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Global 2.5D and 3D TSV Market Research Report 2025
Synopsis
The global 2.5D and 3D TSV market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for 2.5D and 3D TSV is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for 2.5D and 3D TSV is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for 2.5D and 3D TSV in Mobile and Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of 2.5D and 3D TSV include Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology, TSMC, UMC and SK Hynix, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for 2.5D and 3D TSV, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D and 3D TSV.
Report Scope
The 2.5D and 3D TSV market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 2.5D and 3D TSV market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 2.5D and 3D TSV companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung
Intel
ASE Group
GlobalFoundries
Amkor Technology
Micron Technology
TSMC
UMC
SK Hynix
Shinko
Unimicron
Fujitsu Interconnect
Xperi
Segment by Type
2.5D TSV
3D TSV
Segment by Application
Mobile and Consumer Electronics
Communication Equipment
Automotive and Transportation Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 2.5D and 3D TSV companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
The global 2.5D and 3D TSV market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for 2.5D and 3D TSV is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for 2.5D and 3D TSV is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for 2.5D and 3D TSV in Mobile and Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of 2.5D and 3D TSV include Samsung, Intel, ASE Group, GlobalFoundries, Amkor Technology, Micron Technology, TSMC, UMC and SK Hynix, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for 2.5D and 3D TSV, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D and 3D TSV.
Report Scope
The 2.5D and 3D TSV market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 2.5D and 3D TSV market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 2.5D and 3D TSV companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Samsung
Intel
ASE Group
GlobalFoundries
Amkor Technology
Micron Technology
TSMC
UMC
SK Hynix
Shinko
Unimicron
Fujitsu Interconnect
Xperi
Segment by Type
2.5D TSV
3D TSV
Segment by Application
Mobile and Consumer Electronics
Communication Equipment
Automotive and Transportation Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 2.5D and 3D TSV companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 2.5D and 3D TSV Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 2.5D TSV
1.2.3 3D TSV
1.3 Market by Application
1.3.1 Global 2.5D and 3D TSV Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Mobile and Consumer Electronics
1.3.3 Communication Equipment
1.3.4 Automotive and Transportation Electronics
1.3.5 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 2.5D and 3D TSV Market Perspective (2019-2030)
2.2 2.5D and 3D TSV Growth Trends by Region
2.2.1 Global 2.5D and 3D TSV Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 2.5D and 3D TSV Historic Market Size by Region (2019-2024)
2.2.3 2.5D and 3D TSV Forecasted Market Size by Region (2025-2030)
2.3 2.5D and 3D TSV Market Dynamics
2.3.1 2.5D and 3D TSV Industry Trends
2.3.2 2.5D and 3D TSV Market Drivers
2.3.3 2.5D and 3D TSV Market Challenges
2.3.4 2.5D and 3D TSV Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top 2.5D and 3D TSV Players by Revenue
3.1.1 Global Top 2.5D and 3D TSV Players by Revenue (2019-2024)
3.1.2 Global 2.5D and 3D TSV Revenue Market Share by Players (2019-2024)
3.2 Global 2.5D and 3D TSV Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 2.5D and 3D TSV Revenue
3.4 Global 2.5D and 3D TSV Market Concentration Ratio
3.4.1 Global 2.5D and 3D TSV Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 2.5D and 3D TSV Revenue in 2023
3.5 2.5D and 3D TSV Key Players Head office and Area Served
3.6 Key Players 2.5D and 3D TSV Product Solution and Service
3.7 Date of Enter into 2.5D and 3D TSV Market
3.8 Mergers & Acquisitions, Expansion Plans
4 2.5D and 3D TSV Breakdown Data by Type
4.1 Global 2.5D and 3D TSV Historic Market Size by Type (2019-2024)
4.2 Global 2.5D and 3D TSV Forecasted Market Size by Type (2025-2030)
5 2.5D and 3D TSV Breakdown Data by Application
5.1 Global 2.5D and 3D TSV Historic Market Size by Application (2019-2024)
5.2 Global 2.5D and 3D TSV Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America 2.5D and 3D TSV Market Size (2019-2030)
6.2 North America 2.5D and 3D TSV Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America 2.5D and 3D TSV Market Size by Country (2019-2024)
6.4 North America 2.5D and 3D TSV Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 2.5D and 3D TSV Market Size (2019-2030)
7.2 Europe 2.5D and 3D TSV Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe 2.5D and 3D TSV Market Size by Country (2019-2024)
7.4 Europe 2.5D and 3D TSV Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 2.5D and 3D TSV Market Size (2019-2030)
8.2 Asia-Pacific 2.5D and 3D TSV Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific 2.5D and 3D TSV Market Size by Region (2019-2024)
8.4 Asia-Pacific 2.5D and 3D TSV Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 2.5D and 3D TSV Market Size (2019-2030)
9.2 Latin America 2.5D and 3D TSV Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America 2.5D and 3D TSV Market Size by Country (2019-2024)
9.4 Latin America 2.5D and 3D TSV Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 2.5D and 3D TSV Market Size (2019-2030)
10.2 Middle East & Africa 2.5D and 3D TSV Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa 2.5D and 3D TSV Market Size by Country (2019-2024)
10.4 Middle East & Africa 2.5D and 3D TSV Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Samsung
11.1.1 Samsung Company Detail
11.1.2 Samsung Business Overview
11.1.3 Samsung 2.5D and 3D TSV Introduction
11.1.4 Samsung Revenue in 2.5D and 3D TSV Business (2019-2024)
11.1.5 Samsung Recent Development
11.2 Intel
11.2.1 Intel Company Detail
11.2.2 Intel Business Overview
11.2.3 Intel 2.5D and 3D TSV Introduction
11.2.4 Intel Revenue in 2.5D and 3D TSV Business (2019-2024)
11.2.5 Intel Recent Development
11.3 ASE Group
11.3.1 ASE Group Company Detail
11.3.2 ASE Group Business Overview
11.3.3 ASE Group 2.5D and 3D TSV Introduction
11.3.4 ASE Group Revenue in 2.5D and 3D TSV Business (2019-2024)
11.3.5 ASE Group Recent Development
11.4 GlobalFoundries
11.4.1 GlobalFoundries Company Detail
11.4.2 GlobalFoundries Business Overview
11.4.3 GlobalFoundries 2.5D and 3D TSV Introduction
11.4.4 GlobalFoundries Revenue in 2.5D and 3D TSV Business (2019-2024)
11.4.5 GlobalFoundries Recent Development
11.5 Amkor Technology
11.5.1 Amkor Technology Company Detail
11.5.2 Amkor Technology Business Overview
11.5.3 Amkor Technology 2.5D and 3D TSV Introduction
11.5.4 Amkor Technology Revenue in 2.5D and 3D TSV Business (2019-2024)
11.5.5 Amkor Technology Recent Development
11.6 Micron Technology
11.6.1 Micron Technology Company Detail
11.6.2 Micron Technology Business Overview
11.6.3 Micron Technology 2.5D and 3D TSV Introduction
11.6.4 Micron Technology Revenue in 2.5D and 3D TSV Business (2019-2024)
11.6.5 Micron Technology Recent Development
11.7 TSMC
11.7.1 TSMC Company Detail
11.7.2 TSMC Business Overview
11.7.3 TSMC 2.5D and 3D TSV Introduction
11.7.4 TSMC Revenue in 2.5D and 3D TSV Business (2019-2024)
11.7.5 TSMC Recent Development
11.8 UMC
11.8.1 UMC Company Detail
11.8.2 UMC Business Overview
11.8.3 UMC 2.5D and 3D TSV Introduction
11.8.4 UMC Revenue in 2.5D and 3D TSV Business (2019-2024)
11.8.5 UMC Recent Development
11.9 SK Hynix
11.9.1 SK Hynix Company Detail
11.9.2 SK Hynix Business Overview
11.9.3 SK Hynix 2.5D and 3D TSV Introduction
11.9.4 SK Hynix Revenue in 2.5D and 3D TSV Business (2019-2024)
11.9.5 SK Hynix Recent Development
11.10 Shinko
11.10.1 Shinko Company Detail
11.10.2 Shinko Business Overview
11.10.3 Shinko 2.5D and 3D TSV Introduction
11.10.4 Shinko Revenue in 2.5D and 3D TSV Business (2019-2024)
11.10.5 Shinko Recent Development
11.11 Unimicron
11.11.1 Unimicron Company Detail
11.11.2 Unimicron Business Overview
11.11.3 Unimicron 2.5D and 3D TSV Introduction
11.11.4 Unimicron Revenue in 2.5D and 3D TSV Business (2019-2024)
11.11.5 Unimicron Recent Development
11.12 Fujitsu Interconnect
11.12.1 Fujitsu Interconnect Company Detail
11.12.2 Fujitsu Interconnect Business Overview
11.12.3 Fujitsu Interconnect 2.5D and 3D TSV Introduction
11.12.4 Fujitsu Interconnect Revenue in 2.5D and 3D TSV Business (2019-2024)
11.12.5 Fujitsu Interconnect Recent Development
11.13 Xperi
11.13.1 Xperi Company Detail
11.13.2 Xperi Business Overview
11.13.3 Xperi 2.5D and 3D TSV Introduction
11.13.4 Xperi Revenue in 2.5D and 3D TSV Business (2019-2024)
11.13.5 Xperi Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
List of TablesList of Tables
Table 1. Global 2.5D and 3D TSV Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
Table 2. Key Players of 2.5D TSV
Table 3. Key Players of 3D TSV
Table 4. Global 2.5D and 3D TSV Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
Table 5. Global 2.5D and 3D TSV Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 6. Global 2.5D and 3D TSV Market Size by Region (2019-2024) & (US$ Million)
Table 7. Global 2.5D and 3D TSV Market Share by Region (2019-2024)
Table 8. Global 2.5D and 3D TSV Forecasted Market Size by Region (2025-2030) & (US$ Million)
Table 9. Global 2.5D and 3D TSV Market Share by Region (2025-2030)
Table 10. 2.5D and 3D TSV Market Trends
Table 11. 2.5D and 3D TSV Market Drivers
Table 12. 2.5D and 3D TSV Market Challenges
Table 13. 2.5D and 3D TSV Market Restraints
Table 14. Global 2.5D and 3D TSV Revenue by Players (2019-2024) & (US$ Million)
Table 15. Global 2.5D and 3D TSV Market Share by Players (2019-2024)
Table 16. Global Top 2.5D and 3D TSV Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 2.5D and 3D TSV as of 2023)
Table 17. Ranking of Global Top 2.5D and 3D TSV Companies by Revenue (US$ Million) in 2023
Table 18. Global 5 Largest Players Market Share by 2.5D and 3D TSV Revenue (CR5 and HHI) & (2019-2024)
Table 19. Key Players Headquarters and Area Served
Table 20. Key Players 2.5D and 3D TSV Product Solution and Service
Table 21. Date of Enter into 2.5D and 3D TSV Market
Table 22. Mergers & Acquisitions, Expansion Plans
Table 23. Global 2.5D and 3D TSV Market Size by Type (2019-2024) & (US$ Million)
Table 24. Global 2.5D and 3D TSV Revenue Market Share by Type (2019-2024)
Table 25. Global 2.5D and 3D TSV Forecasted Market Size by Type (2025-2030) & (US$ Million)
Table 26. Global 2.5D and 3D TSV Revenue Market Share by Type (2025-2030)
Table 27. Global 2.5D and 3D TSV Market Size by Application (2019-2024) & (US$ Million)
Table 28. Global 2.5D and 3D TSV Revenue Market Share by Application (2019-2024)
Table 29. Global 2.5D and 3D TSV Forecasted Market Size by Application (2025-2030) & (US$ Million)
Table 30. Global 2.5D and 3D TSV Revenue Market Share by Application (2025-2030)
Table 31. North America 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 32. North America 2.5D and 3D TSV Market Size by Country (2019-2024) & (US$ Million)
Table 33. North America 2.5D and 3D TSV Market Size by Country (2025-2030) & (US$ Million)
Table 34. Europe 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 35. Europe 2.5D and 3D TSV Market Size by Country (2019-2024) & (US$ Million)
Table 36. Europe 2.5D and 3D TSV Market Size by Country (2025-2030) & (US$ Million)
Table 37. Asia-Pacific 2.5D and 3D TSV Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
Table 38. Asia-Pacific 2.5D and 3D TSV Market Size by Region (2019-2024) & (US$ Million)
Table 39. Asia-Pacific 2.5D and 3D TSV Market Size by Region (2025-2030) & (US$ Million)
Table 40. Latin America 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 41. Latin America 2.5D and 3D TSV Market Size by Country (2019-2024) & (US$ Million)
Table 42. Latin America 2.5D and 3D TSV Market Size by Country (2025-2030) & (US$ Million)
Table 43. Middle East & Africa 2.5D and 3D TSV Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 44. Middle East & Africa 2.5D and 3D TSV Market Size by Country (2019-2024) & (US$ Million)
Table 45. Middle East & Africa 2.5D and 3D TSV Market Size by Country (2025-2030) & (US$ Million)
Table 46. Samsung Company Detail
Table 47. Samsung Business Overview
Table 48. Samsung 2.5D and 3D TSV Product
Table 49. Samsung Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 50. Samsung Recent Development
Table 51. Intel Company Detail
Table 52. Intel Business Overview
Table 53. Intel 2.5D and 3D TSV Product
Table 54. Intel Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 55. Intel Recent Development
Table 56. ASE Group Company Detail
Table 57. ASE Group Business Overview
Table 58. ASE Group 2.5D and 3D TSV Product
Table 59. ASE Group Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 60. ASE Group Recent Development
Table 61. GlobalFoundries Company Detail
Table 62. GlobalFoundries Business Overview
Table 63. GlobalFoundries 2.5D and 3D TSV Product
Table 64. GlobalFoundries Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 65. GlobalFoundries Recent Development
Table 66. Amkor Technology Company Detail
Table 67. Amkor Technology Business Overview
Table 68. Amkor Technology 2.5D and 3D TSV Product
Table 69. Amkor Technology Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 70. Amkor Technology Recent Development
Table 71. Micron Technology Company Detail
Table 72. Micron Technology Business Overview
Table 73. Micron Technology 2.5D and 3D TSV Product
Table 74. Micron Technology Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 75. Micron Technology Recent Development
Table 76. TSMC Company Detail
Table 77. TSMC Business Overview
Table 78. TSMC 2.5D and 3D TSV Product
Table 79. TSMC Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 80. TSMC Recent Development
Table 81. UMC Company Detail
Table 82. UMC Business Overview
Table 83. UMC 2.5D and 3D TSV Product
Table 84. UMC Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 85. UMC Recent Development
Table 86. SK Hynix Company Detail
Table 87. SK Hynix Business Overview
Table 88. SK Hynix 2.5D and 3D TSV Product
Table 89. SK Hynix Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 90. SK Hynix Recent Development
Table 91. Shinko Company Detail
Table 92. Shinko Business Overview
Table 93. Shinko 2.5D and 3D TSV Product
Table 94. Shinko Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 95. Shinko Recent Development
Table 96. Unimicron Company Detail
Table 97. Unimicron Business Overview
Table 98. Unimicron 2.5D and 3D TSV Product
Table 99. Unimicron Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 100. Unimicron Recent Development
Table 101. Fujitsu Interconnect Company Detail
Table 102. Fujitsu Interconnect Business Overview
Table 103. Fujitsu Interconnect 2.5D and 3D TSV Product
Table 104. Fujitsu Interconnect Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 105. Fujitsu Interconnect Recent Development
Table 106. Xperi Company Detail
Table 107. Xperi Business Overview
Table 108. Xperi 2.5D and 3D TSV Product
Table 109. Xperi Revenue in 2.5D and 3D TSV Business (2019-2024) & (US$ Million)
Table 110. Xperi Recent Development
Table 111. Research Programs/Design for This Report
Table 112. Key Data Information from Secondary Sources
Table 113. Key Data Information from Primary Sources
List of Figures
Figure 1. Global 2.5D and 3D TSV Market Size Comparison by Type (2024-2030) & (US$ Million)
Figure 2. Global 2.5D and 3D TSV Market Share by Type: 2023 VS 2030
Figure 3. 2.5D TSV Features
Figure 4. 3D TSV Features
Figure 5. Global 2.5D and 3D TSV Market Size Comparison by Application (2024-2030) & (US$ Million)
Figure 6. Global 2.5D and 3D TSV Market Share by Application: 2023 VS 2030
Figure 7. Mobile and Consumer Electronics Case Studies
Figure 8. Communication Equipment Case Studies
Figure 9. Automotive and Transportation Electronics Case Studies
Figure 10. Other Case Studies
Figure 11. 2.5D and 3D TSV Report Years Considered
Figure 12. Global 2.5D and 3D TSV Market Size (US$ Million), Year-over-Year: 2019-2030
Figure 13. Global 2.5D and 3D TSV Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 14. Global 2.5D and 3D TSV Market Share by Region: 2023 VS 2030
Figure 15. Global 2.5D and 3D TSV Market Share by Players in 2023
Figure 16. Global Top 2.5D and 3D TSV Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 2.5D and 3D TSV as of 2023)
Figure 17. The Top 10 and 5 Players Market Share by 2.5D and 3D TSV Revenue in 2023
Figure 18. North America 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 19. North America 2.5D and 3D TSV Market Share by Country (2019-2030)
Figure 20. United States 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 21. Canada 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 22. Europe 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 23. Europe 2.5D and 3D TSV Market Share by Country (2019-2030)
Figure 24. Germany 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 25. France 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 26. U.K. 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 27. Italy 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 28. Russia 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 29. Nordic Countries 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 30. Asia-Pacific 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 31. Asia-Pacific 2.5D and 3D TSV Market Share by Region (2019-2030)
Figure 32. China 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 33. Japan 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 34. South Korea 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 35. Southeast Asia 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 36. India 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 37. Australia 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 38. Latin America 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 39. Latin America 2.5D and 3D TSV Market Share by Country (2019-2030)
Figure 40. Mexico 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 41. Brazil 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 42. Middle East & Africa 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 43. Middle East & Africa 2.5D and 3D TSV Market Share by Country (2019-2030)
Figure 44. Turkey 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 45. Saudi Arabia 2.5D and 3D TSV Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 46. Samsung Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 47. Intel Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 48. ASE Group Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 49. GlobalFoundries Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 50. Amkor Technology Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 51. Micron Technology Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 52. TSMC Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 53. UMC Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 54. SK Hynix Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 55. Shinko Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 56. Unimicron Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 57. Fujitsu Interconnect Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 58. Xperi Revenue Growth Rate in 2.5D and 3D TSV Business (2019-2024)
Figure 59. Bottom-up and Top-down Approaches for This Report
Figure 60. Data Triangulation
Figure 61. Key Executives Interviewed
Published By : QY Research
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