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Electronic Board Level Underfill and Encapsulation Material-Global Market Insights and Sales Trends 2024
Synopsis
Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
The global Electronic Board Level Underfill and Encapsulation Material market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Board Level Underfill and Encapsulation Material in various end use industries. The expanding demands from the Semiconductor Electronics Device, Aviation & Aerospace, Medical Devices and Others, are propelling Electronic Board Level Underfill and Encapsulation Material market. No Flow Underfill, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Capillary Underfill segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Board Level Underfill and Encapsulation Material, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Board Level Underfill and Encapsulation Material market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Board Level Underfill and Encapsulation Material market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Board Level Underfill and Encapsulation Material sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Board Level Underfill and Encapsulation Material covered in this report include Fuller, Masterbond, Zymet, Namics, Epoxy Technology, Yincae Advanced Materials and Henkel, etc.
The global Electronic Board Level Underfill and Encapsulation Material market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel
Global Electronic Board Level Underfill and Encapsulation Material market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Board Level Underfill and Encapsulation Material market, Segment by Type:
No Flow Underfill
Capillary Underfill
Molded Underfill
Wafer level Underfill
Global Electronic Board Level Underfill and Encapsulation Material market, by Application
Semiconductor Electronics Device
Aviation & Aerospace
Medical Devices
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Electronic Board Level Underfill and Encapsulation Material manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Electronic Board Level Underfill and Encapsulation Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Underfill and encapsulation is a process of filling cavities between chip and substrate with thermoset encapsulates which protects the solders during service.
The global Electronic Board Level Underfill and Encapsulation Material market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Board Level Underfill and Encapsulation Material in various end use industries. The expanding demands from the Semiconductor Electronics Device, Aviation & Aerospace, Medical Devices and Others, are propelling Electronic Board Level Underfill and Encapsulation Material market. No Flow Underfill, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Capillary Underfill segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Board Level Underfill and Encapsulation Material, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Board Level Underfill and Encapsulation Material market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Board Level Underfill and Encapsulation Material market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Board Level Underfill and Encapsulation Material sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Board Level Underfill and Encapsulation Material covered in this report include Fuller, Masterbond, Zymet, Namics, Epoxy Technology, Yincae Advanced Materials and Henkel, etc.
The global Electronic Board Level Underfill and Encapsulation Material market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Fuller
Masterbond
Zymet
Namics
Epoxy Technology
Yincae Advanced Materials
Henkel
Global Electronic Board Level Underfill and Encapsulation Material market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Board Level Underfill and Encapsulation Material market, Segment by Type:
No Flow Underfill
Capillary Underfill
Molded Underfill
Wafer level Underfill
Global Electronic Board Level Underfill and Encapsulation Material market, by Application
Semiconductor Electronics Device
Aviation & Aerospace
Medical Devices
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Electronic Board Level Underfill and Encapsulation Material manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Electronic Board Level Underfill and Encapsulation Material in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Electronic Board Level Underfill and Encapsulation Material Market Overview
1.1 Electronic Board Level Underfill and Encapsulation Material Product Overview
1.2 Electronic Board Level Underfill and Encapsulation Material Market Segment by Type
1.2.1 No Flow Underfill
1.2.2 Capillary Underfill
1.2.3 Molded Underfill
1.2.4 Wafer level Underfill
1.3 Global Electronic Board Level Underfill and Encapsulation Material Market Size by Type
1.3.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size Overview by Type (2018-2029)
1.3.2 Global Electronic Board Level Underfill and Encapsulation Material Historic Market Size Review by Type (2018-2023)
1.3.3 Global Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Type (2018-2023)
1.4.2 Europe Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Type (2018-2023)
2 Global Electronic Board Level Underfill and Encapsulation Material Market Competition by Company
2.1 Global Top Players by Electronic Board Level Underfill and Encapsulation Material Sales (2018-2023)
2.2 Global Top Players by Electronic Board Level Underfill and Encapsulation Material Revenue (2018-2023)
2.3 Global Top Players by Electronic Board Level Underfill and Encapsulation Material Price (2018-2023)
2.4 Global Top Manufacturers Electronic Board Level Underfill and Encapsulation Material Manufacturing Base Distribution, Sales Area, Product Type
2.5 Electronic Board Level Underfill and Encapsulation Material Market Competitive Situation and Trends
2.5.1 Electronic Board Level Underfill and Encapsulation Material Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Electronic Board Level Underfill and Encapsulation Material Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Electronic Board Level Underfill and Encapsulation Material as of 2022)
2.7 Date of Key Manufacturers Enter into Electronic Board Level Underfill and Encapsulation Material Market
2.8 Key Manufacturers Electronic Board Level Underfill and Encapsulation Material Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Electronic Board Level Underfill and Encapsulation Material Status and Outlook by Region
3.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Electronic Board Level Underfill and Encapsulation Material Historic Market Size by Region
3.2.1 Global Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Region (2018-2023)
3.2.2 Global Electronic Board Level Underfill and Encapsulation Material Sales in Value by Region (2018-2023)
3.2.3 Global Electronic Board Level Underfill and Encapsulation Material Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Region
3.3.1 Global Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Region (2024-2029)
3.3.2 Global Electronic Board Level Underfill and Encapsulation Material Sales in Value by Region (2024-2029)
3.3.3 Global Electronic Board Level Underfill and Encapsulation Material Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Electronic Board Level Underfill and Encapsulation Material by Application
4.1 Electronic Board Level Underfill and Encapsulation Material Market Segment by Application
4.1.1 Semiconductor Electronics Device
4.1.2 Aviation & Aerospace
4.1.3 Medical Devices
4.1.4 Others
4.2 Global Electronic Board Level Underfill and Encapsulation Material Market Size by Application
4.2.1 Global Electronic Board Level Underfill and Encapsulation Material Market Size Overview by Application (2018-2029)
4.2.2 Global Electronic Board Level Underfill and Encapsulation Material Historic Market Size Review by Application (2018-2023)
4.2.3 Global Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Application (2018-2023)
4.3.2 Europe Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales Breakdown by Application (2018-2023)
5 North America Electronic Board Level Underfill and Encapsulation Material by Country
5.1 North America Electronic Board Level Underfill and Encapsulation Material Historic Market Size by Country
5.1.1 North America Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2018-2023)
5.1.3 North America Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2018-2023)
5.2 North America Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Country
5.2.1 North America Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2024-2029)
5.2.2 North America Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2024-2029)
6 Europe Electronic Board Level Underfill and Encapsulation Material by Country
6.1 Europe Electronic Board Level Underfill and Encapsulation Material Historic Market Size by Country
6.1.1 Europe Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2018-2023)
6.1.3 Europe Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2018-2023)
6.2 Europe Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Country
6.2.1 Europe Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2024-2029)
6.2.2 Europe Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2024-2029)
7 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material by Region
7.1 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Historic Market Size by Region
7.1.1 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Region
7.2.1 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Electronic Board Level Underfill and Encapsulation Material Sales in Value by Region (2024-2029)
8 Latin America Electronic Board Level Underfill and Encapsulation Material by Country
8.1 Latin America Electronic Board Level Underfill and Encapsulation Material Historic Market Size by Country
8.1.1 Latin America Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2018-2023)
8.1.3 Latin America Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2018-2023)
8.2 Latin America Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Country
8.2.1 Latin America Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2024-2029)
8.2.2 Latin America Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2024-2029)
9 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material by Country
9.1 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Historic Market Size by Country
9.1.1 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Forecasted Market Size by Country
9.2.1 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Electronic Board Level Underfill and Encapsulation Material Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Fuller
10.1.1 Fuller Company Information
10.1.2 Fuller Introduction and Business Overview
10.1.3 Fuller Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Fuller Electronic Board Level Underfill and Encapsulation Material Products Offered
10.1.5 Fuller Recent Development
10.2 Masterbond
10.2.1 Masterbond Company Information
10.2.2 Masterbond Introduction and Business Overview
10.2.3 Masterbond Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Masterbond Electronic Board Level Underfill and Encapsulation Material Products Offered
10.2.5 Masterbond Recent Development
10.3 Zymet
10.3.1 Zymet Company Information
10.3.2 Zymet Introduction and Business Overview
10.3.3 Zymet Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Zymet Electronic Board Level Underfill and Encapsulation Material Products Offered
10.3.5 Zymet Recent Development
10.4 Namics
10.4.1 Namics Company Information
10.4.2 Namics Introduction and Business Overview
10.4.3 Namics Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Namics Electronic Board Level Underfill and Encapsulation Material Products Offered
10.4.5 Namics Recent Development
10.5 Epoxy Technology
10.5.1 Epoxy Technology Company Information
10.5.2 Epoxy Technology Introduction and Business Overview
10.5.3 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Epoxy Technology Electronic Board Level Underfill and Encapsulation Material Products Offered
10.5.5 Epoxy Technology Recent Development
10.6 Yincae Advanced Materials
10.6.1 Yincae Advanced Materials Company Information
10.6.2 Yincae Advanced Materials Introduction and Business Overview
10.6.3 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Yincae Advanced Materials Electronic Board Level Underfill and Encapsulation Material Products Offered
10.6.5 Yincae Advanced Materials Recent Development
10.7 Henkel
10.7.1 Henkel Company Information
10.7.2 Henkel Introduction and Business Overview
10.7.3 Henkel Electronic Board Level Underfill and Encapsulation Material Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Henkel Electronic Board Level Underfill and Encapsulation Material Products Offered
10.7.5 Henkel Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Electronic Board Level Underfill and Encapsulation Material Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Electronic Board Level Underfill and Encapsulation Material Industrial Chain Analysis
11.4 Electronic Board Level Underfill and Encapsulation Material Market Dynamics
11.4.1 Electronic Board Level Underfill and Encapsulation Material Industry Trends
11.4.2 Electronic Board Level Underfill and Encapsulation Material Market Drivers
11.4.3 Electronic Board Level Underfill and Encapsulation Material Market Challenges
11.4.4 Electronic Board Level Underfill and Encapsulation Material Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Electronic Board Level Underfill and Encapsulation Material Distributors
12.3 Electronic Board Level Underfill and Encapsulation Material Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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