The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Global 3D IC and 2.5D IC Packaging Market Research Report 2024
Synopsis
The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2023 and is anticipated to reach US$ 268230 million by 2030, witnessing a CAGR of 15.0% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC Packaging.
Report Scope
The 3D IC and 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D IC and 2.5D IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC and 2.5D IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Segment by Application
Logic
Imaging & Optoelectronics
Memory
MEMS/Sensors
LED
Power
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 3D IC and 2.5D IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 3D IC and 2.5D IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 3D IC and 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2023 and is anticipated to reach US$ 268230 million by 2030, witnessing a CAGR of 15.0% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC Packaging.
Report Scope
The 3D IC and 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D IC and 2.5D IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC and 2.5D IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Segment by Application
Logic
Imaging & Optoelectronics
Memory
MEMS/Sensors
LED
Power
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 3D IC and 2.5D IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 3D IC and 2.5D IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 3D IC and 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 3D IC and 2.5D IC Packaging Market Overview
1.1 Product Definition
1.2 3D IC and 2.5D IC Packaging Segment by Type
1.2.1 Global 3D IC and 2.5D IC Packaging Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 3D Wafer-level Chip-scale Packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Packaging Segment by Application
1.3.1 Global 3D IC and 2.5D IC Packaging Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Logic
1.3.3 Imaging & Optoelectronics
1.3.4 Memory
1.3.5 MEMS/Sensors
1.3.6 LED
1.3.7 Power
1.4 Global Market Growth Prospects
1.4.1 Global 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global 3D IC and 2.5D IC Packaging Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts (2019-2030)
1.4.4 Global 3D IC and 2.5D IC Packaging Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Manufacturers (2019-2024)
2.2 Global 3D IC and 2.5D IC Packaging Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of 3D IC and 2.5D IC Packaging, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global 3D IC and 2.5D IC Packaging Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global 3D IC and 2.5D IC Packaging Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Product Offered and Application
2.8 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Date of Enter into This Industry
2.9 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends
2.9.1 3D IC and 2.5D IC Packaging Market Concentration Rate
2.9.2 Global 5 and 10 Largest 3D IC and 2.5D IC Packaging Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 3D IC and 2.5D IC Packaging Production by Region
3.1 Global 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global 3D IC and 2.5D IC Packaging Production Value by Region (2019-2030)
3.2.1 Global 3D IC and 2.5D IC Packaging Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of 3D IC and 2.5D IC Packaging by Region (2025-2030)
3.3 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global 3D IC and 2.5D IC Packaging Production by Region (2019-2030)
3.4.1 Global 3D IC and 2.5D IC Packaging Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of 3D IC and 2.5D IC Packaging by Region (2025-2030)
3.5 Global 3D IC and 2.5D IC Packaging Market Price Analysis by Region (2019-2024)
3.6 Global 3D IC and 2.5D IC Packaging Production and Value, Year-over-Year Growth
3.6.1 North America 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.3 China 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2019-2030)
4 3D IC and 2.5D IC Packaging Consumption by Region
4.1 Global 3D IC and 2.5D IC Packaging Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global 3D IC and 2.5D IC Packaging Consumption by Region (2019-2030)
4.2.1 Global 3D IC and 2.5D IC Packaging Consumption by Region (2019-2024)
4.2.2 Global 3D IC and 2.5D IC Packaging Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America 3D IC and 2.5D IC Packaging Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe 3D IC and 2.5D IC Packaging Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global 3D IC and 2.5D IC Packaging Production by Type (2019-2030)
5.1.1 Global 3D IC and 2.5D IC Packaging Production by Type (2019-2024)
5.1.2 Global 3D IC and 2.5D IC Packaging Production by Type (2025-2030)
5.1.3 Global 3D IC and 2.5D IC Packaging Production Market Share by Type (2019-2030)
5.2 Global 3D IC and 2.5D IC Packaging Production Value by Type (2019-2030)
5.2.1 Global 3D IC and 2.5D IC Packaging Production Value by Type (2019-2024)
5.2.2 Global 3D IC and 2.5D IC Packaging Production Value by Type (2025-2030)
5.2.3 Global 3D IC and 2.5D IC Packaging Production Value Market Share by Type (2019-2030)
5.3 Global 3D IC and 2.5D IC Packaging Price by Type (2019-2030)
6 Segment by Application
6.1 Global 3D IC and 2.5D IC Packaging Production by Application (2019-2030)
6.1.1 Global 3D IC and 2.5D IC Packaging Production by Application (2019-2024)
6.1.2 Global 3D IC and 2.5D IC Packaging Production by Application (2025-2030)
6.1.3 Global 3D IC and 2.5D IC Packaging Production Market Share by Application (2019-2030)
6.2 Global 3D IC and 2.5D IC Packaging Production Value by Application (2019-2030)
6.2.1 Global 3D IC and 2.5D IC Packaging Production Value by Application (2019-2024)
6.2.2 Global 3D IC and 2.5D IC Packaging Production Value by Application (2025-2030)
6.2.3 Global 3D IC and 2.5D IC Packaging Production Value Market Share by Application (2019-2030)
6.3 Global 3D IC and 2.5D IC Packaging Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Taiwan Semiconductor
7.1.1 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Corporation Information
7.1.2 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Portfolio
7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Taiwan Semiconductor Main Business and Markets Served
7.1.5 Taiwan Semiconductor Recent Developments/Updates
7.2 Samsung Electronics
7.2.1 Samsung Electronics 3D IC and 2.5D IC Packaging Corporation Information
7.2.2 Samsung Electronics 3D IC and 2.5D IC Packaging Product Portfolio
7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Samsung Electronics Main Business and Markets Served
7.2.5 Samsung Electronics Recent Developments/Updates
7.3 Toshiba Corp
7.3.1 Toshiba Corp 3D IC and 2.5D IC Packaging Corporation Information
7.3.2 Toshiba Corp 3D IC and 2.5D IC Packaging Product Portfolio
7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Toshiba Corp Main Business and Markets Served
7.3.5 Toshiba Corp Recent Developments/Updates
7.4 Advanced Semiconductor Engineering
7.4.1 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Corporation Information
7.4.2 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Portfolio
7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Advanced Semiconductor Engineering Main Business and Markets Served
7.4.5 Advanced Semiconductor Engineering Recent Developments/Updates
7.5 Amkor Technology
7.5.1 Amkor Technology 3D IC and 2.5D IC Packaging Corporation Information
7.5.2 Amkor Technology 3D IC and 2.5D IC Packaging Product Portfolio
7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Amkor Technology Main Business and Markets Served
7.5.5 Amkor Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 3D IC and 2.5D IC Packaging Industry Chain Analysis
8.2 3D IC and 2.5D IC Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 3D IC and 2.5D IC Packaging Production Mode & Process
8.4 3D IC and 2.5D IC Packaging Sales and Marketing
8.4.1 3D IC and 2.5D IC Packaging Sales Channels
8.4.2 3D IC and 2.5D IC Packaging Distributors
8.5 3D IC and 2.5D IC Packaging Customers
9 3D IC and 2.5D IC Packaging Market Dynamics
9.1 3D IC and 2.5D IC Packaging Industry Trends
9.2 3D IC and 2.5D IC Packaging Market Drivers
9.3 3D IC and 2.5D IC Packaging Market Challenges
9.4 3D IC and 2.5D IC Packaging Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest IT & Electronics Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
