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AiP (Antenna in Package) Module-Global Market Insights and Sales Trends 2025
Synopsis
AiP is a technology that integrates an antenna and a chip into a package to achieve system-level wireless functions. The dielectric materials of the package antenna are mainly ceramic, organic, and molding compounds, and the conductor materials are gold, silver, and copper. It implements one or more antennas in the IC package and can carry bare radio frequency chips (transceivers). AiP can be further integrated with front-end components (for example, power amplifier (PA) or low noise amplifier (LNA)), switches, filters, and even power management integrated circuits (PMIC) to form an antenna module-package (SiP) using System-in technology.
The global AiP (Antenna in Package) Module market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of AiP (Antenna in Package) Module in various end use industries. The expanding demands from the Consumer Electronics, Vehicle Electronics, Industrial Internet of Things and Communication Base Station, are propelling AiP (Antenna in Package) Module market. LTCC, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the HDI segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for AiP (Antenna in Package) Module, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global AiP (Antenna in Package) Module market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global AiP (Antenna in Package) Module market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, AiP (Antenna in Package) Module sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of AiP (Antenna in Package) Module covered in this report include Qualcomm, Intel, Murata, Skyworks, Qorvo, Samsung, Broadcom and Huizhou Speed Wireless Technology, etc.
The global AiP (Antenna in Package) Module market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Qualcomm
Intel
Murata
Skyworks
Qorvo
Samsung
Broadcom
Huizhou Speed Wireless Technology
Global AiP (Antenna in Package) Module market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global AiP (Antenna in Package) Module market, Segment by Type:
LTCC
HDI
FOWLP
Global AiP (Antenna in Package) Module market, by Application
Consumer Electronics
Vehicle Electronics
Industrial Internet of Things
Communication Base Station
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of AiP (Antenna in Package) Module manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of AiP (Antenna in Package) Module in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
AiP is a technology that integrates an antenna and a chip into a package to achieve system-level wireless functions. The dielectric materials of the package antenna are mainly ceramic, organic, and molding compounds, and the conductor materials are gold, silver, and copper. It implements one or more antennas in the IC package and can carry bare radio frequency chips (transceivers). AiP can be further integrated with front-end components (for example, power amplifier (PA) or low noise amplifier (LNA)), switches, filters, and even power management integrated circuits (PMIC) to form an antenna module-package (SiP) using System-in technology.
The global AiP (Antenna in Package) Module market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of AiP (Antenna in Package) Module in various end use industries. The expanding demands from the Consumer Electronics, Vehicle Electronics, Industrial Internet of Things and Communication Base Station, are propelling AiP (Antenna in Package) Module market. LTCC, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the HDI segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for AiP (Antenna in Package) Module, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global AiP (Antenna in Package) Module market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global AiP (Antenna in Package) Module market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, AiP (Antenna in Package) Module sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of AiP (Antenna in Package) Module covered in this report include Qualcomm, Intel, Murata, Skyworks, Qorvo, Samsung, Broadcom and Huizhou Speed Wireless Technology, etc.
The global AiP (Antenna in Package) Module market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Qualcomm
Intel
Murata
Skyworks
Qorvo
Samsung
Broadcom
Huizhou Speed Wireless Technology
Global AiP (Antenna in Package) Module market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global AiP (Antenna in Package) Module market, Segment by Type:
LTCC
HDI
FOWLP
Global AiP (Antenna in Package) Module market, by Application
Consumer Electronics
Vehicle Electronics
Industrial Internet of Things
Communication Base Station
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of AiP (Antenna in Package) Module manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of AiP (Antenna in Package) Module in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 AiP (Antenna in Package) Module Market Overview
1.1 AiP (Antenna in Package) Module Product Overview
1.2 AiP (Antenna in Package) Module Market Segment by Type
1.2.1 LTCC
1.2.2 HDI
1.2.3 FOWLP
1.3 Global AiP (Antenna in Package) Module Market Size by Type
1.3.1 Global AiP (Antenna in Package) Module Market Size Overview by Type (2018-2029)
1.3.2 Global AiP (Antenna in Package) Module Historic Market Size Review by Type (2018-2023)
1.3.3 Global AiP (Antenna in Package) Module Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America AiP (Antenna in Package) Module Sales Breakdown by Type (2018-2023)
1.4.2 Europe AiP (Antenna in Package) Module Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific AiP (Antenna in Package) Module Sales Breakdown by Type (2018-2023)
1.4.4 Latin America AiP (Antenna in Package) Module Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa AiP (Antenna in Package) Module Sales Breakdown by Type (2018-2023)
2 Global AiP (Antenna in Package) Module Market Competition by Company
2.1 Global Top Players by AiP (Antenna in Package) Module Sales (2018-2023)
2.2 Global Top Players by AiP (Antenna in Package) Module Revenue (2018-2023)
2.3 Global Top Players by AiP (Antenna in Package) Module Price (2018-2023)
2.4 Global Top Manufacturers AiP (Antenna in Package) Module Manufacturing Base Distribution, Sales Area, Product Type
2.5 AiP (Antenna in Package) Module Market Competitive Situation and Trends
2.5.1 AiP (Antenna in Package) Module Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by AiP (Antenna in Package) Module Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in AiP (Antenna in Package) Module as of 2022)
2.7 Date of Key Manufacturers Enter into AiP (Antenna in Package) Module Market
2.8 Key Manufacturers AiP (Antenna in Package) Module Product Offered
2.9 Mergers & Acquisitions, Expansion
3 AiP (Antenna in Package) Module Status and Outlook by Region
3.1 Global AiP (Antenna in Package) Module Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global AiP (Antenna in Package) Module Historic Market Size by Region
3.2.1 Global AiP (Antenna in Package) Module Sales in Volume by Region (2018-2023)
3.2.2 Global AiP (Antenna in Package) Module Sales in Value by Region (2018-2023)
3.2.3 Global AiP (Antenna in Package) Module Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global AiP (Antenna in Package) Module Forecasted Market Size by Region
3.3.1 Global AiP (Antenna in Package) Module Sales in Volume by Region (2024-2029)
3.3.2 Global AiP (Antenna in Package) Module Sales in Value by Region (2024-2029)
3.3.3 Global AiP (Antenna in Package) Module Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global AiP (Antenna in Package) Module by Application
4.1 AiP (Antenna in Package) Module Market Segment by Application
4.1.1 Consumer Electronics
4.1.2 Vehicle Electronics
4.1.3 Industrial Internet of Things
4.1.4 Communication Base Station
4.1.5 Others
4.2 Global AiP (Antenna in Package) Module Market Size by Application
4.2.1 Global AiP (Antenna in Package) Module Market Size Overview by Application (2018-2029)
4.2.2 Global AiP (Antenna in Package) Module Historic Market Size Review by Application (2018-2023)
4.2.3 Global AiP (Antenna in Package) Module Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America AiP (Antenna in Package) Module Sales Breakdown by Application (2018-2023)
4.3.2 Europe AiP (Antenna in Package) Module Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific AiP (Antenna in Package) Module Sales Breakdown by Application (2018-2023)
4.3.4 Latin America AiP (Antenna in Package) Module Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa AiP (Antenna in Package) Module Sales Breakdown by Application (2018-2023)
5 North America AiP (Antenna in Package) Module by Country
5.1 North America AiP (Antenna in Package) Module Historic Market Size by Country
5.1.1 North America AiP (Antenna in Package) Module Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America AiP (Antenna in Package) Module Sales in Volume by Country (2018-2023)
5.1.3 North America AiP (Antenna in Package) Module Sales in Value by Country (2018-2023)
5.2 North America AiP (Antenna in Package) Module Forecasted Market Size by Country
5.2.1 North America AiP (Antenna in Package) Module Sales in Volume by Country (2024-2029)
5.2.2 North America AiP (Antenna in Package) Module Sales in Value by Country (2024-2029)
6 Europe AiP (Antenna in Package) Module by Country
6.1 Europe AiP (Antenna in Package) Module Historic Market Size by Country
6.1.1 Europe AiP (Antenna in Package) Module Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe AiP (Antenna in Package) Module Sales in Volume by Country (2018-2023)
6.1.3 Europe AiP (Antenna in Package) Module Sales in Value by Country (2018-2023)
6.2 Europe AiP (Antenna in Package) Module Forecasted Market Size by Country
6.2.1 Europe AiP (Antenna in Package) Module Sales in Volume by Country (2024-2029)
6.2.2 Europe AiP (Antenna in Package) Module Sales in Value by Country (2024-2029)
7 Asia-Pacific AiP (Antenna in Package) Module by Region
7.1 Asia-Pacific AiP (Antenna in Package) Module Historic Market Size by Region
7.1.1 Asia-Pacific AiP (Antenna in Package) Module Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific AiP (Antenna in Package) Module Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific AiP (Antenna in Package) Module Sales in Value by Region (2018-2023)
7.2 Asia-Pacific AiP (Antenna in Package) Module Forecasted Market Size by Region
7.2.1 Asia-Pacific AiP (Antenna in Package) Module Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific AiP (Antenna in Package) Module Sales in Value by Region (2024-2029)
8 Latin America AiP (Antenna in Package) Module by Country
8.1 Latin America AiP (Antenna in Package) Module Historic Market Size by Country
8.1.1 Latin America AiP (Antenna in Package) Module Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America AiP (Antenna in Package) Module Sales in Volume by Country (2018-2023)
8.1.3 Latin America AiP (Antenna in Package) Module Sales in Value by Country (2018-2023)
8.2 Latin America AiP (Antenna in Package) Module Forecasted Market Size by Country
8.2.1 Latin America AiP (Antenna in Package) Module Sales in Volume by Country (2024-2029)
8.2.2 Latin America AiP (Antenna in Package) Module Sales in Value by Country (2024-2029)
9 Middle East and Africa AiP (Antenna in Package) Module by Country
9.1 Middle East and Africa AiP (Antenna in Package) Module Historic Market Size by Country
9.1.1 Middle East and Africa AiP (Antenna in Package) Module Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa AiP (Antenna in Package) Module Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa AiP (Antenna in Package) Module Sales in Value by Country (2018-2023)
9.2 Middle East and Africa AiP (Antenna in Package) Module Forecasted Market Size by Country
9.2.1 Middle East and Africa AiP (Antenna in Package) Module Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa AiP (Antenna in Package) Module Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Qualcomm
10.1.1 Qualcomm Company Information
10.1.2 Qualcomm Introduction and Business Overview
10.1.3 Qualcomm AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Qualcomm AiP (Antenna in Package) Module Products Offered
10.1.5 Qualcomm Recent Development
10.2 Intel
10.2.1 Intel Company Information
10.2.2 Intel Introduction and Business Overview
10.2.3 Intel AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Intel AiP (Antenna in Package) Module Products Offered
10.2.5 Intel Recent Development
10.3 Murata
10.3.1 Murata Company Information
10.3.2 Murata Introduction and Business Overview
10.3.3 Murata AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Murata AiP (Antenna in Package) Module Products Offered
10.3.5 Murata Recent Development
10.4 Skyworks
10.4.1 Skyworks Company Information
10.4.2 Skyworks Introduction and Business Overview
10.4.3 Skyworks AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Skyworks AiP (Antenna in Package) Module Products Offered
10.4.5 Skyworks Recent Development
10.5 Qorvo
10.5.1 Qorvo Company Information
10.5.2 Qorvo Introduction and Business Overview
10.5.3 Qorvo AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Qorvo AiP (Antenna in Package) Module Products Offered
10.5.5 Qorvo Recent Development
10.6 Samsung
10.6.1 Samsung Company Information
10.6.2 Samsung Introduction and Business Overview
10.6.3 Samsung AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Samsung AiP (Antenna in Package) Module Products Offered
10.6.5 Samsung Recent Development
10.7 Broadcom
10.7.1 Broadcom Company Information
10.7.2 Broadcom Introduction and Business Overview
10.7.3 Broadcom AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Broadcom AiP (Antenna in Package) Module Products Offered
10.7.5 Broadcom Recent Development
10.8 Huizhou Speed Wireless Technology
10.8.1 Huizhou Speed Wireless Technology Company Information
10.8.2 Huizhou Speed Wireless Technology Introduction and Business Overview
10.8.3 Huizhou Speed Wireless Technology AiP (Antenna in Package) Module Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Huizhou Speed Wireless Technology AiP (Antenna in Package) Module Products Offered
10.8.5 Huizhou Speed Wireless Technology Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 AiP (Antenna in Package) Module Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 AiP (Antenna in Package) Module Industrial Chain Analysis
11.4 AiP (Antenna in Package) Module Market Dynamics
11.4.1 AiP (Antenna in Package) Module Industry Trends
11.4.2 AiP (Antenna in Package) Module Market Drivers
11.4.3 AiP (Antenna in Package) Module Market Challenges
11.4.4 AiP (Antenna in Package) Module Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 AiP (Antenna in Package) Module Distributors
12.3 AiP (Antenna in Package) Module Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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