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2.5D IC Flip Chip Product-Global Market Insights and Sales Trends 2025
Synopsis
The global 2.5D IC Flip Chip Product market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 2.5D IC Flip Chip Product in various end use industries. The expanding demands from the Electronics, Industrial, Automotive & Transport and Healthcare, are propelling 2.5D IC Flip Chip Product market. Copper Pillar, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Solder Bumping segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 2.5D IC Flip Chip Product, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 2.5D IC Flip Chip Product market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 2.5D IC Flip Chip Product market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 2.5D IC Flip Chip Product sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 2.5D IC Flip Chip Product covered in this report include TSMC (Taiwan), Samsung (South Korea), ASE Group (Taiwan), Amkor Technology (US), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan) and STMicroelectronics (Switzerland), etc.
The global 2.5D IC Flip Chip Product market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
TSMC (Taiwan)
Samsung (South Korea)
ASE Group (Taiwan)
Amkor Technology (US)
UMC (Taiwan)
STATS ChipPAC (Singapore)
Powertech Technology (Taiwan)
STMicroelectronics (Switzerland)
Global 2.5D IC Flip Chip Product market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 2.5D IC Flip Chip Product market, Segment by Type:
Copper Pillar
Solder Bumping
Tin-lead eutectic solder
Lead-free solder
Gold Bumping
Others
Global 2.5D IC Flip Chip Product market, by Application
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of 2.5D IC Flip Chip Product manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of 2.5D IC Flip Chip Product in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global 2.5D IC Flip Chip Product market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 2.5D IC Flip Chip Product in various end use industries. The expanding demands from the Electronics, Industrial, Automotive & Transport and Healthcare, are propelling 2.5D IC Flip Chip Product market. Copper Pillar, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Solder Bumping segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 2.5D IC Flip Chip Product, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 2.5D IC Flip Chip Product market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 2.5D IC Flip Chip Product market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 2.5D IC Flip Chip Product sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 2.5D IC Flip Chip Product covered in this report include TSMC (Taiwan), Samsung (South Korea), ASE Group (Taiwan), Amkor Technology (US), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan) and STMicroelectronics (Switzerland), etc.
The global 2.5D IC Flip Chip Product market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
TSMC (Taiwan)
Samsung (South Korea)
ASE Group (Taiwan)
Amkor Technology (US)
UMC (Taiwan)
STATS ChipPAC (Singapore)
Powertech Technology (Taiwan)
STMicroelectronics (Switzerland)
Global 2.5D IC Flip Chip Product market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 2.5D IC Flip Chip Product market, Segment by Type:
Copper Pillar
Solder Bumping
Tin-lead eutectic solder
Lead-free solder
Gold Bumping
Others
Global 2.5D IC Flip Chip Product market, by Application
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of 2.5D IC Flip Chip Product manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of 2.5D IC Flip Chip Product in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 2.5D IC Flip Chip Product Market Overview
1.1 2.5D IC Flip Chip Product Product Overview
1.2 2.5D IC Flip Chip Product Market Segment by Type
1.2.1 Copper Pillar
1.2.2 Solder Bumping
1.2.3 Tin-lead eutectic solder
1.2.4 Lead-free solder
1.2.5 Gold Bumping
1.2.6 Others
1.3 Global 2.5D IC Flip Chip Product Market Size by Type
1.3.1 Global 2.5D IC Flip Chip Product Market Size Overview by Type (2018-2029)
1.3.2 Global 2.5D IC Flip Chip Product Historic Market Size Review by Type (2018-2023)
1.3.3 Global 2.5D IC Flip Chip Product Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America 2.5D IC Flip Chip Product Sales Breakdown by Type (2018-2023)
1.4.2 Europe 2.5D IC Flip Chip Product Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific 2.5D IC Flip Chip Product Sales Breakdown by Type (2018-2023)
1.4.4 Latin America 2.5D IC Flip Chip Product Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa 2.5D IC Flip Chip Product Sales Breakdown by Type (2018-2023)
2 Global 2.5D IC Flip Chip Product Market Competition by Company
2.1 Global Top Players by 2.5D IC Flip Chip Product Sales (2018-2023)
2.2 Global Top Players by 2.5D IC Flip Chip Product Revenue (2018-2023)
2.3 Global Top Players by 2.5D IC Flip Chip Product Price (2018-2023)
2.4 Global Top Manufacturers 2.5D IC Flip Chip Product Manufacturing Base Distribution, Sales Area, Product Type
2.5 2.5D IC Flip Chip Product Market Competitive Situation and Trends
2.5.1 2.5D IC Flip Chip Product Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by 2.5D IC Flip Chip Product Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in 2.5D IC Flip Chip Product as of 2022)
2.7 Date of Key Manufacturers Enter into 2.5D IC Flip Chip Product Market
2.8 Key Manufacturers 2.5D IC Flip Chip Product Product Offered
2.9 Mergers & Acquisitions, Expansion
3 2.5D IC Flip Chip Product Status and Outlook by Region
3.1 Global 2.5D IC Flip Chip Product Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global 2.5D IC Flip Chip Product Historic Market Size by Region
3.2.1 Global 2.5D IC Flip Chip Product Sales in Volume by Region (2018-2023)
3.2.2 Global 2.5D IC Flip Chip Product Sales in Value by Region (2018-2023)
3.2.3 Global 2.5D IC Flip Chip Product Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global 2.5D IC Flip Chip Product Forecasted Market Size by Region
3.3.1 Global 2.5D IC Flip Chip Product Sales in Volume by Region (2024-2029)
3.3.2 Global 2.5D IC Flip Chip Product Sales in Value by Region (2024-2029)
3.3.3 Global 2.5D IC Flip Chip Product Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global 2.5D IC Flip Chip Product by Application
4.1 2.5D IC Flip Chip Product Market Segment by Application
4.1.1 Electronics
4.1.2 Industrial
4.1.3 Automotive & Transport
4.1.4 Healthcare
4.1.5 IT & Telecommunication
4.1.6 Aerospace and Defense
4.1.7 Others
4.2 Global 2.5D IC Flip Chip Product Market Size by Application
4.2.1 Global 2.5D IC Flip Chip Product Market Size Overview by Application (2018-2029)
4.2.2 Global 2.5D IC Flip Chip Product Historic Market Size Review by Application (2018-2023)
4.2.3 Global 2.5D IC Flip Chip Product Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America 2.5D IC Flip Chip Product Sales Breakdown by Application (2018-2023)
4.3.2 Europe 2.5D IC Flip Chip Product Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific 2.5D IC Flip Chip Product Sales Breakdown by Application (2018-2023)
4.3.4 Latin America 2.5D IC Flip Chip Product Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa 2.5D IC Flip Chip Product Sales Breakdown by Application (2018-2023)
5 North America 2.5D IC Flip Chip Product by Country
5.1 North America 2.5D IC Flip Chip Product Historic Market Size by Country
5.1.1 North America 2.5D IC Flip Chip Product Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America 2.5D IC Flip Chip Product Sales in Volume by Country (2018-2023)
5.1.3 North America 2.5D IC Flip Chip Product Sales in Value by Country (2018-2023)
5.2 North America 2.5D IC Flip Chip Product Forecasted Market Size by Country
5.2.1 North America 2.5D IC Flip Chip Product Sales in Volume by Country (2024-2029)
5.2.2 North America 2.5D IC Flip Chip Product Sales in Value by Country (2024-2029)
6 Europe 2.5D IC Flip Chip Product by Country
6.1 Europe 2.5D IC Flip Chip Product Historic Market Size by Country
6.1.1 Europe 2.5D IC Flip Chip Product Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe 2.5D IC Flip Chip Product Sales in Volume by Country (2018-2023)
6.1.3 Europe 2.5D IC Flip Chip Product Sales in Value by Country (2018-2023)
6.2 Europe 2.5D IC Flip Chip Product Forecasted Market Size by Country
6.2.1 Europe 2.5D IC Flip Chip Product Sales in Volume by Country (2024-2029)
6.2.2 Europe 2.5D IC Flip Chip Product Sales in Value by Country (2024-2029)
7 Asia-Pacific 2.5D IC Flip Chip Product by Region
7.1 Asia-Pacific 2.5D IC Flip Chip Product Historic Market Size by Region
7.1.1 Asia-Pacific 2.5D IC Flip Chip Product Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific 2.5D IC Flip Chip Product Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific 2.5D IC Flip Chip Product Sales in Value by Region (2018-2023)
7.2 Asia-Pacific 2.5D IC Flip Chip Product Forecasted Market Size by Region
7.2.1 Asia-Pacific 2.5D IC Flip Chip Product Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific 2.5D IC Flip Chip Product Sales in Value by Region (2024-2029)
8 Latin America 2.5D IC Flip Chip Product by Country
8.1 Latin America 2.5D IC Flip Chip Product Historic Market Size by Country
8.1.1 Latin America 2.5D IC Flip Chip Product Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America 2.5D IC Flip Chip Product Sales in Volume by Country (2018-2023)
8.1.3 Latin America 2.5D IC Flip Chip Product Sales in Value by Country (2018-2023)
8.2 Latin America 2.5D IC Flip Chip Product Forecasted Market Size by Country
8.2.1 Latin America 2.5D IC Flip Chip Product Sales in Volume by Country (2024-2029)
8.2.2 Latin America 2.5D IC Flip Chip Product Sales in Value by Country (2024-2029)
9 Middle East and Africa 2.5D IC Flip Chip Product by Country
9.1 Middle East and Africa 2.5D IC Flip Chip Product Historic Market Size by Country
9.1.1 Middle East and Africa 2.5D IC Flip Chip Product Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa 2.5D IC Flip Chip Product Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa 2.5D IC Flip Chip Product Sales in Value by Country (2018-2023)
9.2 Middle East and Africa 2.5D IC Flip Chip Product Forecasted Market Size by Country
9.2.1 Middle East and Africa 2.5D IC Flip Chip Product Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa 2.5D IC Flip Chip Product Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 TSMC (Taiwan)
10.1.1 TSMC (Taiwan) Company Information
10.1.2 TSMC (Taiwan) Introduction and Business Overview
10.1.3 TSMC (Taiwan) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.1.4 TSMC (Taiwan) 2.5D IC Flip Chip Product Products Offered
10.1.5 TSMC (Taiwan) Recent Development
10.2 Samsung (South Korea)
10.2.1 Samsung (South Korea) Company Information
10.2.2 Samsung (South Korea) Introduction and Business Overview
10.2.3 Samsung (South Korea) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Samsung (South Korea) 2.5D IC Flip Chip Product Products Offered
10.2.5 Samsung (South Korea) Recent Development
10.3 ASE Group (Taiwan)
10.3.1 ASE Group (Taiwan) Company Information
10.3.2 ASE Group (Taiwan) Introduction and Business Overview
10.3.3 ASE Group (Taiwan) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.3.4 ASE Group (Taiwan) 2.5D IC Flip Chip Product Products Offered
10.3.5 ASE Group (Taiwan) Recent Development
10.4 Amkor Technology (US)
10.4.1 Amkor Technology (US) Company Information
10.4.2 Amkor Technology (US) Introduction and Business Overview
10.4.3 Amkor Technology (US) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Amkor Technology (US) 2.5D IC Flip Chip Product Products Offered
10.4.5 Amkor Technology (US) Recent Development
10.5 UMC (Taiwan)
10.5.1 UMC (Taiwan) Company Information
10.5.2 UMC (Taiwan) Introduction and Business Overview
10.5.3 UMC (Taiwan) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.5.4 UMC (Taiwan) 2.5D IC Flip Chip Product Products Offered
10.5.5 UMC (Taiwan) Recent Development
10.6 STATS ChipPAC (Singapore)
10.6.1 STATS ChipPAC (Singapore) Company Information
10.6.2 STATS ChipPAC (Singapore) Introduction and Business Overview
10.6.3 STATS ChipPAC (Singapore) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.6.4 STATS ChipPAC (Singapore) 2.5D IC Flip Chip Product Products Offered
10.6.5 STATS ChipPAC (Singapore) Recent Development
10.7 Powertech Technology (Taiwan)
10.7.1 Powertech Technology (Taiwan) Company Information
10.7.2 Powertech Technology (Taiwan) Introduction and Business Overview
10.7.3 Powertech Technology (Taiwan) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Powertech Technology (Taiwan) 2.5D IC Flip Chip Product Products Offered
10.7.5 Powertech Technology (Taiwan) Recent Development
10.8 STMicroelectronics (Switzerland)
10.8.1 STMicroelectronics (Switzerland) Company Information
10.8.2 STMicroelectronics (Switzerland) Introduction and Business Overview
10.8.3 STMicroelectronics (Switzerland) 2.5D IC Flip Chip Product Sales, Revenue and Gross Margin (2018-2023)
10.8.4 STMicroelectronics (Switzerland) 2.5D IC Flip Chip Product Products Offered
10.8.5 STMicroelectronics (Switzerland) Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 2.5D IC Flip Chip Product Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 2.5D IC Flip Chip Product Industrial Chain Analysis
11.4 2.5D IC Flip Chip Product Market Dynamics
11.4.1 2.5D IC Flip Chip Product Industry Trends
11.4.2 2.5D IC Flip Chip Product Market Drivers
11.4.3 2.5D IC Flip Chip Product Market Challenges
11.4.4 2.5D IC Flip Chip Product Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 2.5D IC Flip Chip Product Distributors
12.3 2.5D IC Flip Chip Product Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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