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Embedded Die Packaging Technology-Global Market Insights and Sales Trends 2024
Synopsis
The global Embedded Die Packaging Technology market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Embedded Die Packaging Technology in various end use industries. The expanding demands from the Consumer Electronics, IT & Telecommunications, Automotive and Healthcare, are propelling Embedded Die Packaging Technology market. Embedded Die in Rigid Board, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Embedded Die in Flexible Board segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Embedded Die Packaging Technology, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Embedded Die Packaging Technology market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Embedded Die Packaging Technology market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Embedded Die Packaging Technology sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Embedded Die Packaging Technology covered in this report include AT & S, General Electric, Amkor Technology, Taiwan Semiconductor Manufacturing Company, TDK-Epcos, Schweizer, Fujikura, Microchip Technology and Infineon, etc.
The global Embedded Die Packaging Technology market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
AT & S
General Electric
Amkor Technology
Taiwan Semiconductor Manufacturing Company
TDK-Epcos
Schweizer
Fujikura
Microchip Technology
Infineon
Toshiba Corporation
Fujitsu Limited
STMICROELECTRONICS
Global Embedded Die Packaging Technology market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Embedded Die Packaging Technology market, Segment by Type:
Embedded Die in Rigid Board
Embedded Die in Flexible Board
Global Embedded Die Packaging Technology market, by Application
Consumer Electronics
IT & Telecommunications
Automotive
Healthcare
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Embedded Die Packaging Technology companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
The global Embedded Die Packaging Technology market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Embedded Die Packaging Technology in various end use industries. The expanding demands from the Consumer Electronics, IT & Telecommunications, Automotive and Healthcare, are propelling Embedded Die Packaging Technology market. Embedded Die in Rigid Board, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Embedded Die in Flexible Board segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Embedded Die Packaging Technology, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Embedded Die Packaging Technology market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Embedded Die Packaging Technology market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Embedded Die Packaging Technology sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Embedded Die Packaging Technology covered in this report include AT & S, General Electric, Amkor Technology, Taiwan Semiconductor Manufacturing Company, TDK-Epcos, Schweizer, Fujikura, Microchip Technology and Infineon, etc.
The global Embedded Die Packaging Technology market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
AT & S
General Electric
Amkor Technology
Taiwan Semiconductor Manufacturing Company
TDK-Epcos
Schweizer
Fujikura
Microchip Technology
Infineon
Toshiba Corporation
Fujitsu Limited
STMICROELECTRONICS
Global Embedded Die Packaging Technology market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Embedded Die Packaging Technology market, Segment by Type:
Embedded Die in Rigid Board
Embedded Die in Flexible Board
Global Embedded Die Packaging Technology market, by Application
Consumer Electronics
IT & Telecommunications
Automotive
Healthcare
Others
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Embedded Die Packaging Technology companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Embedded Die Packaging Technology
1.1 Embedded Die Packaging Technology Market Overview
1.1.1 Embedded Die Packaging Technology Product Scope
1.1.2 Embedded Die Packaging Technology Market Status and Outlook
1.2 Global Embedded Die Packaging Technology Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Embedded Die Packaging Technology Market Size by Region (2018-2029)
1.4 Global Embedded Die Packaging Technology Historic Market Size by Region (2018-2023)
1.5 Global Embedded Die Packaging Technology Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Embedded Die Packaging Technology Market Size (2018-2029)
1.6.1 North America Embedded Die Packaging Technology Market Size (2018-2029)
1.6.2 Europe Embedded Die Packaging Technology Market Size (2018-2029)
1.6.3 Asia-Pacific Embedded Die Packaging Technology Market Size (2018-2029)
1.6.4 Latin America Embedded Die Packaging Technology Market Size (2018-2029)
1.6.5 Middle East & Africa Embedded Die Packaging Technology Market Size (2018-2029)
2 Embedded Die Packaging Technology Market by Type
2.1 Introduction
2.1.1 Embedded Die in Rigid Board
2.1.2 Embedded Die in Flexible Board
2.2 Global Embedded Die Packaging Technology Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Embedded Die Packaging Technology Historic Market Size by Type (2018-2023)
2.2.2 Global Embedded Die Packaging Technology Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Embedded Die Packaging Technology Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Embedded Die Packaging Technology Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Embedded Die Packaging Technology Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Embedded Die Packaging Technology Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Embedded Die Packaging Technology Revenue Breakdown by Type (2018-2029)
3 Embedded Die Packaging Technology Market Overview by Application
3.1 Introduction
3.1.1 Consumer Electronics
3.1.2 IT & Telecommunications
3.1.3 Automotive
3.1.4 Healthcare
3.1.5 Others
3.2 Global Embedded Die Packaging Technology Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Embedded Die Packaging Technology Historic Market Size by Application (2018-2023)
3.2.2 Global Embedded Die Packaging Technology Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Embedded Die Packaging Technology Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Embedded Die Packaging Technology Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Embedded Die Packaging Technology Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Embedded Die Packaging Technology Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Embedded Die Packaging Technology Revenue Breakdown by Application (2018-2029)
4 Embedded Die Packaging Technology Competition Analysis by Players
4.1 Global Embedded Die Packaging Technology Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Embedded Die Packaging Technology as of 2022)
4.3 Date of Key Players Enter into Embedded Die Packaging Technology Market
4.4 Global Top Players Embedded Die Packaging Technology Headquarters and Area Served
4.5 Key Players Embedded Die Packaging Technology Product Solution and Service
4.6 Competitive Status
4.6.1 Embedded Die Packaging Technology Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 AT & S
5.1.1 AT & S Profile
5.1.2 AT & S Main Business
5.1.3 AT & S Embedded Die Packaging Technology Products, Services and Solutions
5.1.4 AT & S Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.1.5 AT & S Recent Developments
5.2 General Electric
5.2.1 General Electric Profile
5.2.2 General Electric Main Business
5.2.3 General Electric Embedded Die Packaging Technology Products, Services and Solutions
5.2.4 General Electric Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.2.5 General Electric Recent Developments
5.3 Amkor Technology
5.3.1 Amkor Technology Profile
5.3.2 Amkor Technology Main Business
5.3.3 Amkor Technology Embedded Die Packaging Technology Products, Services and Solutions
5.3.4 Amkor Technology Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.3.5 Taiwan Semiconductor Manufacturing Company Recent Developments
5.4 Taiwan Semiconductor Manufacturing Company
5.4.1 Taiwan Semiconductor Manufacturing Company Profile
5.4.2 Taiwan Semiconductor Manufacturing Company Main Business
5.4.3 Taiwan Semiconductor Manufacturing Company Embedded Die Packaging Technology Products, Services and Solutions
5.4.4 Taiwan Semiconductor Manufacturing Company Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.4.5 Taiwan Semiconductor Manufacturing Company Recent Developments
5.5 TDK-Epcos
5.5.1 TDK-Epcos Profile
5.5.2 TDK-Epcos Main Business
5.5.3 TDK-Epcos Embedded Die Packaging Technology Products, Services and Solutions
5.5.4 TDK-Epcos Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.5.5 TDK-Epcos Recent Developments
5.6 Schweizer
5.6.1 Schweizer Profile
5.6.2 Schweizer Main Business
5.6.3 Schweizer Embedded Die Packaging Technology Products, Services and Solutions
5.6.4 Schweizer Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.6.5 Schweizer Recent Developments
5.7 Fujikura
5.7.1 Fujikura Profile
5.7.2 Fujikura Main Business
5.7.3 Fujikura Embedded Die Packaging Technology Products, Services and Solutions
5.7.4 Fujikura Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.7.5 Fujikura Recent Developments
5.8 Microchip Technology
5.8.1 Microchip Technology Profile
5.8.2 Microchip Technology Main Business
5.8.3 Microchip Technology Embedded Die Packaging Technology Products, Services and Solutions
5.8.4 Microchip Technology Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.8.5 Microchip Technology Recent Developments
5.9 Infineon
5.9.1 Infineon Profile
5.9.2 Infineon Main Business
5.9.3 Infineon Embedded Die Packaging Technology Products, Services and Solutions
5.9.4 Infineon Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.9.5 Infineon Recent Developments
5.10 Toshiba Corporation
5.10.1 Toshiba Corporation Profile
5.10.2 Toshiba Corporation Main Business
5.10.3 Toshiba Corporation Embedded Die Packaging Technology Products, Services and Solutions
5.10.4 Toshiba Corporation Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.10.5 Toshiba Corporation Recent Developments
5.11 Fujitsu Limited
5.11.1 Fujitsu Limited Profile
5.11.2 Fujitsu Limited Main Business
5.11.3 Fujitsu Limited Embedded Die Packaging Technology Products, Services and Solutions
5.11.4 Fujitsu Limited Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.11.5 Fujitsu Limited Recent Developments
5.12 STMICROELECTRONICS
5.12.1 STMICROELECTRONICS Profile
5.12.2 STMICROELECTRONICS Main Business
5.12.3 STMICROELECTRONICS Embedded Die Packaging Technology Products, Services and Solutions
5.12.4 STMICROELECTRONICS Embedded Die Packaging Technology Revenue (US$ Million) & (2018-2023)
5.12.5 STMICROELECTRONICS Recent Developments
6 North America
6.1 North America Embedded Die Packaging Technology Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Embedded Die Packaging Technology Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Embedded Die Packaging Technology Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Embedded Die Packaging Technology Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Embedded Die Packaging Technology Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Embedded Die Packaging Technology Market Dynamics
11.1 Embedded Die Packaging Technology Industry Trends
11.2 Embedded Die Packaging Technology Market Drivers
11.3 Embedded Die Packaging Technology Market Challenges
11.4 Embedded Die Packaging Technology Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
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