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Global 3D IC & 2.5D IC Packaging Market Research Report 2024
Synopsis
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The global 3D IC & 2.5D IC Packaging market was valued at US$ 6954 million in 2023 and is anticipated to reach US$ 20620 million by 2030, witnessing a CAGR of 16.8% during the forecast period 2024-2030.
The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
This report aims to provide a comprehensive presentation of the global market for 3D IC & 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC & 2.5D IC Packaging.
Report Scope
The 3D IC & 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D IC & 2.5D IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC & 2.5D IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering
JCET
TongFu Microelectronics
Segment by Type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Segment by Application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 3D IC & 2.5D IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 3D IC & 2.5D IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 3D IC & 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components using through-silicon vias (TSVs),while a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The global 3D IC & 2.5D IC Packaging market was valued at US$ 6954 million in 2023 and is anticipated to reach US$ 20620 million by 2030, witnessing a CAGR of 16.8% during the forecast period 2024-2030.
The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
This report aims to provide a comprehensive presentation of the global market for 3D IC & 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC & 2.5D IC Packaging.
Report Scope
The 3D IC & 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D IC & 2.5D IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC & 2.5D IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Intel Corporation
Toshiba Corp
Samsung Electronics
Stmicroelectronics
Taiwan Semiconductor Manufacturing
Amkor Technology
United Microelectronics
Broadcom
ASE Group
Pure Storage
Advanced Semiconductor Engineering
JCET
TongFu Microelectronics
Segment by Type
3D TSV
2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
Segment by Application
Automotive
Consumer electronics
Medical devices
Military & aerospace
Telecommunication
Industrial sector and smart technologies
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 3D IC & 2.5D IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 3D IC & 2.5D IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 3D IC & 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 3D IC & 2.5D IC Packaging Market Overview
1.1 Product Definition
1.2 3D IC & 2.5D IC Packaging Segment by Type
1.2.1 Global 3D IC & 2.5D IC Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 3D TSV
1.2.3 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)
1.3 3D IC & 2.5D IC Packaging Segment by Application
1.3.1 Global 3D IC & 2.5D IC Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Automotive
1.3.3 Consumer electronics
1.3.4 Medical devices
1.3.5 Military & aerospace
1.3.6 Telecommunication
1.3.7 Industrial sector and smart technologies
1.4 Global Market Growth Prospects
1.4.1 Global 3D IC & 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global 3D IC & 2.5D IC Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global 3D IC & 2.5D IC Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global 3D IC & 2.5D IC Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global 3D IC & 2.5D IC Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global 3D IC & 2.5D IC Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of 3D IC & 2.5D IC Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global 3D IC & 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global 3D IC & 2.5D IC Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of 3D IC & 2.5D IC Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of 3D IC & 2.5D IC Packaging, Product Offered and Application
2.8 Global Key Manufacturers of 3D IC & 2.5D IC Packaging, Date of Enter into This Industry
2.9 3D IC & 2.5D IC Packaging Market Competitive Situation and Trends
2.9.1 3D IC & 2.5D IC Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest 3D IC & 2.5D IC Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 3D IC & 2.5D IC Packaging Production by Region
3.1 Global 3D IC & 2.5D IC Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global 3D IC & 2.5D IC Packaging Production Value by Region (2019-2030)
3.2.1 Global 3D IC & 2.5D IC Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of 3D IC & 2.5D IC Packaging by Region (2025-2030)
3.3 Global 3D IC & 2.5D IC Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global 3D IC & 2.5D IC Packaging Production by Region (2019-2030)
3.4.1 Global 3D IC & 2.5D IC Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of 3D IC & 2.5D IC Packaging by Region (2025-2030)
3.5 Global 3D IC & 2.5D IC Packaging Market Price Analysis by Region (2019-2024)
3.6 Global 3D IC & 2.5D IC Packaging Production and Value, Year-over-Year Growth
3.6.1 North America 3D IC & 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe 3D IC & 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China 3D IC & 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan 3D IC & 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea 3D IC & 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
4 3D IC & 2.5D IC Packaging Consumption by Region
4.1 Global 3D IC & 2.5D IC Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global 3D IC & 2.5D IC Packaging Consumption by Region (2019-2030)
4.2.1 Global 3D IC & 2.5D IC Packaging Consumption by Region (2019-2024)
4.2.2 Global 3D IC & 2.5D IC Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America 3D IC & 2.5D IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America 3D IC & 2.5D IC Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe 3D IC & 2.5D IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe 3D IC & 2.5D IC Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific 3D IC & 2.5D IC Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific 3D IC & 2.5D IC Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa 3D IC & 2.5D IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa 3D IC & 2.5D IC Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global 3D IC & 2.5D IC Packaging Production by Type (2019-2030)
5.1.1 Global 3D IC & 2.5D IC Packaging Production by Type (2019-2024)
5.1.2 Global 3D IC & 2.5D IC Packaging Production by Type (2025-2030)
5.1.3 Global 3D IC & 2.5D IC Packaging Production Market Share by Type (2019-2030)
5.2 Global 3D IC & 2.5D IC Packaging Production Value by Type (2019-2030)
5.2.1 Global 3D IC & 2.5D IC Packaging Production Value by Type (2019-2024)
5.2.2 Global 3D IC & 2.5D IC Packaging Production Value by Type (2025-2030)
5.2.3 Global 3D IC & 2.5D IC Packaging Production Value Market Share by Type (2019-2030)
5.3 Global 3D IC & 2.5D IC Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global 3D IC & 2.5D IC Packaging Production by Application (2019-2030)
6.1.1 Global 3D IC & 2.5D IC Packaging Production by Application (2019-2024)
6.1.2 Global 3D IC & 2.5D IC Packaging Production by Application (2025-2030)
6.1.3 Global 3D IC & 2.5D IC Packaging Production Market Share by Application (2019-2030)
6.2 Global 3D IC & 2.5D IC Packaging Production Value by Application (2019-2030)
6.2.1 Global 3D IC & 2.5D IC Packaging Production Value by Application (2019-2024)
6.2.2 Global 3D IC & 2.5D IC Packaging Production Value by Application (2025-2030)
6.2.3 Global 3D IC & 2.5D IC Packaging Production Value Market Share by Application (2019-2030)
6.3 Global 3D IC & 2.5D IC Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Intel Corporation
7.1.1 Intel Corporation 3D IC & 2.5D IC Packaging Corporation Information
7.1.2 Intel Corporation 3D IC & 2.5D IC Packaging Product Portfolio
7.1.3 Intel Corporation 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Intel Corporation Main Business and Markets Served
7.1.5 Intel Corporation Recent Developments/Updates
7.2 Toshiba Corp
7.2.1 Toshiba Corp 3D IC & 2.5D IC Packaging Corporation Information
7.2.2 Toshiba Corp 3D IC & 2.5D IC Packaging Product Portfolio
7.2.3 Toshiba Corp 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Toshiba Corp Main Business and Markets Served
7.2.5 Toshiba Corp Recent Developments/Updates
7.3 Samsung Electronics
7.3.1 Samsung Electronics 3D IC & 2.5D IC Packaging Corporation Information
7.3.2 Samsung Electronics 3D IC & 2.5D IC Packaging Product Portfolio
7.3.3 Samsung Electronics 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Samsung Electronics Main Business and Markets Served
7.3.5 Samsung Electronics Recent Developments/Updates
7.4 Stmicroelectronics
7.4.1 Stmicroelectronics 3D IC & 2.5D IC Packaging Corporation Information
7.4.2 Stmicroelectronics 3D IC & 2.5D IC Packaging Product Portfolio
7.4.3 Stmicroelectronics 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Stmicroelectronics Main Business and Markets Served
7.4.5 Stmicroelectronics Recent Developments/Updates
7.5 Taiwan Semiconductor Manufacturing
7.5.1 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Corporation Information
7.5.2 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Product Portfolio
7.5.3 Taiwan Semiconductor Manufacturing 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Taiwan Semiconductor Manufacturing Main Business and Markets Served
7.5.5 Taiwan Semiconductor Manufacturing Recent Developments/Updates
7.6 Amkor Technology
7.6.1 Amkor Technology 3D IC & 2.5D IC Packaging Corporation Information
7.6.2 Amkor Technology 3D IC & 2.5D IC Packaging Product Portfolio
7.6.3 Amkor Technology 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Amkor Technology Main Business and Markets Served
7.6.5 Amkor Technology Recent Developments/Updates
7.7 United Microelectronics
7.7.1 United Microelectronics 3D IC & 2.5D IC Packaging Corporation Information
7.7.2 United Microelectronics 3D IC & 2.5D IC Packaging Product Portfolio
7.7.3 United Microelectronics 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.7.4 United Microelectronics Main Business and Markets Served
7.7.5 United Microelectronics Recent Developments/Updates
7.8 Broadcom
7.8.1 Broadcom 3D IC & 2.5D IC Packaging Corporation Information
7.8.2 Broadcom 3D IC & 2.5D IC Packaging Product Portfolio
7.8.3 Broadcom 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Broadcom Main Business and Markets Served
7.7.5 Broadcom Recent Developments/Updates
7.9 ASE Group
7.9.1 ASE Group 3D IC & 2.5D IC Packaging Corporation Information
7.9.2 ASE Group 3D IC & 2.5D IC Packaging Product Portfolio
7.9.3 ASE Group 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.9.4 ASE Group Main Business and Markets Served
7.9.5 ASE Group Recent Developments/Updates
7.10 Pure Storage
7.10.1 Pure Storage 3D IC & 2.5D IC Packaging Corporation Information
7.10.2 Pure Storage 3D IC & 2.5D IC Packaging Product Portfolio
7.10.3 Pure Storage 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Pure Storage Main Business and Markets Served
7.10.5 Pure Storage Recent Developments/Updates
7.11 Advanced Semiconductor Engineering
7.11.1 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Corporation Information
7.11.2 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Product Portfolio
7.11.3 Advanced Semiconductor Engineering 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Advanced Semiconductor Engineering Main Business and Markets Served
7.11.5 Advanced Semiconductor Engineering Recent Developments/Updates
7.12 JCET
7.12.1 JCET 3D IC & 2.5D IC Packaging Corporation Information
7.12.2 JCET 3D IC & 2.5D IC Packaging Product Portfolio
7.12.3 JCET 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.12.4 JCET Main Business and Markets Served
7.12.5 JCET Recent Developments/Updates
7.13 TongFu Microelectronics
7.13.1 TongFu Microelectronics 3D IC & 2.5D IC Packaging Corporation Information
7.13.2 TongFu Microelectronics 3D IC & 2.5D IC Packaging Product Portfolio
7.13.3 TongFu Microelectronics 3D IC & 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.13.4 TongFu Microelectronics Main Business and Markets Served
7.13.5 TongFu Microelectronics Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 3D IC & 2.5D IC Packaging Industry Chain Analysis
8.2 3D IC & 2.5D IC Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 3D IC & 2.5D IC Packaging Production Mode & Process
8.4 3D IC & 2.5D IC Packaging Sales and Marketing
8.4.1 3D IC & 2.5D IC Packaging Sales Channels
8.4.2 3D IC & 2.5D IC Packaging Distributors
8.5 3D IC & 2.5D IC Packaging Customers
9 3D IC & 2.5D IC Packaging Market Dynamics
9.1 3D IC & 2.5D IC Packaging Industry Trends
9.2 3D IC & 2.5D IC Packaging Market Drivers
9.3 3D IC & 2.5D IC Packaging Market Challenges
9.4 3D IC & 2.5D IC Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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