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BGA Solder Ball-Global Market Insights and Sales Trends 2024
Synopsis
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
The global BGA Solder Ball market size is expected to reach US$ 176.9 million by 2029, growing at a CAGR of 6.3% from 2023 to 2029. The market is mainly driven by the significant applications of BGA Solder Ball in various end use industries. The expanding demands from the Lead-Free BGA Package and Lead BGA Package, are propelling BGA Solder Ball market. Lead Solder Ball, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Lead Free Solder Ball segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for BGA Solder Ball market, driven by demand from China, the second largest economy with some signs of stabilising, the BGA Solder Ball market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for BGA Solder Ball, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global BGA Solder Ball market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global BGA Solder Ball market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, BGA Solder Ball sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of BGA Solder Ball covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc.
The global BGA Solder Ball market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Jovy Systems
SK Hynix
MacDermid Alpha Electronics Solutions
Global BGA Solder Ball market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global BGA Solder Ball market, Segment by Type:
Lead Solder Ball
Lead Free Solder Ball
Global BGA Solder Ball market, by Application
Lead-Free BGA Package
Lead BGA Package
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of BGA Solder Ball manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of BGA Solder Ball in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
The global BGA Solder Ball market size is expected to reach US$ 176.9 million by 2029, growing at a CAGR of 6.3% from 2023 to 2029. The market is mainly driven by the significant applications of BGA Solder Ball in various end use industries. The expanding demands from the Lead-Free BGA Package and Lead BGA Package, are propelling BGA Solder Ball market. Lead Solder Ball, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Lead Free Solder Ball segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for BGA Solder Ball market, driven by demand from China, the second largest economy with some signs of stabilising, the BGA Solder Ball market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for BGA Solder Ball, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global BGA Solder Ball market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global BGA Solder Ball market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, BGA Solder Ball sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of BGA Solder Ball covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc.
The global BGA Solder Ball market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Jovy Systems
SK Hynix
MacDermid Alpha Electronics Solutions
Global BGA Solder Ball market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global BGA Solder Ball market, Segment by Type:
Lead Solder Ball
Lead Free Solder Ball
Global BGA Solder Ball market, by Application
Lead-Free BGA Package
Lead BGA Package
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of BGA Solder Ball manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of BGA Solder Ball in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 BGA Solder Ball Market Overview
1.1 BGA Solder Ball Product Overview
1.2 BGA Solder Ball Market Segment by Type
1.2.1 Lead Solder Ball
1.2.2 Lead Free Solder Ball
1.3 Global BGA Solder Ball Market Size by Type
1.3.1 Global BGA Solder Ball Market Size Overview by Type (2018-2029)
1.3.2 Global BGA Solder Ball Historic Market Size Review by Type (2018-2023)
1.3.3 Global BGA Solder Ball Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America BGA Solder Ball Sales Breakdown by Type (2018-2023)
1.4.2 Europe BGA Solder Ball Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific BGA Solder Ball Sales Breakdown by Type (2018-2023)
1.4.4 Latin America BGA Solder Ball Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa BGA Solder Ball Sales Breakdown by Type (2018-2023)
2 Global BGA Solder Ball Market Competition by Company
2.1 Global Top Players by BGA Solder Ball Sales (2018-2023)
2.2 Global Top Players by BGA Solder Ball Revenue (2018-2023)
2.3 Global Top Players by BGA Solder Ball Price (2018-2023)
2.4 Global Top Manufacturers BGA Solder Ball Manufacturing Base Distribution, Sales Area, Product Type
2.5 BGA Solder Ball Market Competitive Situation and Trends
2.5.1 BGA Solder Ball Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by BGA Solder Ball Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in BGA Solder Ball as of 2022)
2.7 Date of Key Manufacturers Enter into BGA Solder Ball Market
2.8 Key Manufacturers BGA Solder Ball Product Offered
2.9 Mergers & Acquisitions, Expansion
3 BGA Solder Ball Status and Outlook by Region
3.1 Global BGA Solder Ball Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global BGA Solder Ball Historic Market Size by Region
3.2.1 Global BGA Solder Ball Sales in Volume by Region (2018-2023)
3.2.2 Global BGA Solder Ball Sales in Value by Region (2018-2023)
3.2.3 Global BGA Solder Ball Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global BGA Solder Ball Forecasted Market Size by Region
3.3.1 Global BGA Solder Ball Sales in Volume by Region (2024-2029)
3.3.2 Global BGA Solder Ball Sales in Value by Region (2024-2029)
3.3.3 Global BGA Solder Ball Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global BGA Solder Ball by Application
4.1 BGA Solder Ball Market Segment by Application
4.1.1 Lead-Free BGA Package
4.1.2 Lead BGA Package
4.2 Global BGA Solder Ball Market Size by Application
4.2.1 Global BGA Solder Ball Market Size Overview by Application (2018-2029)
4.2.2 Global BGA Solder Ball Historic Market Size Review by Application (2018-2023)
4.2.3 Global BGA Solder Ball Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America BGA Solder Ball Sales Breakdown by Application (2018-2023)
4.3.2 Europe BGA Solder Ball Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific BGA Solder Ball Sales Breakdown by Application (2018-2023)
4.3.4 Latin America BGA Solder Ball Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa BGA Solder Ball Sales Breakdown by Application (2018-2023)
5 North America BGA Solder Ball by Country
5.1 North America BGA Solder Ball Historic Market Size by Country
5.1.1 North America BGA Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America BGA Solder Ball Sales in Volume by Country (2018-2023)
5.1.3 North America BGA Solder Ball Sales in Value by Country (2018-2023)
5.2 North America BGA Solder Ball Forecasted Market Size by Country
5.2.1 North America BGA Solder Ball Sales in Volume by Country (2024-2029)
5.2.2 North America BGA Solder Ball Sales in Value by Country (2024-2029)
6 Europe BGA Solder Ball by Country
6.1 Europe BGA Solder Ball Historic Market Size by Country
6.1.1 Europe BGA Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe BGA Solder Ball Sales in Volume by Country (2018-2023)
6.1.3 Europe BGA Solder Ball Sales in Value by Country (2018-2023)
6.2 Europe BGA Solder Ball Forecasted Market Size by Country
6.2.1 Europe BGA Solder Ball Sales in Volume by Country (2024-2029)
6.2.2 Europe BGA Solder Ball Sales in Value by Country (2024-2029)
7 Asia-Pacific BGA Solder Ball by Region
7.1 Asia-Pacific BGA Solder Ball Historic Market Size by Region
7.1.1 Asia-Pacific BGA Solder Ball Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific BGA Solder Ball Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific BGA Solder Ball Sales in Value by Region (2018-2023)
7.2 Asia-Pacific BGA Solder Ball Forecasted Market Size by Region
7.2.1 Asia-Pacific BGA Solder Ball Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific BGA Solder Ball Sales in Value by Region (2024-2029)
8 Latin America BGA Solder Ball by Country
8.1 Latin America BGA Solder Ball Historic Market Size by Country
8.1.1 Latin America BGA Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America BGA Solder Ball Sales in Volume by Country (2018-2023)
8.1.3 Latin America BGA Solder Ball Sales in Value by Country (2018-2023)
8.2 Latin America BGA Solder Ball Forecasted Market Size by Country
8.2.1 Latin America BGA Solder Ball Sales in Volume by Country (2024-2029)
8.2.2 Latin America BGA Solder Ball Sales in Value by Country (2024-2029)
9 Middle East and Africa BGA Solder Ball by Country
9.1 Middle East and Africa BGA Solder Ball Historic Market Size by Country
9.1.1 Middle East and Africa BGA Solder Ball Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa BGA Solder Ball Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa BGA Solder Ball Sales in Value by Country (2018-2023)
9.2 Middle East and Africa BGA Solder Ball Forecasted Market Size by Country
9.2.1 Middle East and Africa BGA Solder Ball Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa BGA Solder Ball Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Senju Metal
10.1.1 Senju Metal Company Information
10.1.2 Senju Metal Introduction and Business Overview
10.1.3 Senju Metal BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Senju Metal BGA Solder Ball Products Offered
10.1.5 Senju Metal Recent Development
10.2 DS HiMetal
10.2.1 DS HiMetal Company Information
10.2.2 DS HiMetal Introduction and Business Overview
10.2.3 DS HiMetal BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.2.4 DS HiMetal BGA Solder Ball Products Offered
10.2.5 DS HiMetal Recent Development
10.3 MKE
10.3.1 MKE Company Information
10.3.2 MKE Introduction and Business Overview
10.3.3 MKE BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.3.4 MKE BGA Solder Ball Products Offered
10.3.5 MKE Recent Development
10.4 YCTC
10.4.1 YCTC Company Information
10.4.2 YCTC Introduction and Business Overview
10.4.3 YCTC BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.4.4 YCTC BGA Solder Ball Products Offered
10.4.5 YCTC Recent Development
10.5 Accurus
10.5.1 Accurus Company Information
10.5.2 Accurus Introduction and Business Overview
10.5.3 Accurus BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Accurus BGA Solder Ball Products Offered
10.5.5 Accurus Recent Development
10.6 PMTC
10.6.1 PMTC Company Information
10.6.2 PMTC Introduction and Business Overview
10.6.3 PMTC BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.6.4 PMTC BGA Solder Ball Products Offered
10.6.5 PMTC Recent Development
10.7 Shanghai hiking solder material
10.7.1 Shanghai hiking solder material Company Information
10.7.2 Shanghai hiking solder material Introduction and Business Overview
10.7.3 Shanghai hiking solder material BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Shanghai hiking solder material BGA Solder Ball Products Offered
10.7.5 Shanghai hiking solder material Recent Development
10.8 Shenmao Technology
10.8.1 Shenmao Technology Company Information
10.8.2 Shenmao Technology Introduction and Business Overview
10.8.3 Shenmao Technology BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Shenmao Technology BGA Solder Ball Products Offered
10.8.5 Shenmao Technology Recent Development
10.9 Nippon Micrometal
10.9.1 Nippon Micrometal Company Information
10.9.2 Nippon Micrometal Introduction and Business Overview
10.9.3 Nippon Micrometal BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Nippon Micrometal BGA Solder Ball Products Offered
10.9.5 Nippon Micrometal Recent Development
10.10 Indium Corporation
10.10.1 Indium Corporation Company Information
10.10.2 Indium Corporation Introduction and Business Overview
10.10.3 Indium Corporation BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Indium Corporation BGA Solder Ball Products Offered
10.10.5 Indium Corporation Recent Development
10.11 Jovy Systems
10.11.1 Jovy Systems Company Information
10.11.2 Jovy Systems Introduction and Business Overview
10.11.3 Jovy Systems BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Jovy Systems BGA Solder Ball Products Offered
10.11.5 Jovy Systems Recent Development
10.12 SK Hynix
10.12.1 SK Hynix Company Information
10.12.2 SK Hynix Introduction and Business Overview
10.12.3 SK Hynix BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.12.4 SK Hynix BGA Solder Ball Products Offered
10.12.5 SK Hynix Recent Development
10.13 MacDermid Alpha Electronics Solutions
10.13.1 MacDermid Alpha Electronics Solutions Company Information
10.13.2 MacDermid Alpha Electronics Solutions Introduction and Business Overview
10.13.3 MacDermid Alpha Electronics Solutions BGA Solder Ball Sales, Revenue and Gross Margin (2018-2023)
10.13.4 MacDermid Alpha Electronics Solutions BGA Solder Ball Products Offered
10.13.5 MacDermid Alpha Electronics Solutions Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 BGA Solder Ball Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 BGA Solder Ball Industrial Chain Analysis
11.4 BGA Solder Ball Market Dynamics
11.4.1 BGA Solder Ball Industry Trends
11.4.2 BGA Solder Ball Market Drivers
11.4.3 BGA Solder Ball Market Challenges
11.4.4 BGA Solder Ball Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 BGA Solder Ball Distributors
12.3 BGA Solder Ball Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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