The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Flip Chip Technologies-Global Market Insights and Sales Trends 2024
Synopsis
Flip chip is the technique for interconnecting semiconductor devices, such as IC chips, to external circuitry with solder bumps that have been dumped onto the chip pads.
The global Flip Chip Technologies market size is expected to reach US$ 17730 million by 2029, growing at a CAGR of 5.7% from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Technologies in various end use industries. The expanding demands from the Electronics, Industrial, Automotive &Transport and Healthcare, are propelling Flip Chip Technologies market. Copper Pillar, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Solder Bumping segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Technologies, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Technologies market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Technologies market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Technologies sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Technologies covered in this report include Samsung Electronics, ASE group, Powertech Technology, United Microelectronics Corporation, Intel Corporation, Amkor Technology, TSMC, Jiangsu Changjiang Electronics Technology and Texas Instruments, etc.
The global Flip Chip Technologies market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Samsung Electronics
ASE group
Powertech Technology
United Microelectronics Corporation
Intel Corporation
Amkor Technology
TSMC
Jiangsu Changjiang Electronics Technology
Texas Instruments
Siliconware Precision Industries
Global Flip Chip Technologies market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Technologies market, Segment by Type:
Copper Pillar
Solder Bumping
Tin-lead Eutectic Solder
Lead-free Solder
Gold Bumping
Other
Global Flip Chip Technologies market, by Application
Electronics
Industrial
Automotive &Transport
Healthcare
IT & Telecommunication
Aerospace and Defence
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Flip Chip Technologies companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Flip chip is the technique for interconnecting semiconductor devices, such as IC chips, to external circuitry with solder bumps that have been dumped onto the chip pads.
The global Flip Chip Technologies market size is expected to reach US$ 17730 million by 2029, growing at a CAGR of 5.7% from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Technologies in various end use industries. The expanding demands from the Electronics, Industrial, Automotive &Transport and Healthcare, are propelling Flip Chip Technologies market. Copper Pillar, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Solder Bumping segment is estimated at % CAGR for the next seven-year period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Objectives
This report provides market insight on the different segments, by players, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Technologies, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Technologies market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Technologies market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Technologies sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Technologies covered in this report include Samsung Electronics, ASE group, Powertech Technology, United Microelectronics Corporation, Intel Corporation, Amkor Technology, TSMC, Jiangsu Changjiang Electronics Technology and Texas Instruments, etc.
The global Flip Chip Technologies market report caters to various stakeholders in this industry including investors, suppliers, product players, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Samsung Electronics
ASE group
Powertech Technology
United Microelectronics Corporation
Intel Corporation
Amkor Technology
TSMC
Jiangsu Changjiang Electronics Technology
Texas Instruments
Siliconware Precision Industries
Global Flip Chip Technologies market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Technologies market, Segment by Type:
Copper Pillar
Solder Bumping
Tin-lead Eutectic Solder
Lead-free Solder
Gold Bumping
Other
Global Flip Chip Technologies market, by Application
Electronics
Industrial
Automotive &Transport
Healthcare
IT & Telecommunication
Aerospace and Defence
Other
Core Chapters
Chapter One: Introduces the report scope of the report, executive summary of global and regional market size and CAGR for the history and forecast period (2018-2023, 2024-2029). It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter Two: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter Three: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter Four: Detailed analysis of Flip Chip Technologies companies’ competitive landscape, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Five: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product introduction, revenue, recent development, etc.
Chapter Six, Seven, Eight, Nine and Ten: North America, Europe, Asia Pacific, Latin America, Middle East & Africa, revenue by country.
Chapter Eleven: this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Research Finding/Conclusion
Index1 Market Overview of Flip Chip Technologies
1.1 Flip Chip Technologies Market Overview
1.1.1 Flip Chip Technologies Product Scope
1.1.2 Flip Chip Technologies Market Status and Outlook
1.2 Global Flip Chip Technologies Market Size Overview by Region 2018 VS 2022 VS 2029
1.3 Global Flip Chip Technologies Market Size by Region (2018-2029)
1.4 Global Flip Chip Technologies Historic Market Size by Region (2018-2023)
1.5 Global Flip Chip Technologies Market Size Forecast by Region (2024-2029)
1.6 Key Regions, Flip Chip Technologies Market Size (2018-2029)
1.6.1 North America Flip Chip Technologies Market Size (2018-2029)
1.6.2 Europe Flip Chip Technologies Market Size (2018-2029)
1.6.3 Asia-Pacific Flip Chip Technologies Market Size (2018-2029)
1.6.4 Latin America Flip Chip Technologies Market Size (2018-2029)
1.6.5 Middle East & Africa Flip Chip Technologies Market Size (2018-2029)
2 Flip Chip Technologies Market by Type
2.1 Introduction
2.1.1 Copper Pillar
2.1.2 Solder Bumping
2.1.3 Tin-lead Eutectic Solder
2.1.4 Lead-free Solder
2.1.5 Gold Bumping
2.1.6 Other
2.2 Global Flip Chip Technologies Market Size by Type: 2018 VS 2022 VS 2029
2.2.1 Global Flip Chip Technologies Historic Market Size by Type (2018-2023)
2.2.2 Global Flip Chip Technologies Forecasted Market Size by Type (2024-2029)
2.3 Key Regions Market Size by Type
2.3.1 North America Flip Chip Technologies Revenue Breakdown by Type (2018-2029)
2.3.2 Europe Flip Chip Technologies Revenue Breakdown by Type (2018-2029)
2.3.3 Asia-Pacific Flip Chip Technologies Revenue Breakdown by Type (2018-2029)
2.3.4 Latin America Flip Chip Technologies Revenue Breakdown by Type (2018-2029)
2.3.5 Middle East and Africa Flip Chip Technologies Revenue Breakdown by Type (2018-2029)
3 Flip Chip Technologies Market Overview by Application
3.1 Introduction
3.1.1 Electronics
3.1.2 Industrial
3.1.3 Automotive &Transport
3.1.4 Healthcare
3.1.5 IT & Telecommunication
3.1.6 Aerospace and Defence
3.1.7 Other
3.2 Global Flip Chip Technologies Market Size by Application: 2018 VS 2022 VS 2029
3.2.1 Global Flip Chip Technologies Historic Market Size by Application (2018-2023)
3.2.2 Global Flip Chip Technologies Forecasted Market Size by Application (2024-2029)
3.3 Key Regions Market Size by Application
3.3.1 North America Flip Chip Technologies Revenue Breakdown by Application (2018-2029)
3.3.2 Europe Flip Chip Technologies Revenue Breakdown by Application (2018-2029)
3.3.3 Asia-Pacific Flip Chip Technologies Revenue Breakdown by Application (2018-2029)
3.3.4 Latin America Flip Chip Technologies Revenue Breakdown by Application (2018-2029)
3.3.5 Middle East and Africa Flip Chip Technologies Revenue Breakdown by Application (2018-2029)
4 Flip Chip Technologies Competition Analysis by Players
4.1 Global Flip Chip Technologies Market Size by Players (2018-2023)
4.2 Global Top Players by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Flip Chip Technologies as of 2022)
4.3 Date of Key Players Enter into Flip Chip Technologies Market
4.4 Global Top Players Flip Chip Technologies Headquarters and Area Served
4.5 Key Players Flip Chip Technologies Product Solution and Service
4.6 Competitive Status
4.6.1 Flip Chip Technologies Market Concentration Rate
4.6.2 Mergers & Acquisitions, Expansion Plans
5 Company (Top Players) Profiles
5.1 Samsung Electronics
5.1.1 Samsung Electronics Profile
5.1.2 Samsung Electronics Main Business
5.1.3 Samsung Electronics Flip Chip Technologies Products, Services and Solutions
5.1.4 Samsung Electronics Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.1.5 Samsung Electronics Recent Developments
5.2 ASE group
5.2.1 ASE group Profile
5.2.2 ASE group Main Business
5.2.3 ASE group Flip Chip Technologies Products, Services and Solutions
5.2.4 ASE group Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.2.5 ASE group Recent Developments
5.3 Powertech Technology
5.3.1 Powertech Technology Profile
5.3.2 Powertech Technology Main Business
5.3.3 Powertech Technology Flip Chip Technologies Products, Services and Solutions
5.3.4 Powertech Technology Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.3.5 United Microelectronics Corporation Recent Developments
5.4 United Microelectronics Corporation
5.4.1 United Microelectronics Corporation Profile
5.4.2 United Microelectronics Corporation Main Business
5.4.3 United Microelectronics Corporation Flip Chip Technologies Products, Services and Solutions
5.4.4 United Microelectronics Corporation Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.4.5 United Microelectronics Corporation Recent Developments
5.5 Intel Corporation
5.5.1 Intel Corporation Profile
5.5.2 Intel Corporation Main Business
5.5.3 Intel Corporation Flip Chip Technologies Products, Services and Solutions
5.5.4 Intel Corporation Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.5.5 Intel Corporation Recent Developments
5.6 Amkor Technology
5.6.1 Amkor Technology Profile
5.6.2 Amkor Technology Main Business
5.6.3 Amkor Technology Flip Chip Technologies Products, Services and Solutions
5.6.4 Amkor Technology Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.6.5 Amkor Technology Recent Developments
5.7 TSMC
5.7.1 TSMC Profile
5.7.2 TSMC Main Business
5.7.3 TSMC Flip Chip Technologies Products, Services and Solutions
5.7.4 TSMC Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.7.5 TSMC Recent Developments
5.8 Jiangsu Changjiang Electronics Technology
5.8.1 Jiangsu Changjiang Electronics Technology Profile
5.8.2 Jiangsu Changjiang Electronics Technology Main Business
5.8.3 Jiangsu Changjiang Electronics Technology Flip Chip Technologies Products, Services and Solutions
5.8.4 Jiangsu Changjiang Electronics Technology Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.8.5 Jiangsu Changjiang Electronics Technology Recent Developments
5.9 Texas Instruments
5.9.1 Texas Instruments Profile
5.9.2 Texas Instruments Main Business
5.9.3 Texas Instruments Flip Chip Technologies Products, Services and Solutions
5.9.4 Texas Instruments Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.9.5 Texas Instruments Recent Developments
5.10 Siliconware Precision Industries
5.10.1 Siliconware Precision Industries Profile
5.10.2 Siliconware Precision Industries Main Business
5.10.3 Siliconware Precision Industries Flip Chip Technologies Products, Services and Solutions
5.10.4 Siliconware Precision Industries Flip Chip Technologies Revenue (US$ Million) & (2018-2023)
5.10.5 Siliconware Precision Industries Recent Developments
6 North America
6.1 North America Flip Chip Technologies Market Size by Country (2018-2029)
6.2 U.S.
6.3 Canada
7 Europe
7.1 Europe Flip Chip Technologies Market Size by Country (2018-2029)
7.2 Germany
7.3 France
7.4 U.K.
7.5 Italy
7.6 Russia
7.7 Nordic Countries
7.8 Rest of Europe
8 Asia-Pacific
8.1 Asia-Pacific Flip Chip Technologies Market Size by Region (2018-2029)
8.2 China
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
8.6 India
8.7 Australia
8.8 Rest of Asia-Pacific
9 Latin America
9.1 Latin America Flip Chip Technologies Market Size by Country (2018-2029)
9.2 Mexico
9.3 Brazil
9.4 Rest of Latin America
10 Middle East & Africa
10.1 Middle East & Africa Flip Chip Technologies Market Size by Country (2018-2029)
10.2 Turkey
10.3 Saudi Arabia
10.4 UAE
10.5 Rest of Middle East & Africa
11 Flip Chip Technologies Market Dynamics
11.1 Flip Chip Technologies Industry Trends
11.2 Flip Chip Technologies Market Drivers
11.3 Flip Chip Technologies Market Challenges
11.4 Flip Chip Technologies Market Restraints
12 Research Finding /Conclusion
13 Methodology and Data Source
13.1 Methodology/Research Approach
13.1.1 Research Programs/Design
13.1.2 Market Size Estimation
13.1.3 Market Breakdown and Data Triangulation
13.2 Data Source
13.2.1 Secondary Sources
13.2.2 Primary Sources
13.3 Disclaimer
13.4 Author List
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest IT & Electronics Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
