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3D IC and 2.5D IC-Global Market Insights and Sales Trends 2025
Synopsis
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The global 3D IC and 2.5D IC market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 3D IC and 2.5D IC in various end use industries. The expanding demands from the Consumer Electronics, Telecommunication, Industry Sector and Automotive, are propelling 3D IC and 2.5D IC market. 3D Wafer-level Chip-scale Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 3D TSV segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 3D IC and 2.5D IC, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 3D IC and 2.5D IC market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 3D IC and 2.5D IC market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 3D IC and 2.5D IC sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 3D IC and 2.5D IC covered in this report include TSMC(Taiwan), Samsung(South Korea), Toshiba(Japan), ASE Group(Taiwan), Amkor(U.S.), UMC(Taiwan), Stmicroelectronics(Switzerland), Broadcom(U.S.) and Intel(U.S.), etc.
The global 3D IC and 2.5D IC market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
TSMC(Taiwan)
Samsung(South Korea)
Toshiba(Japan)
ASE Group(Taiwan)
Amkor(U.S.)
UMC(Taiwan)
Stmicroelectronics(Switzerland)
Broadcom(U.S.)
Intel(U.S.)
Jiangsu Changjiang Electronics(China)
Global 3D IC and 2.5D IC market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 3D IC and 2.5D IC market, Segment by Type:
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Global 3D IC and 2.5D IC market, by Application
Consumer Electronics
Telecommunication
Industry Sector
Automotive
Military and Aerospace
Smart Technologies
Medical Devices
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of 3D IC and 2.5D IC companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The global 3D IC and 2.5D IC market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 3D IC and 2.5D IC in various end use industries. The expanding demands from the Consumer Electronics, Telecommunication, Industry Sector and Automotive, are propelling 3D IC and 2.5D IC market. 3D Wafer-level Chip-scale Packaging, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 3D TSV segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 3D IC and 2.5D IC, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 3D IC and 2.5D IC market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 3D IC and 2.5D IC market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 3D IC and 2.5D IC sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 3D IC and 2.5D IC covered in this report include TSMC(Taiwan), Samsung(South Korea), Toshiba(Japan), ASE Group(Taiwan), Amkor(U.S.), UMC(Taiwan), Stmicroelectronics(Switzerland), Broadcom(U.S.) and Intel(U.S.), etc.
The global 3D IC and 2.5D IC market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
TSMC(Taiwan)
Samsung(South Korea)
Toshiba(Japan)
ASE Group(Taiwan)
Amkor(U.S.)
UMC(Taiwan)
Stmicroelectronics(Switzerland)
Broadcom(U.S.)
Intel(U.S.)
Jiangsu Changjiang Electronics(China)
Global 3D IC and 2.5D IC market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 3D IC and 2.5D IC market, Segment by Type:
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Global 3D IC and 2.5D IC market, by Application
Consumer Electronics
Telecommunication
Industry Sector
Automotive
Military and Aerospace
Smart Technologies
Medical Devices
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of 3D IC and 2.5D IC companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of 3D IC and 2.5D IC
1.1 3D IC and 2.5D IC Market Overview
1.1.1 3D IC and 2.5D IC Product Scope
1.1.2 3D IC and 2.5D IC Market Status and Outlook
1.2 Global 3D IC and 2.5D IC Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global 3D IC and 2.5D IC Market Size by Region (2018-2029)
1.4 Global 3D IC and 2.5D IC Historic Market Size by Region (2018-2023)
1.5 Global 3D IC and 2.5D IC Market Size Forecast by Region (2024-2029)
1.6 Key Regions, 3D IC and 2.5D IC Market Size (2018-2029)
1.6.1 North America 3D IC and 2.5D IC Market Size (2018-2029)
1.6.2 Europe 3D IC and 2.5D IC Market Size (2018-2029)
1.6.3 Asia-Pacific 3D IC and 2.5D IC Market Size (2018-2029)
1.6.4 Latin America 3D IC and 2.5D IC Market Size (2018-2029)
1.6.5 Middle East & Africa 3D IC and 2.5D IC Market Size (2018-2029)
2 3D IC and 2.5D IC Market by Type
2.1 Introduction
2.1.1 3D Wafer-level Chip-scale Packaging
2.1.2 3D TSV
2.1.3 2.5D
2.2 Global 3D IC and 2.5D IC Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global 3D IC and 2.5D IC Historic Market Size by Type (2018-2023)
2.2.2 Global 3D IC and 2.5D IC Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America 3D IC and 2.5D IC Revenue Breakdown by Type (2018-2029)
2.3.2 Europe 3D IC and 2.5D IC Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific 3D IC and 2.5D IC Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America 3D IC and 2.5D IC Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa 3D IC and 2.5D IC Revenue Breakdown by Type (2018-2029)
3 3D IC and 2.5D IC Market Overview by Application
3.1 Introduction
3.1.1 Consumer Electronics
3.1.2 Telecommunication
3.1.3 Industry Sector
3.1.4 Automotive
3.1.5 Military and Aerospace
3.1.6 Smart Technologies
3.1.7 Medical Devices
3.2 Global 3D IC and 2.5D IC Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global 3D IC and 2.5D IC Historic Market Size by Application (2018-2023)
3.2.2 Global 3D IC and 2.5D IC Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America 3D IC and 2.5D IC Revenue Breakdown by Application (2018-2029)
3.3.2 Europe 3D IC and 2.5D IC Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific 3D IC and 2.5D IC Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America 3D IC and 2.5D IC Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa 3D IC and 2.5D IC Revenue Breakdown by Application (2018-2029)
4 3D IC and 2.5D IC Competition Analysis by Players
4.1 Global 3D IC and 2.5D IC Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in 3D IC and 2.5D IC as of 2022)
4.3 Date of Key Players Enter into 3D IC and 2.5D IC Market
4.4 Global Top Players 3D IC and 2.5D IC Headquarters and Area Served
4.5 Key Players 3D IC and 2.5D IC Product Solution and Service
4.6 Competitive Status
4.6.1 3D IC and 2.5D IC Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 TSMC(Taiwan)
5.1.1 TSMC(Taiwan) Profile
5.1.2 TSMC(Taiwan) Main Business
5.1.3 TSMC(Taiwan) 3D IC and 2.5D IC Products, Services and Solutions
5.1.4 TSMC(Taiwan) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.1.5 TSMC(Taiwan) Recent Developments
5.2 Samsung(South Korea)
5.2.1 Samsung(South Korea) Profile
5.2.2 Samsung(South Korea) Main Business
5.2.3 Samsung(South Korea) 3D IC and 2.5D IC Products, Services and Solutions
5.2.4 Samsung(South Korea) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.2.5 Samsung(South Korea) Recent Developments
5.3 Toshiba(Japan)
5.3.1 Toshiba(Japan) Profile
5.3.2 Toshiba(Japan) Main Business
5.3.3 Toshiba(Japan) 3D IC and 2.5D IC Products, Services and Solutions
5.3.4 Toshiba(Japan) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.3.5 ASE Group(Taiwan) Recent Developments
5.4 ASE Group(Taiwan)
5.4.1 ASE Group(Taiwan) Profile
5.4.2 ASE Group(Taiwan) Main Business
5.4.3 ASE Group(Taiwan) 3D IC and 2.5D IC Products, Services and Solutions
5.4.4 ASE Group(Taiwan) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.4.5 ASE Group(Taiwan) Recent Developments
5.5 Amkor(U.S.)
5.5.1 Amkor(U.S.) Profile
5.5.2 Amkor(U.S.) Main Business
5.5.3 Amkor(U.S.) 3D IC and 2.5D IC Products, Services and Solutions
5.5.4 Amkor(U.S.) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.5.5 Amkor(U.S.) Recent Developments
5.6 UMC(Taiwan)
5.6.1 UMC(Taiwan) Profile
5.6.2 UMC(Taiwan) Main Business
5.6.3 UMC(Taiwan) 3D IC and 2.5D IC Products, Services and Solutions
5.6.4 UMC(Taiwan) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.6.5 UMC(Taiwan) Recent Developments
5.7 Stmicroelectronics(Switzerland)
5.7.1 Stmicroelectronics(Switzerland) Profile
5.7.2 Stmicroelectronics(Switzerland) Main Business
5.7.3 Stmicroelectronics(Switzerland) 3D IC and 2.5D IC Products, Services and Solutions
5.7.4 Stmicroelectronics(Switzerland) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.7.5 Stmicroelectronics(Switzerland) Recent Developments
5.8 Broadcom(U.S.)
5.8.1 Broadcom(U.S.) Profile
5.8.2 Broadcom(U.S.) Main Business
5.8.3 Broadcom(U.S.) 3D IC and 2.5D IC Products, Services and Solutions
5.8.4 Broadcom(U.S.) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.8.5 Broadcom(U.S.) Recent Developments
5.9 Intel(U.S.)
5.9.1 Intel(U.S.) Profile
5.9.2 Intel(U.S.) Main Business
5.9.3 Intel(U.S.) 3D IC and 2.5D IC Products, Services and Solutions
5.9.4 Intel(U.S.) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.9.5 Intel(U.S.) Recent Developments
5.10 Jiangsu Changjiang Electronics(China)
5.10.1 Jiangsu Changjiang Electronics(China) Profile
5.10.2 Jiangsu Changjiang Electronics(China) Main Business
5.10.3 Jiangsu Changjiang Electronics(China) 3D IC and 2.5D IC Products, Services and Solutions
5.10.4 Jiangsu Changjiang Electronics(China) 3D IC and 2.5D IC Revenue (US$ Million) & (2018-2023)
5.10.5 Jiangsu Changjiang Electronics(China) Recent Developments
6 North America
6.1 North America 3D IC and 2.5D IC Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe 3D IC and 2.5D IC Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific 3D IC and 2.5D IC Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America 3D IC and 2.5D IC Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa 3D IC and 2.5D IC Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 3D IC and 2.5D IC Market Dynamics
11.1 3D IC and 2.5D IC Industry Trends
11.2 3D IC and 2.5D IC Market Drivers
11.3 3D IC and 2.5D IC Market Challenges
11.4 3D IC and 2.5D IC Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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