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Blades for Wafer Cutting-Global Market Insights and Sales Trends 2024
Synopsis
The global Blades for Wafer Cutting market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Blades for Wafer Cutting in various end use industries. The expanding demands from the Semiconductor and Others, are propelling Blades for Wafer Cutting market. Resin-blades, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Metal Sintered Blades segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Blades for Wafer Cutting, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Blades for Wafer Cutting market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Blades for Wafer Cutting market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Blades for Wafer Cutting sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Blades for Wafer Cutting covered in this report include Accretech, Advanced Dicing Technologies (ADT), DISCO, K&S, UKAM, Ceiba, Shanghai Sinyang, Kinik and ITI, etc.
The global Blades for Wafer Cutting market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Accretech
Advanced Dicing Technologies (ADT)
DISCO
K&S
UKAM
Ceiba
Shanghai Sinyang
Kinik
ITI
Global Blades for Wafer Cutting market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Blades for Wafer Cutting market, Segment by Type:
Resin-blades
Metal Sintered Blades
Nickel Blades
Others
Global Blades for Wafer Cutting market, by Application
Semiconductor
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Blades for Wafer Cutting manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Blades for Wafer Cutting in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Blades for Wafer Cutting market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Blades for Wafer Cutting in various end use industries. The expanding demands from the Semiconductor and Others, are propelling Blades for Wafer Cutting market. Resin-blades, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Metal Sintered Blades segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Blades for Wafer Cutting, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Blades for Wafer Cutting market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Blades for Wafer Cutting market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Blades for Wafer Cutting sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Blades for Wafer Cutting covered in this report include Accretech, Advanced Dicing Technologies (ADT), DISCO, K&S, UKAM, Ceiba, Shanghai Sinyang, Kinik and ITI, etc.
The global Blades for Wafer Cutting market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Accretech
Advanced Dicing Technologies (ADT)
DISCO
K&S
UKAM
Ceiba
Shanghai Sinyang
Kinik
ITI
Global Blades for Wafer Cutting market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Blades for Wafer Cutting market, Segment by Type:
Resin-blades
Metal Sintered Blades
Nickel Blades
Others
Global Blades for Wafer Cutting market, by Application
Semiconductor
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Blades for Wafer Cutting manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Blades for Wafer Cutting in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Blades for Wafer Cutting Market Overview
1.1 Blades for Wafer Cutting Product Overview
1.2 Blades for Wafer Cutting Market Segment by Type
1.2.1 Resin-blades
1.2.2 Metal Sintered Blades
1.2.3 Nickel Blades
1.2.4 Others
1.3 Global Blades for Wafer Cutting Market Size by Type
1.3.1 Global Blades for Wafer Cutting Market Size Overview by Type (2018-2029)
1.3.2 Global Blades for Wafer Cutting Historic Market Size Review by Type (2018-2023)
1.3.3 Global Blades for Wafer Cutting Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Blades for Wafer Cutting Sales Breakdown by Type (2018-2023)
1.4.2 Europe Blades for Wafer Cutting Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Blades for Wafer Cutting Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Blades for Wafer Cutting Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Blades for Wafer Cutting Sales Breakdown by Type (2018-2023)
2 Global Blades for Wafer Cutting Market Competition by Company
2.1 Global Top Players by Blades for Wafer Cutting Sales (2018-2023)
2.2 Global Top Players by Blades for Wafer Cutting Revenue (2018-2023)
2.3 Global Top Players by Blades for Wafer Cutting Price (2018-2023)
2.4 Global Top Manufacturers Blades for Wafer Cutting Manufacturing Base Distribution, Sales Area, Product Type
2.5 Blades for Wafer Cutting Market Competitive Situation and Trends
2.5.1 Blades for Wafer Cutting Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Blades for Wafer Cutting Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Blades for Wafer Cutting as of 2022)
2.7 Date of Key Manufacturers Enter into Blades for Wafer Cutting Market
2.8 Key Manufacturers Blades for Wafer Cutting Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Blades for Wafer Cutting Status and Outlook by Region
3.1 Global Blades for Wafer Cutting Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Blades for Wafer Cutting Historic Market Size by Region
3.2.1 Global Blades for Wafer Cutting Sales in Volume by Region (2018-2023)
3.2.2 Global Blades for Wafer Cutting Sales in Value by Region (2018-2023)
3.2.3 Global Blades for Wafer Cutting Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Blades for Wafer Cutting Forecasted Market Size by Region
3.3.1 Global Blades for Wafer Cutting Sales in Volume by Region (2024-2029)
3.3.2 Global Blades for Wafer Cutting Sales in Value by Region (2024-2029)
3.3.3 Global Blades for Wafer Cutting Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Blades for Wafer Cutting by Application
4.1 Blades for Wafer Cutting Market Segment by Application
4.1.1 Semiconductor
4.1.2 Others
4.2 Global Blades for Wafer Cutting Market Size by Application
4.2.1 Global Blades for Wafer Cutting Market Size Overview by Application (2018-2029)
4.2.2 Global Blades for Wafer Cutting Historic Market Size Review by Application (2018-2023)
4.2.3 Global Blades for Wafer Cutting Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Blades for Wafer Cutting Sales Breakdown by Application (2018-2023)
4.3.2 Europe Blades for Wafer Cutting Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Blades for Wafer Cutting Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Blades for Wafer Cutting Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Blades for Wafer Cutting Sales Breakdown by Application (2018-2023)
5 North America Blades for Wafer Cutting by Country
5.1 North America Blades for Wafer Cutting Historic Market Size by Country
5.1.1 North America Blades for Wafer Cutting Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Blades for Wafer Cutting Sales in Volume by Country (2018-2023)
5.1.3 North America Blades for Wafer Cutting Sales in Value by Country (2018-2023)
5.2 North America Blades for Wafer Cutting Forecasted Market Size by Country
5.2.1 North America Blades for Wafer Cutting Sales in Volume by Country (2024-2029)
5.2.2 North America Blades for Wafer Cutting Sales in Value by Country (2024-2029)
6 Europe Blades for Wafer Cutting by Country
6.1 Europe Blades for Wafer Cutting Historic Market Size by Country
6.1.1 Europe Blades for Wafer Cutting Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Blades for Wafer Cutting Sales in Volume by Country (2018-2023)
6.1.3 Europe Blades for Wafer Cutting Sales in Value by Country (2018-2023)
6.2 Europe Blades for Wafer Cutting Forecasted Market Size by Country
6.2.1 Europe Blades for Wafer Cutting Sales in Volume by Country (2024-2029)
6.2.2 Europe Blades for Wafer Cutting Sales in Value by Country (2024-2029)
7 Asia-Pacific Blades for Wafer Cutting by Region
7.1 Asia-Pacific Blades for Wafer Cutting Historic Market Size by Region
7.1.1 Asia-Pacific Blades for Wafer Cutting Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Blades for Wafer Cutting Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Blades for Wafer Cutting Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Blades for Wafer Cutting Forecasted Market Size by Region
7.2.1 Asia-Pacific Blades for Wafer Cutting Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Blades for Wafer Cutting Sales in Value by Region (2024-2029)
8 Latin America Blades for Wafer Cutting by Country
8.1 Latin America Blades for Wafer Cutting Historic Market Size by Country
8.1.1 Latin America Blades for Wafer Cutting Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Blades for Wafer Cutting Sales in Volume by Country (2018-2023)
8.1.3 Latin America Blades for Wafer Cutting Sales in Value by Country (2018-2023)
8.2 Latin America Blades for Wafer Cutting Forecasted Market Size by Country
8.2.1 Latin America Blades for Wafer Cutting Sales in Volume by Country (2024-2029)
8.2.2 Latin America Blades for Wafer Cutting Sales in Value by Country (2024-2029)
9 Middle East and Africa Blades for Wafer Cutting by Country
9.1 Middle East and Africa Blades for Wafer Cutting Historic Market Size by Country
9.1.1 Middle East and Africa Blades for Wafer Cutting Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Blades for Wafer Cutting Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Blades for Wafer Cutting Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Blades for Wafer Cutting Forecasted Market Size by Country
9.2.1 Middle East and Africa Blades for Wafer Cutting Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Blades for Wafer Cutting Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Accretech
10.1.1 Accretech Company Information
10.1.2 Accretech Introduction and Business Overview
10.1.3 Accretech Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Accretech Blades for Wafer Cutting Products Offered
10.1.5 Accretech Recent Development
10.2 Advanced Dicing Technologies (ADT)
10.2.1 Advanced Dicing Technologies (ADT) Company Information
10.2.2 Advanced Dicing Technologies (ADT) Introduction and Business Overview
10.2.3 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Advanced Dicing Technologies (ADT) Blades for Wafer Cutting Products Offered
10.2.5 Advanced Dicing Technologies (ADT) Recent Development
10.3 DISCO
10.3.1 DISCO Company Information
10.3.2 DISCO Introduction and Business Overview
10.3.3 DISCO Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.3.4 DISCO Blades for Wafer Cutting Products Offered
10.3.5 DISCO Recent Development
10.4 K&S
10.4.1 K&S Company Information
10.4.2 K&S Introduction and Business Overview
10.4.3 K&S Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.4.4 K&S Blades for Wafer Cutting Products Offered
10.4.5 K&S Recent Development
10.5 UKAM
10.5.1 UKAM Company Information
10.5.2 UKAM Introduction and Business Overview
10.5.3 UKAM Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.5.4 UKAM Blades for Wafer Cutting Products Offered
10.5.5 UKAM Recent Development
10.6 Ceiba
10.6.1 Ceiba Company Information
10.6.2 Ceiba Introduction and Business Overview
10.6.3 Ceiba Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Ceiba Blades for Wafer Cutting Products Offered
10.6.5 Ceiba Recent Development
10.7 Shanghai Sinyang
10.7.1 Shanghai Sinyang Company Information
10.7.2 Shanghai Sinyang Introduction and Business Overview
10.7.3 Shanghai Sinyang Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Shanghai Sinyang Blades for Wafer Cutting Products Offered
10.7.5 Shanghai Sinyang Recent Development
10.8 Kinik
10.8.1 Kinik Company Information
10.8.2 Kinik Introduction and Business Overview
10.8.3 Kinik Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Kinik Blades for Wafer Cutting Products Offered
10.8.5 Kinik Recent Development
10.9 ITI
10.9.1 ITI Company Information
10.9.2 ITI Introduction and Business Overview
10.9.3 ITI Blades for Wafer Cutting Sales, Revenue and Gross Margin (2018-2023)
10.9.4 ITI Blades for Wafer Cutting Products Offered
10.9.5 ITI Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Blades for Wafer Cutting Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Blades for Wafer Cutting Industrial Chain Analysis
11.4 Blades for Wafer Cutting Market Dynamics
11.4.1 Blades for Wafer Cutting Industry Trends
11.4.2 Blades for Wafer Cutting Market Drivers
11.4.3 Blades for Wafer Cutting Market Challenges
11.4.4 Blades for Wafer Cutting Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Blades for Wafer Cutting Distributors
12.3 Blades for Wafer Cutting Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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