Synopsis3D time of flight (ToF) is a type of scanner-less LIDAR (light detection and ranging) that uses high power optical pulses in durations of nanoseconds to capture depth information (typically over short distances) from a scene of interest. The global 3D Ti.....
SynopsisThe global Bimetal Sensor market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Bimetal Sensor is estimated to increase from $ mill.....
SynopsisThe global Virtual Reality Panoramic Video Shooting market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Virtual Reality Panoramic.....
SynopsisPiezoelectric Discs are one of the piezoelectric ceramic elements with Disc shape, and they can be used as actuators, sensors, generators, etc. This range is fabricated from many available piezoelectric material formulations to respond to the ever growing chal.....
SynopsisProduct Packaging Testing can find out the most appropriate packaging for the product. The global Product Packaging Testing market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the foreca.....
SynopsisThe global Consumer Trend Forecasting Software market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Consumer Trend Forecasting Soft.....
SynopsisThe global Powder Processing Service market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Powder Processing Service is estimated t.....
SynopsisIC substrate is the core material of the packaging link and has a high technical threshold. IC substrate directly loads the chip, provides an electronic connection between the chip and the PCB motherboard, plays the role of "connecting the above and the next",.....
SynopsisThe global Failure Modes and Effects Analysis (FMEA) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Failure Modes and Effect.....
SynopsisPrinted circuit boards (PCB) play a pivotal role in the functioning and performance of automotive electronics. From powertrain systems to ADAS, infotainment and lighting, PCBs can be found enabling various functions. The global Automotive Intelligent Coc.....
