Synopsis The global Motor Main Control Chip market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The motor main control chip is an integrated circuit used.....
SynopsisThe global Submount (Heatspreader) market size was valued at USD 293.9 million in 2022 and is forecast to a readjusted size of USD 366.3 million by 2029 with a CAGR of 3.2% during review period. A submount is used in electronics that provides mechanical.....
SynopsisThe global Wafer Bonding Equipment market size was valued at USD 328.1 million in 2022 and is forecast to a readjusted size of USD 515.2 million by 2029 with a CAGR of 6.7% during review period. Global key players of wafer bonding equipment include EV G.....
SynopsisThe global Trade Show Services market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Trade Show Services is estimated to increase f.....
SynopsisMarket Analysis and Insights: Global Snap-in Aluminum Electrolytic Capacitor Market Due to the COVID-19 pandemic, the global Snap-in Aluminum Electrolytic Capacitor market size is estimated to be worth US$ million in 2022 and is forecast to a readjusted.....
SynopsisUltra-low-power microcontroller devices are a category of microcontrollers that are designed to operate with minimal power consumption. These devices are particularly well-suited for battery-powered or energy-harvesting applications where power efficiency is c.....
SynopsisTool Qualification is a mandated process for organizations developing software in safety critical industries. The global Tool Qualification Service market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market.....
SynopsisMetal bonding wire and ribbon are materials commonly used in the electronics industry for connecting various components in electronic devices, such as integrated circuits (ICs) and semiconductor packages. The global Semiconductor Packaging Bonding Wire m.....
SynopsisThe global Endpoint Threat Detection market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Endpoint Threat Detection is estimated t.....
SynopsisThermal Infrared Imaging requires the use of special cameras. The imaging sensors in these cameras are sensitive to wavelengths in the infrared region of the electro-magnetic spectrum. Thermal Infrared Imaging is also referred to as “non-visible” imaging, sinc.....
