SynopsisThe global IT Service Management Software market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for IT Service Management Software is e.....
SynopsisThe global Entrepreneurial Performance Management market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Entrepreneurial Performance.....
SynopsisThe Industrial Controls and Factory Automation market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and glo.....
SynopsisSupported by the need to achieve accuracy and safety in volatile zones and the implementation of government regulations globally, the market for hazardous area sensors has received a significant boost. The global Hazardous Area Sensors market size is exp.....
SynopsisThe Innovation Program Management Software market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global .....
SynopsisCardiovascular information system (CVIS) could allow transformation across people, process, organization and technology facets. The global Cardiovascular Informations (CVIS) market size is expected to reach US$ million by 2029, growing at a CAGR of % fro.....
SynopsisAn organ-on-a-chip (OOC) is a multi-channel 3-D microfluidic cell culture chip that simulates the activities, mechanics and physiological response of entire organs and organ systems, a type of artificial organ. It constitutes the subject matter of significant .....
SynopsisData bus coupler is a device which is used to couple one bus to the other without any interruption in power supply and without creating hazardous arcs. The global Data Bus Coupler market size is expected to reach US$ million by 2029, growing at a CAGR of.....
SynopsisBecause completed wafers are thinner compared to their areas and are susceptible to contamination, they may bend or break during transportation. FOSB Wafer Carrier Boxes can provide a clean, secure environment for valuable 300 mm wafers as they move through nu.....
SynopsisTechnical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN are pushing.....
