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Back Grinding Tapes for Semiconductor-Global Market Insights and Sales Trends 2024
Synopsis
The global Back Grinding Tapes for Semiconductor market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Back Grinding Tapes for Semiconductor in various end use industries. The expanding demands from the Wet Etching, Metalizing Process, Grinding and Cleaning Process and Other Semiconductor Processes, are propelling Back Grinding Tapes for Semiconductor market. UV Type, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Non-UV Type segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Back Grinding Tapes for Semiconductor, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Back Grinding Tapes for Semiconductor market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Back Grinding Tapes for Semiconductor market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Back Grinding Tapes for Semiconductor sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Back Grinding Tapes for Semiconductor covered in this report include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology and KGK Chemical, etc.
The global Back Grinding Tapes for Semiconductor market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
KGK Chemical
Global Back Grinding Tapes for Semiconductor market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Back Grinding Tapes for Semiconductor market, Segment by Type:
UV Type
Non-UV Type
Global Back Grinding Tapes for Semiconductor market, by Application
Wet Etching
Metalizing Process
Grinding and Cleaning Process
Other Semiconductor Processes
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Back Grinding Tapes for Semiconductor manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Back Grinding Tapes for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Back Grinding Tapes for Semiconductor market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Back Grinding Tapes for Semiconductor in various end use industries. The expanding demands from the Wet Etching, Metalizing Process, Grinding and Cleaning Process and Other Semiconductor Processes, are propelling Back Grinding Tapes for Semiconductor market. UV Type, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Non-UV Type segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Back Grinding Tapes for Semiconductor, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Back Grinding Tapes for Semiconductor market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Back Grinding Tapes for Semiconductor market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Back Grinding Tapes for Semiconductor sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Back Grinding Tapes for Semiconductor covered in this report include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, D&X, AI Technology and KGK Chemical, etc.
The global Back Grinding Tapes for Semiconductor market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
D&X
AI Technology
KGK Chemical
Global Back Grinding Tapes for Semiconductor market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Back Grinding Tapes for Semiconductor market, Segment by Type:
UV Type
Non-UV Type
Global Back Grinding Tapes for Semiconductor market, by Application
Wet Etching
Metalizing Process
Grinding and Cleaning Process
Other Semiconductor Processes
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Back Grinding Tapes for Semiconductor manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Back Grinding Tapes for Semiconductor in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Back Grinding Tapes for Semiconductor Market Overview
1.1 Back Grinding Tapes for Semiconductor Product Overview
1.2 Back Grinding Tapes for Semiconductor Market Segment by Type
1.2.1 UV Type
1.2.2 Non-UV Type
1.3 Global Back Grinding Tapes for Semiconductor Market Size by Type
1.3.1 Global Back Grinding Tapes for Semiconductor Market Size Overview by Type (2018-2029)
1.3.2 Global Back Grinding Tapes for Semiconductor Historic Market Size Review by Type (2018-2023)
1.3.3 Global Back Grinding Tapes for Semiconductor Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Back Grinding Tapes for Semiconductor Sales Breakdown by Type (2018-2023)
1.4.2 Europe Back Grinding Tapes for Semiconductor Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Back Grinding Tapes for Semiconductor Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Back Grinding Tapes for Semiconductor Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Back Grinding Tapes for Semiconductor Sales Breakdown by Type (2018-2023)
2 Global Back Grinding Tapes for Semiconductor Market Competition by Company
2.1 Global Top Players by Back Grinding Tapes for Semiconductor Sales (2018-2023)
2.2 Global Top Players by Back Grinding Tapes for Semiconductor Revenue (2018-2023)
2.3 Global Top Players by Back Grinding Tapes for Semiconductor Price (2018-2023)
2.4 Global Top Manufacturers Back Grinding Tapes for Semiconductor Manufacturing Base Distribution, Sales Area, Product Type
2.5 Back Grinding Tapes for Semiconductor Market Competitive Situation and Trends
2.5.1 Back Grinding Tapes for Semiconductor Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Back Grinding Tapes for Semiconductor Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Back Grinding Tapes for Semiconductor as of 2022)
2.7 Date of Key Manufacturers Enter into Back Grinding Tapes for Semiconductor Market
2.8 Key Manufacturers Back Grinding Tapes for Semiconductor Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Back Grinding Tapes for Semiconductor Status and Outlook by Region
3.1 Global Back Grinding Tapes for Semiconductor Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Back Grinding Tapes for Semiconductor Historic Market Size by Region
3.2.1 Global Back Grinding Tapes for Semiconductor Sales in Volume by Region (2018-2023)
3.2.2 Global Back Grinding Tapes for Semiconductor Sales in Value by Region (2018-2023)
3.2.3 Global Back Grinding Tapes for Semiconductor Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Back Grinding Tapes for Semiconductor Forecasted Market Size by Region
3.3.1 Global Back Grinding Tapes for Semiconductor Sales in Volume by Region (2024-2029)
3.3.2 Global Back Grinding Tapes for Semiconductor Sales in Value by Region (2024-2029)
3.3.3 Global Back Grinding Tapes for Semiconductor Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Back Grinding Tapes for Semiconductor by Application
4.1 Back Grinding Tapes for Semiconductor Market Segment by Application
4.1.1 Wet Etching
4.1.2 Metalizing Process
4.1.3 Grinding and Cleaning Process
4.1.4 Other Semiconductor Processes
4.2 Global Back Grinding Tapes for Semiconductor Market Size by Application
4.2.1 Global Back Grinding Tapes for Semiconductor Market Size Overview by Application (2018-2029)
4.2.2 Global Back Grinding Tapes for Semiconductor Historic Market Size Review by Application (2018-2023)
4.2.3 Global Back Grinding Tapes for Semiconductor Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Back Grinding Tapes for Semiconductor Sales Breakdown by Application (2018-2023)
4.3.2 Europe Back Grinding Tapes for Semiconductor Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Back Grinding Tapes for Semiconductor Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Back Grinding Tapes for Semiconductor Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Back Grinding Tapes for Semiconductor Sales Breakdown by Application (2018-2023)
5 North America Back Grinding Tapes for Semiconductor by Country
5.1 North America Back Grinding Tapes for Semiconductor Historic Market Size by Country
5.1.1 North America Back Grinding Tapes for Semiconductor Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Back Grinding Tapes for Semiconductor Sales in Volume by Country (2018-2023)
5.1.3 North America Back Grinding Tapes for Semiconductor Sales in Value by Country (2018-2023)
5.2 North America Back Grinding Tapes for Semiconductor Forecasted Market Size by Country
5.2.1 North America Back Grinding Tapes for Semiconductor Sales in Volume by Country (2024-2029)
5.2.2 North America Back Grinding Tapes for Semiconductor Sales in Value by Country (2024-2029)
6 Europe Back Grinding Tapes for Semiconductor by Country
6.1 Europe Back Grinding Tapes for Semiconductor Historic Market Size by Country
6.1.1 Europe Back Grinding Tapes for Semiconductor Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Back Grinding Tapes for Semiconductor Sales in Volume by Country (2018-2023)
6.1.3 Europe Back Grinding Tapes for Semiconductor Sales in Value by Country (2018-2023)
6.2 Europe Back Grinding Tapes for Semiconductor Forecasted Market Size by Country
6.2.1 Europe Back Grinding Tapes for Semiconductor Sales in Volume by Country (2024-2029)
6.2.2 Europe Back Grinding Tapes for Semiconductor Sales in Value by Country (2024-2029)
7 Asia-Pacific Back Grinding Tapes for Semiconductor by Region
7.1 Asia-Pacific Back Grinding Tapes for Semiconductor Historic Market Size by Region
7.1.1 Asia-Pacific Back Grinding Tapes for Semiconductor Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Back Grinding Tapes for Semiconductor Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Back Grinding Tapes for Semiconductor Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Back Grinding Tapes for Semiconductor Forecasted Market Size by Region
7.2.1 Asia-Pacific Back Grinding Tapes for Semiconductor Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Back Grinding Tapes for Semiconductor Sales in Value by Region (2024-2029)
8 Latin America Back Grinding Tapes for Semiconductor by Country
8.1 Latin America Back Grinding Tapes for Semiconductor Historic Market Size by Country
8.1.1 Latin America Back Grinding Tapes for Semiconductor Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Back Grinding Tapes for Semiconductor Sales in Volume by Country (2018-2023)
8.1.3 Latin America Back Grinding Tapes for Semiconductor Sales in Value by Country (2018-2023)
8.2 Latin America Back Grinding Tapes for Semiconductor Forecasted Market Size by Country
8.2.1 Latin America Back Grinding Tapes for Semiconductor Sales in Volume by Country (2024-2029)
8.2.2 Latin America Back Grinding Tapes for Semiconductor Sales in Value by Country (2024-2029)
9 Middle East and Africa Back Grinding Tapes for Semiconductor by Country
9.1 Middle East and Africa Back Grinding Tapes for Semiconductor Historic Market Size by Country
9.1.1 Middle East and Africa Back Grinding Tapes for Semiconductor Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Back Grinding Tapes for Semiconductor Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Back Grinding Tapes for Semiconductor Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Back Grinding Tapes for Semiconductor Forecasted Market Size by Country
9.2.1 Middle East and Africa Back Grinding Tapes for Semiconductor Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Back Grinding Tapes for Semiconductor Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Mitsui Chemicals Tohcello
10.1.1 Mitsui Chemicals Tohcello Company Information
10.1.2 Mitsui Chemicals Tohcello Introduction and Business Overview
10.1.3 Mitsui Chemicals Tohcello Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Mitsui Chemicals Tohcello Back Grinding Tapes for Semiconductor Products Offered
10.1.5 Mitsui Chemicals Tohcello Recent Development
10.2 Nitto
10.2.1 Nitto Company Information
10.2.2 Nitto Introduction and Business Overview
10.2.3 Nitto Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Nitto Back Grinding Tapes for Semiconductor Products Offered
10.2.5 Nitto Recent Development
10.3 LINTEC
10.3.1 LINTEC Company Information
10.3.2 LINTEC Introduction and Business Overview
10.3.3 LINTEC Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.3.4 LINTEC Back Grinding Tapes for Semiconductor Products Offered
10.3.5 LINTEC Recent Development
10.4 Furukawa Electric
10.4.1 Furukawa Electric Company Information
10.4.2 Furukawa Electric Introduction and Business Overview
10.4.3 Furukawa Electric Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Furukawa Electric Back Grinding Tapes for Semiconductor Products Offered
10.4.5 Furukawa Electric Recent Development
10.5 Denka
10.5.1 Denka Company Information
10.5.2 Denka Introduction and Business Overview
10.5.3 Denka Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Denka Back Grinding Tapes for Semiconductor Products Offered
10.5.5 Denka Recent Development
10.6 D&X
10.6.1 D&X Company Information
10.6.2 D&X Introduction and Business Overview
10.6.3 D&X Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.6.4 D&X Back Grinding Tapes for Semiconductor Products Offered
10.6.5 D&X Recent Development
10.7 AI Technology
10.7.1 AI Technology Company Information
10.7.2 AI Technology Introduction and Business Overview
10.7.3 AI Technology Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.7.4 AI Technology Back Grinding Tapes for Semiconductor Products Offered
10.7.5 AI Technology Recent Development
10.8 KGK Chemical
10.8.1 KGK Chemical Company Information
10.8.2 KGK Chemical Introduction and Business Overview
10.8.3 KGK Chemical Back Grinding Tapes for Semiconductor Sales, Revenue and Gross Margin (2018-2023)
10.8.4 KGK Chemical Back Grinding Tapes for Semiconductor Products Offered
10.8.5 KGK Chemical Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Back Grinding Tapes for Semiconductor Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Back Grinding Tapes for Semiconductor Industrial Chain Analysis
11.4 Back Grinding Tapes for Semiconductor Market Dynamics
11.4.1 Back Grinding Tapes for Semiconductor Industry Trends
11.4.2 Back Grinding Tapes for Semiconductor Market Drivers
11.4.3 Back Grinding Tapes for Semiconductor Market Challenges
11.4.4 Back Grinding Tapes for Semiconductor Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Back Grinding Tapes for Semiconductor Distributors
12.3 Back Grinding Tapes for Semiconductor Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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