SynopsisIt is developed for the application of carbon nanotubes in plastics. After the carbon nanotube functional masterbatch and the matrix resin are melted and compounded in a twin-screw extruder, the special material for electrostatic conductive plastics can be obt.....
SynopsisSingle crystal growing furnace allows crystals to be produced with the bridgman ,czochralski or float zone method, etc. This technique is used to grow single crystals of semiconductor materials (silicon, germanium and gallium arsenide), metals, salts and synth.....
SynopsisGallium arsenide is a group III-V compound semiconductor, which is composed of two elements, arsenic and gallium. It has a bright gray appearance, metallic luster, brittle and hard, high frequency, high electron mobility, high output power, and low power. Exce.....
SynopsisDeveloper for photolithography is chemical agents used in photolithography processes (development) to form circuits in semiconductor wafers. Market Analysis and Insights: Global Developer for Photolithography Market The global Developer for .....
SynopsisSince photoresist products require subsequent removal prior to the commencement of further manufacturing processes, strippers need to be formulated to efficiently and effectively remove photoresists, as well as other debris that might interfere with subsequent.....
SynopsisThe oxidation furnace is a high-temperature furnace, especially designed for the oxidation of silicon carbide (SiC) by centrotherm thermal solutions. Its capability to run high process temperatures of up to 1400°C and oxidation processes using O2, N2O, NO, NO2.....
SynopsisDiffusion (sometimes referred to as annealing) is a thermal treatment used to move dopants, or impurities, and make dopants introduced by ion implantation electrically active. Oxidation forms a silicon oxide layer on the wafer’s surface, which acts as an insul.....
SynopsisSemiconductor wafer packaging refers to the process of processing wafers to obtain independent chips according to product model and functional requirements. The main processes include: filming-polishing-film removal-cutting-pasting-bonding-lamination-baking-el.....
SynopsisWithin the wafer debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding etc......
SynopsisWithin the wafer debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding etc......
