SynopsisA transistor is a semiconductor device that is used to switch or amplify electrical signals. The global Power Transistor market size is expected to reach US$ 13530 million by 2029, growing at a CAGR of 2.7% from 2023 to 2029. The market is mainly driven .....
SynopsisThe global Semiconductor 3D Metrology Equipment market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considere.....
SynopsisThe global Cuboid Fuse market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market.....
SynopsisThe wafer hot plate is a hot plate designed specifically for baking silicon wafers. Global Wafer Hot Plate market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influ.....
SynopsisThe global Surface Acoustic Wave (SAW) Devices market size is expected to reach US$ 2906.6 million by 2029, growing at a CAGR of 3.9% from 2023 to 2029. The market is mainly driven by the significant applications of Surface Acoustic Wave (SAW) Devices in vario.....
Synopsis Highlights The global Mainframe Data Modernization Services market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influ.....
Synopsis Global Board Mount Pressure Sensor Digital Output market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVI.....
SynopsisSilicon rings for etching are mainly used on 8-12 inches (i.e., 200mm-300mm) plasma etcher. In the manufacturing process of integrated circuits, high-purity silicon components and wafers are made of silicon, which makes the electrical properties of etching mor.....
Synopsis SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can.....
SynopsisHigh permeability manganese-zinc ferrite core is a magnetic material commonly used in transformers, inductors, sensors and other magnetic components in electronic and electrical equipment. It has high magnetic permeability and good hysteresis characteristics, .....
