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Global 3D IC and 2.5D IC Market Research Report 2024
Synopsis
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The global 3D IC and 2.5D IC market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC.
Report Scope
The 3D IC and 2.5D IC market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D IC and 2.5D IC market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC and 2.5D IC companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TSMC(Taiwan)
Samsung(South Korea)
Toshiba(Japan)
ASE Group(Taiwan)
Amkor(U.S.)
UMC(Taiwan)
Stmicroelectronics(Switzerland)
Broadcom(U.S.)
Intel(U.S.)
Jiangsu Changjiang Electronics(China)
Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Segment by Application
Consumer Electronics
Telecommunication
Industry Sector
Automotive
Military and Aerospace
Smart Technologies
Medical Devices
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D IC and 2.5D IC companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
The global 3D IC and 2.5D IC market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC.
Report Scope
The 3D IC and 2.5D IC market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D IC and 2.5D IC market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC and 2.5D IC companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
TSMC(Taiwan)
Samsung(South Korea)
Toshiba(Japan)
ASE Group(Taiwan)
Amkor(U.S.)
UMC(Taiwan)
Stmicroelectronics(Switzerland)
Broadcom(U.S.)
Intel(U.S.)
Jiangsu Changjiang Electronics(China)
Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Segment by Application
Consumer Electronics
Telecommunication
Industry Sector
Automotive
Military and Aerospace
Smart Technologies
Medical Devices
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D IC and 2.5D IC companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 3D IC and 2.5D IC Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 3D Wafer-level Chip-scale Packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 Market by Application
1.3.1 Global 3D IC and 2.5D IC Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Telecommunication
1.3.4 Industry Sector
1.3.5 Automotive
1.3.6 Military and Aerospace
1.3.7 Smart Technologies
1.3.8 Medical Devices
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 3D IC and 2.5D IC Market Perspective (2019-2030)
2.2 3D IC and 2.5D IC Growth Trends by Region
2.2.1 Global 3D IC and 2.5D IC Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 3D IC and 2.5D IC Historic Market Size by Region (2019-2024)
2.2.3 3D IC and 2.5D IC Forecasted Market Size by Region (2025-2030)
2.3 3D IC and 2.5D IC Market Dynamics
2.3.1 3D IC and 2.5D IC Industry Trends
2.3.2 3D IC and 2.5D IC Market Drivers
2.3.3 3D IC and 2.5D IC Market Challenges
2.3.4 3D IC and 2.5D IC Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top 3D IC and 2.5D IC Players by Revenue
3.1.1 Global Top 3D IC and 2.5D IC Players by Revenue (2019-2024)
3.1.2 Global 3D IC and 2.5D IC Revenue Market Share by Players (2019-2024)
3.2 Global 3D IC and 2.5D IC Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 3D IC and 2.5D IC Revenue
3.4 Global 3D IC and 2.5D IC Market Concentration Ratio
3.4.1 Global 3D IC and 2.5D IC Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 3D IC and 2.5D IC Revenue in 2023
3.5 3D IC and 2.5D IC Key Players Head office and Area Served
3.6 Key Players 3D IC and 2.5D IC Product Solution and Service
3.7 Date of Enter into 3D IC and 2.5D IC Market
3.8 Mergers & Acquisitions, Expansion Plans
4 3D IC and 2.5D IC Breakdown Data by Type
4.1 Global 3D IC and 2.5D IC Historic Market Size by Type (2019-2024)
4.2 Global 3D IC and 2.5D IC Forecasted Market Size by Type (2025-2030)
5 3D IC and 2.5D IC Breakdown Data by Application
5.1 Global 3D IC and 2.5D IC Historic Market Size by Application (2019-2024)
5.2 Global 3D IC and 2.5D IC Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America 3D IC and 2.5D IC Market Size (2019-2030)
6.2 North America 3D IC and 2.5D IC Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America 3D IC and 2.5D IC Market Size by Country (2019-2024)
6.4 North America 3D IC and 2.5D IC Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 3D IC and 2.5D IC Market Size (2019-2030)
7.2 Europe 3D IC and 2.5D IC Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe 3D IC and 2.5D IC Market Size by Country (2019-2024)
7.4 Europe 3D IC and 2.5D IC Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 3D IC and 2.5D IC Market Size (2019-2030)
8.2 Asia-Pacific 3D IC and 2.5D IC Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific 3D IC and 2.5D IC Market Size by Region (2019-2024)
8.4 Asia-Pacific 3D IC and 2.5D IC Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 3D IC and 2.5D IC Market Size (2019-2030)
9.2 Latin America 3D IC and 2.5D IC Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America 3D IC and 2.5D IC Market Size by Country (2019-2024)
9.4 Latin America 3D IC and 2.5D IC Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 3D IC and 2.5D IC Market Size (2019-2030)
10.2 Middle East & Africa 3D IC and 2.5D IC Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa 3D IC and 2.5D IC Market Size by Country (2019-2024)
10.4 Middle East & Africa 3D IC and 2.5D IC Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 TSMC(Taiwan)
11.1.1 TSMC(Taiwan) Company Detail
11.1.2 TSMC(Taiwan) Business Overview
11.1.3 TSMC(Taiwan) 3D IC and 2.5D IC Introduction
11.1.4 TSMC(Taiwan) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.1.5 TSMC(Taiwan) Recent Development
11.2 Samsung(South Korea)
11.2.1 Samsung(South Korea) Company Detail
11.2.2 Samsung(South Korea) Business Overview
11.2.3 Samsung(South Korea) 3D IC and 2.5D IC Introduction
11.2.4 Samsung(South Korea) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.2.5 Samsung(South Korea) Recent Development
11.3 Toshiba(Japan)
11.3.1 Toshiba(Japan) Company Detail
11.3.2 Toshiba(Japan) Business Overview
11.3.3 Toshiba(Japan) 3D IC and 2.5D IC Introduction
11.3.4 Toshiba(Japan) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.3.5 Toshiba(Japan) Recent Development
11.4 ASE Group(Taiwan)
11.4.1 ASE Group(Taiwan) Company Detail
11.4.2 ASE Group(Taiwan) Business Overview
11.4.3 ASE Group(Taiwan) 3D IC and 2.5D IC Introduction
11.4.4 ASE Group(Taiwan) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.4.5 ASE Group(Taiwan) Recent Development
11.5 Amkor(U.S.)
11.5.1 Amkor(U.S.) Company Detail
11.5.2 Amkor(U.S.) Business Overview
11.5.3 Amkor(U.S.) 3D IC and 2.5D IC Introduction
11.5.4 Amkor(U.S.) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.5.5 Amkor(U.S.) Recent Development
11.6 UMC(Taiwan)
11.6.1 UMC(Taiwan) Company Detail
11.6.2 UMC(Taiwan) Business Overview
11.6.3 UMC(Taiwan) 3D IC and 2.5D IC Introduction
11.6.4 UMC(Taiwan) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.6.5 UMC(Taiwan) Recent Development
11.7 Stmicroelectronics(Switzerland)
11.7.1 Stmicroelectronics(Switzerland) Company Detail
11.7.2 Stmicroelectronics(Switzerland) Business Overview
11.7.3 Stmicroelectronics(Switzerland) 3D IC and 2.5D IC Introduction
11.7.4 Stmicroelectronics(Switzerland) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.7.5 Stmicroelectronics(Switzerland) Recent Development
11.8 Broadcom(U.S.)
11.8.1 Broadcom(U.S.) Company Detail
11.8.2 Broadcom(U.S.) Business Overview
11.8.3 Broadcom(U.S.) 3D IC and 2.5D IC Introduction
11.8.4 Broadcom(U.S.) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.8.5 Broadcom(U.S.) Recent Development
11.9 Intel(U.S.)
11.9.1 Intel(U.S.) Company Detail
11.9.2 Intel(U.S.) Business Overview
11.9.3 Intel(U.S.) 3D IC and 2.5D IC Introduction
11.9.4 Intel(U.S.) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.9.5 Intel(U.S.) Recent Development
11.10 Jiangsu Changjiang Electronics(China)
11.10.1 Jiangsu Changjiang Electronics(China) Company Detail
11.10.2 Jiangsu Changjiang Electronics(China) Business Overview
11.10.3 Jiangsu Changjiang Electronics(China) 3D IC and 2.5D IC Introduction
11.10.4 Jiangsu Changjiang Electronics(China) Revenue in 3D IC and 2.5D IC Business (2019-2024)
11.10.5 Jiangsu Changjiang Electronics(China) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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