SynopsisVirtual Reality (VR) and Augmented Reality (AR) technologies are increasingly being integrated into the education sector, offering innovative and immersive learning experiences for students. These technologies leverage computer-generated simulations and intera.....
SynopsisEdge AI Platform is a system that uses Machine Learning algorithms to process data generated by a hardware device at the local level. Global Edge AI Platforms market is projected to reach US$ 2142.8 million in 2029, increasing from US$ 968.2 million in 2.....
SynopsisA payment aggregator is a third-party payment service provider (PSP) that uses one large merchant account to process payments of sub-accounts owned by their users. Global Aggregated Payment Platform market is projected to reach US$ million in 2029, incre.....
SynopsisInspection Management Software: Create forms and checklists, schedule inspections, record results and track corrective actions to completion. Global Inspection Management Software System market is projected to reach US$ million in 2029, increasing from U.....
SynopsisSemiconductor dicing die bonding tape, also known as dicing tape or die attach tape, is a specialized adhesive tape used in the semiconductor manufacturing process. It plays a crucial role in wafer dicing and die bonding, which are essential steps in the produ.....
SynopsisWafer Transfer Robot Arm has the same function as a robot.Designed for handling wafers in a production line or inspection line of semiconductor. Global Wafer Transfer Robot Arm market is projected to reach US$ 1583.4 million in 2029, increasing from US$ .....
SynopsisNext Generation Sequencing (NGS), also known as high-throughput sequencing, refers to advanced genomic technologies that enable the rapid and cost-effective sequencing of DNA or RNA molecules. NGS solutions have revolutionized the field of genomics and have si.....
SynopsisAn Electronic Multilayer Varistor (MLV) is a compact, surface-mountable chip that is voltage dependent, nonlinear, and bidirectional. It has an electrical V-I characteristic similar to back-to-back zener diodes, offering symmetrical protection in both forward .....
SynopsisGlobal Talent Matching Software market is projected to reach US$ 35770 million in 2029, increasing from US$ 21860 million in 2022, with the CAGR of 7.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Uk.....
SynopsisNavigation-grade IMU (Inertial Measurement Unit) is a highly accurate inertial sensor system used for navigation and positioning applications. It combines multiple sensors such as accelerometers, gyroscopes, and magnetometers to measure acceleration, rotation,.....
