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Bonder-Global Market Insights and Sales Trends 2025
Synopsis
This report focuses on the Bonder machine for semiconductor industry.
The global Bonder market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Bonder in various end use industries. The expanding demands from the Integrated device manufacturer (IDMs) and Outsourced semiconductor assembly and test (OSATs), are propelling Bonder market. Wire Bonder, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Die Bonder segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Bonder market, driven by demand from China, the second largest economy with some signs of stabilising, the Bonder market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Bonder, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Bonder market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Bonder market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Bonder sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Bonder covered in this report include Besi, ASM Pacific Technology, Kulicke & Soffa, Palomar Technologies, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond and SHINKAWA Electric, etc.
The global Bonder market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Besi
ASM Pacific Technology
Kulicke & Soffa
Palomar Technologies
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Global Bonder market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Bonder market, Segment by Type:
Wire Bonder
Die Bonder
FC Bonder
Global Bonder market, by Application
Integrated device manufacturer (IDMs)
Outsourced semiconductor assembly and test (OSATs)
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Bonder manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
This report focuses on the Bonder machine for semiconductor industry.
The global Bonder market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Bonder in various end use industries. The expanding demands from the Integrated device manufacturer (IDMs) and Outsourced semiconductor assembly and test (OSATs), are propelling Bonder market. Wire Bonder, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Die Bonder segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Bonder market, driven by demand from China, the second largest economy with some signs of stabilising, the Bonder market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Bonder, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Bonder market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Bonder market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Bonder sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Bonder covered in this report include Besi, ASM Pacific Technology, Kulicke & Soffa, Palomar Technologies, DIAS Automation, F&K Delvotec Bondtechnik, Hesse, Hybond and SHINKAWA Electric, etc.
The global Bonder market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Besi
ASM Pacific Technology
Kulicke & Soffa
Palomar Technologies
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
Panasonic
FASFORD TECHNOLOGY
West-Bond
Global Bonder market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Bonder market, Segment by Type:
Wire Bonder
Die Bonder
FC Bonder
Global Bonder market, by Application
Integrated device manufacturer (IDMs)
Outsourced semiconductor assembly and test (OSATs)
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Bonder manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Bonder Market Overview
1.1 Bonder Product Overview
1.2 Bonder Market Segment by Type
1.2.1 Wire Bonder
1.2.2 Die Bonder
1.2.3 FC Bonder
1.3 Global Bonder Market Size by Type
1.3.1 Global Bonder Market Size Overview by Type (2018-2029)
1.3.2 Global Bonder Historic Market Size Review by Type (2018-2023)
1.3.3 Global Bonder Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Bonder Sales Breakdown by Type (2018-2023)
1.4.2 Europe Bonder Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Bonder Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Bonder Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Bonder Sales Breakdown by Type (2018-2023)
2 Global Bonder Market Competition by Company
2.1 Global Top Players by Bonder Sales (2018-2023)
2.2 Global Top Players by Bonder Revenue (2018-2023)
2.3 Global Top Players by Bonder Price (2018-2023)
2.4 Global Top Manufacturers Bonder Manufacturing Base Distribution, Sales Area, Product Type
2.5 Bonder Market Competitive Situation and Trends
2.5.1 Bonder Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Bonder Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Bonder as of 2022)
2.7 Date of Key Manufacturers Enter into Bonder Market
2.8 Key Manufacturers Bonder Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Bonder Status and Outlook by Region
3.1 Global Bonder Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Bonder Historic Market Size by Region
3.2.1 Global Bonder Sales in Volume by Region (2018-2023)
3.2.2 Global Bonder Sales in Value by Region (2018-2023)
3.2.3 Global Bonder Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Bonder Forecasted Market Size by Region
3.3.1 Global Bonder Sales in Volume by Region (2024-2029)
3.3.2 Global Bonder Sales in Value by Region (2024-2029)
3.3.3 Global Bonder Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Bonder by Application
4.1 Bonder Market Segment by Application
4.1.1 Integrated device manufacturer (IDMs)
4.1.2 Outsourced semiconductor assembly and test (OSATs)
4.2 Global Bonder Market Size by Application
4.2.1 Global Bonder Market Size Overview by Application (2018-2029)
4.2.2 Global Bonder Historic Market Size Review by Application (2018-2023)
4.2.3 Global Bonder Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Bonder Sales Breakdown by Application (2018-2023)
4.3.2 Europe Bonder Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Bonder Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Bonder Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Bonder Sales Breakdown by Application (2018-2023)
5 North America Bonder by Country
5.1 North America Bonder Historic Market Size by Country
5.1.1 North America Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Bonder Sales in Volume by Country (2018-2023)
5.1.3 North America Bonder Sales in Value by Country (2018-2023)
5.2 North America Bonder Forecasted Market Size by Country
5.2.1 North America Bonder Sales in Volume by Country (2024-2029)
5.2.2 North America Bonder Sales in Value by Country (2024-2029)
6 Europe Bonder by Country
6.1 Europe Bonder Historic Market Size by Country
6.1.1 Europe Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Bonder Sales in Volume by Country (2018-2023)
6.1.3 Europe Bonder Sales in Value by Country (2018-2023)
6.2 Europe Bonder Forecasted Market Size by Country
6.2.1 Europe Bonder Sales in Volume by Country (2024-2029)
6.2.2 Europe Bonder Sales in Value by Country (2024-2029)
7 Asia-Pacific Bonder by Region
7.1 Asia-Pacific Bonder Historic Market Size by Region
7.1.1 Asia-Pacific Bonder Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Bonder Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Bonder Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Bonder Forecasted Market Size by Region
7.2.1 Asia-Pacific Bonder Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Bonder Sales in Value by Region (2024-2029)
8 Latin America Bonder by Country
8.1 Latin America Bonder Historic Market Size by Country
8.1.1 Latin America Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Bonder Sales in Volume by Country (2018-2023)
8.1.3 Latin America Bonder Sales in Value by Country (2018-2023)
8.2 Latin America Bonder Forecasted Market Size by Country
8.2.1 Latin America Bonder Sales in Volume by Country (2024-2029)
8.2.2 Latin America Bonder Sales in Value by Country (2024-2029)
9 Middle East and Africa Bonder by Country
9.1 Middle East and Africa Bonder Historic Market Size by Country
9.1.1 Middle East and Africa Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Bonder Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Bonder Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Bonder Forecasted Market Size by Country
9.2.1 Middle East and Africa Bonder Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Bonder Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Besi
10.1.1 Besi Company Information
10.1.2 Besi Introduction and Business Overview
10.1.3 Besi Bonder Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Besi Bonder Products Offered
10.1.5 Besi Recent Development
10.2 ASM Pacific Technology
10.2.1 ASM Pacific Technology Company Information
10.2.2 ASM Pacific Technology Introduction and Business Overview
10.2.3 ASM Pacific Technology Bonder Sales, Revenue and Gross Margin (2018-2023)
10.2.4 ASM Pacific Technology Bonder Products Offered
10.2.5 ASM Pacific Technology Recent Development
10.3 Kulicke & Soffa
10.3.1 Kulicke & Soffa Company Information
10.3.2 Kulicke & Soffa Introduction and Business Overview
10.3.3 Kulicke & Soffa Bonder Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Kulicke & Soffa Bonder Products Offered
10.3.5 Kulicke & Soffa Recent Development
10.4 Palomar Technologies
10.4.1 Palomar Technologies Company Information
10.4.2 Palomar Technologies Introduction and Business Overview
10.4.3 Palomar Technologies Bonder Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Palomar Technologies Bonder Products Offered
10.4.5 Palomar Technologies Recent Development
10.5 DIAS Automation
10.5.1 DIAS Automation Company Information
10.5.2 DIAS Automation Introduction and Business Overview
10.5.3 DIAS Automation Bonder Sales, Revenue and Gross Margin (2018-2023)
10.5.4 DIAS Automation Bonder Products Offered
10.5.5 DIAS Automation Recent Development
10.6 F&K Delvotec Bondtechnik
10.6.1 F&K Delvotec Bondtechnik Company Information
10.6.2 F&K Delvotec Bondtechnik Introduction and Business Overview
10.6.3 F&K Delvotec Bondtechnik Bonder Sales, Revenue and Gross Margin (2018-2023)
10.6.4 F&K Delvotec Bondtechnik Bonder Products Offered
10.6.5 F&K Delvotec Bondtechnik Recent Development
10.7 Hesse
10.7.1 Hesse Company Information
10.7.2 Hesse Introduction and Business Overview
10.7.3 Hesse Bonder Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Hesse Bonder Products Offered
10.7.5 Hesse Recent Development
10.8 Hybond
10.8.1 Hybond Company Information
10.8.2 Hybond Introduction and Business Overview
10.8.3 Hybond Bonder Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Hybond Bonder Products Offered
10.8.5 Hybond Recent Development
10.9 SHINKAWA Electric
10.9.1 SHINKAWA Electric Company Information
10.9.2 SHINKAWA Electric Introduction and Business Overview
10.9.3 SHINKAWA Electric Bonder Sales, Revenue and Gross Margin (2018-2023)
10.9.4 SHINKAWA Electric Bonder Products Offered
10.9.5 SHINKAWA Electric Recent Development
10.10 Toray Engineering
10.10.1 Toray Engineering Company Information
10.10.2 Toray Engineering Introduction and Business Overview
10.10.3 Toray Engineering Bonder Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Toray Engineering Bonder Products Offered
10.10.5 Toray Engineering Recent Development
10.11 Panasonic
10.11.1 Panasonic Company Information
10.11.2 Panasonic Introduction and Business Overview
10.11.3 Panasonic Bonder Sales, Revenue and Gross Margin (2018-2023)
10.11.4 Panasonic Bonder Products Offered
10.11.5 Panasonic Recent Development
10.12 FASFORD TECHNOLOGY
10.12.1 FASFORD TECHNOLOGY Company Information
10.12.2 FASFORD TECHNOLOGY Introduction and Business Overview
10.12.3 FASFORD TECHNOLOGY Bonder Sales, Revenue and Gross Margin (2018-2023)
10.12.4 FASFORD TECHNOLOGY Bonder Products Offered
10.12.5 FASFORD TECHNOLOGY Recent Development
10.13 West-Bond
10.13.1 West-Bond Company Information
10.13.2 West-Bond Introduction and Business Overview
10.13.3 West-Bond Bonder Sales, Revenue and Gross Margin (2018-2023)
10.13.4 West-Bond Bonder Products Offered
10.13.5 West-Bond Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Bonder Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Bonder Industrial Chain Analysis
11.4 Bonder Market Dynamics
11.4.1 Bonder Industry Trends
11.4.2 Bonder Market Drivers
11.4.3 Bonder Market Challenges
11.4.4 Bonder Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Bonder Distributors
12.3 Bonder Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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