SynopsisSince photoresist products require subsequent removal prior to the commencement of further manufacturing processes, strippers need to be formulated to efficiently and effectively remove photoresists, as well as other debris that might interfere with subsequent.....
SynopsisThe oxidation furnace is a high-temperature furnace, especially designed for the oxidation of silicon carbide (SiC) by centrotherm thermal solutions. Its capability to run high process temperatures of up to 1400°C and oxidation processes using O2, N2O, NO, NO2.....
SynopsisDiffusion (sometimes referred to as annealing) is a thermal treatment used to move dopants, or impurities, and make dopants introduced by ion implantation electrically active. Oxidation forms a silicon oxide layer on the wafer’s surface, which acts as an insul.....
SynopsisSemiconductor wafer packaging refers to the process of processing wafers to obtain independent chips according to product model and functional requirements. The main processes include: filming-polishing-film removal-cutting-pasting-bonding-lamination-baking-el.....
SynopsisWithin the wafer debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding etc......
SynopsisWithin the wafer debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding etc......
SynopsisWithin the wafer debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding etc......
SynopsisWafer Packaging Inspection Systems is designed to inspect advanced wafer-level packaging process steps, providing information on the full range of defect types for inline process control through multi-mode optics and sensors and advanced defect detection algor.....
SynopsisWafer Packaging Inspection Systems is designed to inspect advanced wafer-level packaging process steps, providing information on the full range of defect types for inline process control through multi-mode optics and sensors and advanced defect detection algor.....
SynopsisIn semiconductor manufacturing plasma ashing is the process of removing the photoresist (light sensitive coating) from an etched wafer. Using a plasma source, a monatomic (single atom) substance known as a reactive species is generated. Oxygen or fluorine are .....
