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Electronic Potting and Encapsulating-Global Market Insights and Sales Trends 2024
Synopsis
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
The global Electronic Potting and Encapsulating market size is expected to reach US$ 3404 million by 2029, growing at a CAGR of 9.3% from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Potting and Encapsulating in various end use industries. The expanding demands from the Consumer Electronics, Automotive, Medical and Telecommunications, are propelling Electronic Potting and Encapsulating market. Epoxy, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Silicones segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Potting and Encapsulating, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Potting and Encapsulating market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Potting and Encapsulating market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Potting and Encapsulating sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Potting and Encapsulating covered in this report include Henkel, Dow Corning, Hitachi Chemical, LORD Corporation, Huntsman Corporation, ITW Engineered Polymers, 3M, H.B. Fuller and John C. Dolph, etc.
The global Electronic Potting and Encapsulating market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Global Electronic Potting and Encapsulating market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Potting and Encapsulating market, Segment by Type:
Epoxy
Silicones
Polyurethane
Ohers
Global Electronic Potting and Encapsulating market, by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Electronic Potting and Encapsulating companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
The global Electronic Potting and Encapsulating market size is expected to reach US$ 3404 million by 2029, growing at a CAGR of 9.3% from 2023 to 2029. The market is mainly driven by the significant applications of Electronic Potting and Encapsulating in various end use industries. The expanding demands from the Consumer Electronics, Automotive, Medical and Telecommunications, are propelling Electronic Potting and Encapsulating market. Epoxy, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Silicones segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Electronic Potting and Encapsulating, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Electronic Potting and Encapsulating market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Electronic Potting and Encapsulating market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Electronic Potting and Encapsulating sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Electronic Potting and Encapsulating covered in this report include Henkel, Dow Corning, Hitachi Chemical, LORD Corporation, Huntsman Corporation, ITW Engineered Polymers, 3M, H.B. Fuller and John C. Dolph, etc.
The global Electronic Potting and Encapsulating market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Global Electronic Potting and Encapsulating market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Electronic Potting and Encapsulating market, Segment by Type:
Epoxy
Silicones
Polyurethane
Ohers
Global Electronic Potting and Encapsulating market, by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Electronic Potting and Encapsulating companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Electronic Potting and Encapsulating
1.1 Electronic Potting and Encapsulating Market Overview
1.1.1 Electronic Potting and Encapsulating Product Scope
1.1.2 Electronic Potting and Encapsulating Market Status and Outlook
1.2 Global Electronic Potting and Encapsulating Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Electronic Potting and Encapsulating Market Size by Region (2018-2029)
1.4 Global Electronic Potting and Encapsulating Historic Market Size by Region (2018-2023)
1.5 Global Electronic Potting and Encapsulating Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Electronic Potting and Encapsulating Market Size (2018-2029)
1.6.1 North America Electronic Potting and Encapsulating Market Size (2018-2029)
1.6.2 Europe Electronic Potting and Encapsulating Market Size (2018-2029)
1.6.3 Asia-Pacific Electronic Potting and Encapsulating Market Size (2018-2029)
1.6.4 Latin America Electronic Potting and Encapsulating Market Size (2018-2029)
1.6.5 Middle East & Africa Electronic Potting and Encapsulating Market Size (2018-2029)
2 Electronic Potting and Encapsulating Market by Type
2.1 Introduction
2.1.1 Epoxy
2.1.2 Silicones
2.1.3 Polyurethane
2.1.4 Ohers
2.2 Global Electronic Potting and Encapsulating Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Electronic Potting and Encapsulating Historic Market Size by Type (2018-2023)
2.2.2 Global Electronic Potting and Encapsulating Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Electronic Potting and Encapsulating Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Electronic Potting and Encapsulating Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Electronic Potting and Encapsulating Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Electronic Potting and Encapsulating Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Electronic Potting and Encapsulating Revenue Breakdown by Type (2018-2029)
3 Electronic Potting and Encapsulating Market Overview by Application
3.1 Introduction
3.1.1 Consumer Electronics
3.1.2 Automotive
3.1.3 Medical
3.1.4 Telecommunications
3.1.5 Others
3.2 Global Electronic Potting and Encapsulating Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Electronic Potting and Encapsulating Historic Market Size by Application (2018-2023)
3.2.2 Global Electronic Potting and Encapsulating Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Electronic Potting and Encapsulating Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Electronic Potting and Encapsulating Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Electronic Potting and Encapsulating Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Electronic Potting and Encapsulating Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Electronic Potting and Encapsulating Revenue Breakdown by Application (2018-2029)
4 Electronic Potting and Encapsulating Competition Analysis by Players
4.1 Global Electronic Potting and Encapsulating Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Electronic Potting and Encapsulating as of 2022)
4.3 Date of Key Players Enter into Electronic Potting and Encapsulating Market
4.4 Global Top Players Electronic Potting and Encapsulating Headquarters and Area Served
4.5 Key Players Electronic Potting and Encapsulating Product Solution and Service
4.6 Competitive Status
4.6.1 Electronic Potting and Encapsulating Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Henkel
5.1.1 Henkel Profile
5.1.2 Henkel Main Business
5.1.3 Henkel Electronic Potting and Encapsulating Products, Services and Solutions
5.1.4 Henkel Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.1.5 Henkel Recent Developments
5.2 Dow Corning
5.2.1 Dow Corning Profile
5.2.2 Dow Corning Main Business
5.2.3 Dow Corning Electronic Potting and Encapsulating Products, Services and Solutions
5.2.4 Dow Corning Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.2.5 Dow Corning Recent Developments
5.3 Hitachi Chemical
5.3.1 Hitachi Chemical Profile
5.3.2 Hitachi Chemical Main Business
5.3.3 Hitachi Chemical Electronic Potting and Encapsulating Products, Services and Solutions
5.3.4 Hitachi Chemical Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.3.5 LORD Corporation Recent Developments
5.4 LORD Corporation
5.4.1 LORD Corporation Profile
5.4.2 LORD Corporation Main Business
5.4.3 LORD Corporation Electronic Potting and Encapsulating Products, Services and Solutions
5.4.4 LORD Corporation Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.4.5 LORD Corporation Recent Developments
5.5 Huntsman Corporation
5.5.1 Huntsman Corporation Profile
5.5.2 Huntsman Corporation Main Business
5.5.3 Huntsman Corporation Electronic Potting and Encapsulating Products, Services and Solutions
5.5.4 Huntsman Corporation Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.5.5 Huntsman Corporation Recent Developments
5.6 ITW Engineered Polymers
5.6.1 ITW Engineered Polymers Profile
5.6.2 ITW Engineered Polymers Main Business
5.6.3 ITW Engineered Polymers Electronic Potting and Encapsulating Products, Services and Solutions
5.6.4 ITW Engineered Polymers Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.6.5 ITW Engineered Polymers Recent Developments
5.7 3M
5.7.1 3M Profile
5.7.2 3M Main Business
5.7.3 3M Electronic Potting and Encapsulating Products, Services and Solutions
5.7.4 3M Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.7.5 3M Recent Developments
5.8 H.B. Fuller
5.8.1 H.B. Fuller Profile
5.8.2 H.B. Fuller Main Business
5.8.3 H.B. Fuller Electronic Potting and Encapsulating Products, Services and Solutions
5.8.4 H.B. Fuller Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.8.5 H.B. Fuller Recent Developments
5.9 John C. Dolph
5.9.1 John C. Dolph Profile
5.9.2 John C. Dolph Main Business
5.9.3 John C. Dolph Electronic Potting and Encapsulating Products, Services and Solutions
5.9.4 John C. Dolph Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.9.5 John C. Dolph Recent Developments
5.10 Master Bond
5.10.1 Master Bond Profile
5.10.2 Master Bond Main Business
5.10.3 Master Bond Electronic Potting and Encapsulating Products, Services and Solutions
5.10.4 Master Bond Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.10.5 Master Bond Recent Developments
5.11 ACC Silicones
5.11.1 ACC Silicones Profile
5.11.2 ACC Silicones Main Business
5.11.3 ACC Silicones Electronic Potting and Encapsulating Products, Services and Solutions
5.11.4 ACC Silicones Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.11.5 ACC Silicones Recent Developments
5.12 Epic Resins
5.12.1 Epic Resins Profile
5.12.2 Epic Resins Main Business
5.12.3 Epic Resins Electronic Potting and Encapsulating Products, Services and Solutions
5.12.4 Epic Resins Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.12.5 Epic Resins Recent Developments
5.13 Plasma Ruggedized Solutions
5.13.1 Plasma Ruggedized Solutions Profile
5.13.2 Plasma Ruggedized Solutions Main Business
5.13.3 Plasma Ruggedized Solutions Electronic Potting and Encapsulating Products, Services and Solutions
5.13.4 Plasma Ruggedized Solutions Electronic Potting and Encapsulating Revenue (US$ Million) & (2018-2023)
5.13.5 Plasma Ruggedized Solutions Recent Developments
6 North America
6.1 North America Electronic Potting and Encapsulating Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Electronic Potting and Encapsulating Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Electronic Potting and Encapsulating Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Electronic Potting and Encapsulating Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Electronic Potting and Encapsulating Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Electronic Potting and Encapsulating Market Dynamics
11.1 Electronic Potting and Encapsulating Industry Trends
11.2 Electronic Potting and Encapsulating Market Drivers
11.3 Electronic Potting and Encapsulating Market Challenges
11.4 Electronic Potting and Encapsulating Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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