermal Infrared Sensors market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Thermal Infrared Sensors in various end use industries. The expan.....
SynopsisThe global Logistic Regression Models market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Logistic Regression Models is estimated .....
SynopsisA process for planarization of wafers is nowadays an integral part in every semiconductor production facility. This step is done before patterning the wafer to provide a flat surface for exposing different mask images on. Pressure is applied to the wafer cover.....
SynopsisHuman resource (HR) management software, also called Core HR, include the following: benefits administration, personnel tracking, payroll. These systems are also referred to as back-end HR systems since they help manage key administrative HR tasks, and are ess.....
SynopsisThe global Carbon Nanotube (CNT) Heaters market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Carbon Nanotube (CNT) Heaters is esti.....
