SynopsisThe global Corporate E Learning Solutions market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The Global Info Research report includes an overview of the develo.....
SynopsisThe global 10 Gbps DFB Laser Diode Chip market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. The global market for semiconductor was estimated at US$ 579 bi.....
Synopsis Market Analysis and Insights: Global Unified Endpoint Management and Security Market The global Unified Endpoint Management and Security market size is projected to reach US$ million by 2028, from US$ million in 2021, at.....
SynopsisIndustrial samplers are used to extract samples of free-flowing materials such as coal, aggregate, wood chips, plastics and liquid. The design and operation of the sampler eliminates issues inherent with hand-sampling methods and provide representative and rep.....
SynopsisThe global Aviation Actuator System market size is expected to reach US$ 1050.7 million by 2029, growing at a CAGR of 4.1% from 2023 to 2029. The market is mainly driven by the significant applications of Aviation Actuator System in various end use industries......
SynopsisWater is an integral part of oil and gas production both as an ingredient and as the largest by-product. Waste water includes water from reservoir, water injected into the well, drilling of exploration wells, oil and gas processing, and refining. Proper manage.....
SynopsisThe global Cloud ITSM market size is expected to reach US$ 19360 million by 2029, growing at a CAGR of 18.6% from 2023 to 2029. The market is mainly driven by the significant applications of Cloud ITSM in various end use industries. The expanding demands from .....
SynopsisA studio mixing board is an electronic device for mixing audio signals, used in sound recording and reproduction and sound reinforcement systems. Inputs to the console include microphones, signals from electric or electronic instruments, or recorded sounds. Mi.....
SynopsisSilicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding.....
SynopsisThe global Pressure Transducers market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Pressure Transducers is estimated to increase.....
