Synopsis The global Inverted Chip Packaging Method market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were .....
SynopsisThe global Non-contact Infrared Heat Sensor market size was valued at USD 548.7 million in 2022 and is forecast to a readjusted size of USD 704.6 million by 2029 with a CAGR of 3.6% during review period. The influence of COVID-19 and the Russia-Ukraine War wer.....
SynopsisThe global ESC Sensors market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for ESC Sensors is estimated to increase from $ million in.....
Content moderation is the process of evaluating the text, images, videos, profiles, and other content uploaded by users to ensure it does not violate legal, safety, cultural, or community standards. The global Content Automated Moderation Solution market was valued at .....
SynopsisPerformance Testing is defined as a type of software testing to ensure software applications will perform well under their expected workload. The global Performance Testing market size is expected to reach US$ 1215.1 million by 2029, growing at a CAGR of.....
SynopsisAn infrared sensor for smart elderly care refers to a technology that utilizes infrared (IR) technology to monitor the activities and well-being of elderly individuals in a smart home or healthcare setting.Infrared sensors are electronic devices that can detec.....
SynopsisThe global Business Process Testing Software market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Business Process Testing Softwar.....
SynopsisFan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. The global Fan-out Wafer Level Package market was valued at US$ million in 2023 and is anticipated to reach.....
SynopsisThe global Cast Resin Dry-Type Transformer market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Cast Resin Dry-Type Transformer is.....
SynopsisThe global Modulator Drivers market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Modulator Drivers is estimated to increase from .....
