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3D ICs-Global Market Insights and Sales Trends 2025
Synopsis
3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
The global 3D ICs market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 3D ICs in various end use industries. The expanding demands from the Automotive, Smart Technologies, Robotics and Electronics, are propelling 3D ICs market. 3D SiCs, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Monolithic 3D ICs segment is estimated at % CAGR for the next seven-year period.
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 3D ICs, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 3D ICs market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 3D ICs market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 3D ICs sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 3D ICs covered in this report include Xilinx, Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC), Toshiba, EV Group and Tessera, etc.
The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Xilinx
Advanced Semiconductor Engineering (ASE)
Samsung
STMicroelectronics
Taiwan Semiconductors Manufacturing (TSMC)
Toshiba
EV Group
Tessera
Global 3D ICs market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 3D ICs market, Segment by Type:
3D SiCs
Monolithic 3D ICs
Global 3D ICs market, by Application
Automotive
Smart Technologies
Robotics
Electronics
Medical
Industrial
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of 3D ICs companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
3D IC is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
The global 3D ICs market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of 3D ICs in various end use industries. The expanding demands from the Automotive, Smart Technologies, Robotics and Electronics, are propelling 3D ICs market. 3D SiCs, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Monolithic 3D ICs segment is estimated at % CAGR for the next seven-year period.
3D IC technology finds its applications in various end-use sectors such as consumer electronics, military, information and communication technology, automotive and aerospace among others. IC manufacturers use different fabrication process for 3D ICs, depending upon requirements of the circuit system such as beam re-crystallization, wafer bonding, silicon epitaxial growth and solid phase crystallization.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for 3D ICs, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global 3D ICs market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global 3D ICs market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, 3D ICs sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of 3D ICs covered in this report include Xilinx, Advanced Semiconductor Engineering (ASE), Samsung, STMicroelectronics, Taiwan Semiconductors Manufacturing (TSMC), Toshiba, EV Group and Tessera, etc.
The global 3D ICs market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Xilinx
Advanced Semiconductor Engineering (ASE)
Samsung
STMicroelectronics
Taiwan Semiconductors Manufacturing (TSMC)
Toshiba
EV Group
Tessera
Global 3D ICs market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global 3D ICs market, Segment by Type:
3D SiCs
Monolithic 3D ICs
Global 3D ICs market, by Application
Automotive
Smart Technologies
Robotics
Electronics
Medical
Industrial
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of 3D ICs companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of 3D ICs
1.1 3D ICs Market Overview
1.1.1 3D ICs Product Scope
1.1.2 3D ICs Market Status and Outlook
1.2 Global 3D ICs Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global 3D ICs Market Size by Region (2018-2029)
1.4 Global 3D ICs Historic Market Size by Region (2018-2023)
1.5 Global 3D ICs Market Size Forecast by Region (2024-2029)
1.6 Key Regions, 3D ICs Market Size (2018-2029)
1.6.1 North America 3D ICs Market Size (2018-2029)
1.6.2 Europe 3D ICs Market Size (2018-2029)
1.6.3 Asia-Pacific 3D ICs Market Size (2018-2029)
1.6.4 Latin America 3D ICs Market Size (2018-2029)
1.6.5 Middle East & Africa 3D ICs Market Size (2018-2029)
2 3D ICs Market by Type
2.1 Introduction
2.1.1 3D SiCs
2.1.2 Monolithic 3D ICs
2.2 Global 3D ICs Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global 3D ICs Historic Market Size by Type (2018-2023)
2.2.2 Global 3D ICs Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America 3D ICs Revenue Breakdown by Type (2018-2029)
2.3.2 Europe 3D ICs Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific 3D ICs Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America 3D ICs Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa 3D ICs Revenue Breakdown by Type (2018-2029)
3 3D ICs Market Overview by Application
3.1 Introduction
3.1.1 Automotive
3.1.2 Smart Technologies
3.1.3 Robotics
3.1.4 Electronics
3.1.5 Medical
3.1.6 Industrial
3.2 Global 3D ICs Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global 3D ICs Historic Market Size by Application (2018-2023)
3.2.2 Global 3D ICs Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America 3D ICs Revenue Breakdown by Application (2018-2029)
3.3.2 Europe 3D ICs Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific 3D ICs Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America 3D ICs Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa 3D ICs Revenue Breakdown by Application (2018-2029)
4 3D ICs Competition Analysis by Players
4.1 Global 3D ICs Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in 3D ICs as of 2022)
4.3 Date of Key Players Enter into 3D ICs Market
4.4 Global Top Players 3D ICs Headquarters and Area Served
4.5 Key Players 3D ICs Product Solution and Service
4.6 Competitive Status
4.6.1 3D ICs Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Xilinx
5.1.1 Xilinx Profile
5.1.2 Xilinx Main Business
5.1.3 Xilinx 3D ICs Products, Services and Solutions
5.1.4 Xilinx 3D ICs Revenue (US$ Million) & (2018-2023)
5.1.5 Xilinx Recent Developments
5.2 Advanced Semiconductor Engineering (ASE)
5.2.1 Advanced Semiconductor Engineering (ASE) Profile
5.2.2 Advanced Semiconductor Engineering (ASE) Main Business
5.2.3 Advanced Semiconductor Engineering (ASE) 3D ICs Products, Services and Solutions
5.2.4 Advanced Semiconductor Engineering (ASE) 3D ICs Revenue (US$ Million) & (2018-2023)
5.2.5 Advanced Semiconductor Engineering (ASE) Recent Developments
5.3 Samsung
5.3.1 Samsung Profile
5.3.2 Samsung Main Business
5.3.3 Samsung 3D ICs Products, Services and Solutions
5.3.4 Samsung 3D ICs Revenue (US$ Million) & (2018-2023)
5.3.5 STMicroelectronics Recent Developments
5.4 STMicroelectronics
5.4.1 STMicroelectronics Profile
5.4.2 STMicroelectronics Main Business
5.4.3 STMicroelectronics 3D ICs Products, Services and Solutions
5.4.4 STMicroelectronics 3D ICs Revenue (US$ Million) & (2018-2023)
5.4.5 STMicroelectronics Recent Developments
5.5 Taiwan Semiconductors Manufacturing (TSMC)
5.5.1 Taiwan Semiconductors Manufacturing (TSMC) Profile
5.5.2 Taiwan Semiconductors Manufacturing (TSMC) Main Business
5.5.3 Taiwan Semiconductors Manufacturing (TSMC) 3D ICs Products, Services and Solutions
5.5.4 Taiwan Semiconductors Manufacturing (TSMC) 3D ICs Revenue (US$ Million) & (2018-2023)
5.5.5 Taiwan Semiconductors Manufacturing (TSMC) Recent Developments
5.6 Toshiba
5.6.1 Toshiba Profile
5.6.2 Toshiba Main Business
5.6.3 Toshiba 3D ICs Products, Services and Solutions
5.6.4 Toshiba 3D ICs Revenue (US$ Million) & (2018-2023)
5.6.5 Toshiba Recent Developments
5.7 EV Group
5.7.1 EV Group Profile
5.7.2 EV Group Main Business
5.7.3 EV Group 3D ICs Products, Services and Solutions
5.7.4 EV Group 3D ICs Revenue (US$ Million) & (2018-2023)
5.7.5 EV Group Recent Developments
5.8 Tessera
5.8.1 Tessera Profile
5.8.2 Tessera Main Business
5.8.3 Tessera 3D ICs Products, Services and Solutions
5.8.4 Tessera 3D ICs Revenue (US$ Million) & (2018-2023)
5.8.5 Tessera Recent Developments
6 North America
6.1 North America 3D ICs Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe 3D ICs Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific 3D ICs Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America 3D ICs Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa 3D ICs Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 3D ICs Market Dynamics
11.1 3D ICs Industry Trends
11.2 3D ICs Market Drivers
11.3 3D ICs Market Challenges
11.4 3D ICs Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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