SynopsisGlobal RF and Microwave Ceramic Capacitors includes AVX, Walsin, and Murata, etc. Global top three companies hold a share over 68%. China is the largest market, with a share about 33%, followed by Japan and Europe with the share about 18% and 13%. .....
SynopsisThe polycrystalline silicon ingot casting furnace is one of the key equipment for polycrystalline silicon manufacturing. The stability of its process flow, the stability and advancement of equipment control are directly related to whether it can produce qualif.....
SynopsisA rugged (or ruggedized, but also ruggedised) computer is a computer specifically designed to operate reliably in harsh usage environments and conditions, such as strong vibrations, extreme temperatures and wet or dusty conditions. According to the type,.....
SynopsisSuperluminescent light-emitting diode (SLED) has developed rapidly in recent years. It is a semiconductor optoelectronic device between laser (LD) and light-emitting diode (LED). The luminescence mechanism is a directional radiation phenomenon under strong exc.....
SynopsisGlobal Single Wafer Clean Machine includes SCREEN Semiconductor Solutions, TEL, and Lam Research, etc. Global top three companies hold a share over 82%. China is the largest market, with a share about 30%, followed by North America and Japan with the share abo.....
SynopsisIn the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing activator, additive and organic solvent is generally used. Chemical substances that can help and promote the welding process in the welding pro.....
SynopsisChina is the largest producer and consumer, with a production share of about 47% in 2019，the Asia-Pacific region is the largest consumer region, with a sales share of about 62% in 2019. The product is divided into distributors and ignition coils, and ign.....
SynopsisThin Wafers Temporary Bonding Equipment is to closely combine two mirror polished homogeneous or heterogeneous wafers through chemical and physical actions. After wafer bonding, atoms at the interface react under the action of external forces to form a covalen.....
SynopsisGlobal Vertical Furnaces include Tokyo Electron Limited, Kokusai Electric Corporation, Koyo Thermo Systems, ASM International, NAURA, Centrotherm Photovoltaics and Tempress, etc. Global top 3 companies hold a share over 73%. China is the largest market, with a.....
SynopsisVertical Probe Cards refers the probe cards' probe needles are vertical to the substrate. MEMS stands for “microelectromechanical system.” It generally refers to high-density devices (particularly those with moving parts) that are produced by integrating machi.....
