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Global 3D-IC Packaging Market Research Report 2025
Synopsis
3D-IC (Three-Dimensional Integrated Circuit) packaging is an advanced packaging technology used in the semiconductor industry to vertically stack multiple integrated circuit (IC) dies or chips. It involves stacking and interconnecting multiple IC chips within a single package, allowing for increased integration, improved performance, and reduced form factor of electronic devices.
The global 3D-IC Packaging market was valued at US$ 15860 million in 2023 and is anticipated to reach US$ 26330 million by 2030, witnessing a CAGR of 7.2% during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for 3D-IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D-IC Packaging.
Report Scope
The 3D-IC Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D-IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D-IC Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Synopsys
Cadence
XMC
United Microelectronics Corp
TSMC
SPIL
STMicroelectronics
ASE Group
Amkor Technology
Intel Corporation
GlobalFoundries
Invensas
Toshiba Corporation
Micron Technology
Xilinx
Segment by Type
TSV
TGV
Silicon Interposer
Segment by Application
Consumer Electronics
Medical Devices
Automotive
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D-IC Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
3D-IC (Three-Dimensional Integrated Circuit) packaging is an advanced packaging technology used in the semiconductor industry to vertically stack multiple integrated circuit (IC) dies or chips. It involves stacking and interconnecting multiple IC chips within a single package, allowing for increased integration, improved performance, and reduced form factor of electronic devices.
The global 3D-IC Packaging market was valued at US$ 15860 million in 2023 and is anticipated to reach US$ 26330 million by 2030, witnessing a CAGR of 7.2% during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for 3D-IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D-IC Packaging.
Report Scope
The 3D-IC Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D-IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D-IC Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Synopsys
Cadence
XMC
United Microelectronics Corp
TSMC
SPIL
STMicroelectronics
ASE Group
Amkor Technology
Intel Corporation
GlobalFoundries
Invensas
Toshiba Corporation
Micron Technology
Xilinx
Segment by Type
TSV
TGV
Silicon Interposer
Segment by Application
Consumer Electronics
Medical Devices
Automotive
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D-IC Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global 3D-IC Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 TSV
1.2.3 TGV
1.2.4 Silicon Interposer
1.3 Market by Application
1.3.1 Global 3D-IC Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Medical Devices
1.3.4 Automotive
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 3D-IC Packaging Market Perspective (2019-2030)
2.2 3D-IC Packaging Growth Trends by Region
2.2.1 Global 3D-IC Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 3D-IC Packaging Historic Market Size by Region (2019-2024)
2.2.3 3D-IC Packaging Forecasted Market Size by Region (2025-2030)
2.3 3D-IC Packaging Market Dynamics
2.3.1 3D-IC Packaging Industry Trends
2.3.2 3D-IC Packaging Market Drivers
2.3.3 3D-IC Packaging Market Challenges
2.3.4 3D-IC Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top 3D-IC Packaging Players by Revenue
3.1.1 Global Top 3D-IC Packaging Players by Revenue (2019-2024)
3.1.2 Global 3D-IC Packaging Revenue Market Share by Players (2019-2024)
3.2 Global 3D-IC Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 3D-IC Packaging Revenue
3.4 Global 3D-IC Packaging Market Concentration Ratio
3.4.1 Global 3D-IC Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 3D-IC Packaging Revenue in 2023
3.5 3D-IC Packaging Key Players Head office and Area Served
3.6 Key Players 3D-IC Packaging Product Solution and Service
3.7 Date of Enter into 3D-IC Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 3D-IC Packaging Breakdown Data by Type
4.1 Global 3D-IC Packaging Historic Market Size by Type (2019-2024)
4.2 Global 3D-IC Packaging Forecasted Market Size by Type (2025-2030)
5 3D-IC Packaging Breakdown Data by Application
5.1 Global 3D-IC Packaging Historic Market Size by Application (2019-2024)
5.2 Global 3D-IC Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America 3D-IC Packaging Market Size (2019-2030)
6.2 North America 3D-IC Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America 3D-IC Packaging Market Size by Country (2019-2024)
6.4 North America 3D-IC Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 3D-IC Packaging Market Size (2019-2030)
7.2 Europe 3D-IC Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe 3D-IC Packaging Market Size by Country (2019-2024)
7.4 Europe 3D-IC Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 3D-IC Packaging Market Size (2019-2030)
8.2 Asia-Pacific 3D-IC Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific 3D-IC Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific 3D-IC Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 3D-IC Packaging Market Size (2019-2030)
9.2 Latin America 3D-IC Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America 3D-IC Packaging Market Size by Country (2019-2024)
9.4 Latin America 3D-IC Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 3D-IC Packaging Market Size (2019-2030)
10.2 Middle East & Africa 3D-IC Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa 3D-IC Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa 3D-IC Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Synopsys
11.1.1 Synopsys Company Detail
11.1.2 Synopsys Business Overview
11.1.3 Synopsys 3D-IC Packaging Introduction
11.1.4 Synopsys Revenue in 3D-IC Packaging Business (2019-2024)
11.1.5 Synopsys Recent Development
11.2 Cadence
11.2.1 Cadence Company Detail
11.2.2 Cadence Business Overview
11.2.3 Cadence 3D-IC Packaging Introduction
11.2.4 Cadence Revenue in 3D-IC Packaging Business (2019-2024)
11.2.5 Cadence Recent Development
11.3 XMC
11.3.1 XMC Company Detail
11.3.2 XMC Business Overview
11.3.3 XMC 3D-IC Packaging Introduction
11.3.4 XMC Revenue in 3D-IC Packaging Business (2019-2024)
11.3.5 XMC Recent Development
11.4 United Microelectronics Corp
11.4.1 United Microelectronics Corp Company Detail
11.4.2 United Microelectronics Corp Business Overview
11.4.3 United Microelectronics Corp 3D-IC Packaging Introduction
11.4.4 United Microelectronics Corp Revenue in 3D-IC Packaging Business (2019-2024)
11.4.5 United Microelectronics Corp Recent Development
11.5 TSMC
11.5.1 TSMC Company Detail
11.5.2 TSMC Business Overview
11.5.3 TSMC 3D-IC Packaging Introduction
11.5.4 TSMC Revenue in 3D-IC Packaging Business (2019-2024)
11.5.5 TSMC Recent Development
11.6 SPIL
11.6.1 SPIL Company Detail
11.6.2 SPIL Business Overview
11.6.3 SPIL 3D-IC Packaging Introduction
11.6.4 SPIL Revenue in 3D-IC Packaging Business (2019-2024)
11.6.5 SPIL Recent Development
11.7 STMicroelectronics
11.7.1 STMicroelectronics Company Detail
11.7.2 STMicroelectronics Business Overview
11.7.3 STMicroelectronics 3D-IC Packaging Introduction
11.7.4 STMicroelectronics Revenue in 3D-IC Packaging Business (2019-2024)
11.7.5 STMicroelectronics Recent Development
11.8 ASE Group
11.8.1 ASE Group Company Detail
11.8.2 ASE Group Business Overview
11.8.3 ASE Group 3D-IC Packaging Introduction
11.8.4 ASE Group Revenue in 3D-IC Packaging Business (2019-2024)
11.8.5 ASE Group Recent Development
11.9 Amkor Technology
11.9.1 Amkor Technology Company Detail
11.9.2 Amkor Technology Business Overview
11.9.3 Amkor Technology 3D-IC Packaging Introduction
11.9.4 Amkor Technology Revenue in 3D-IC Packaging Business (2019-2024)
11.9.5 Amkor Technology Recent Development
11.10 Intel Corporation
11.10.1 Intel Corporation Company Detail
11.10.2 Intel Corporation Business Overview
11.10.3 Intel Corporation 3D-IC Packaging Introduction
11.10.4 Intel Corporation Revenue in 3D-IC Packaging Business (2019-2024)
11.10.5 Intel Corporation Recent Development
11.11 GlobalFoundries
11.11.1 GlobalFoundries Company Detail
11.11.2 GlobalFoundries Business Overview
11.11.3 GlobalFoundries 3D-IC Packaging Introduction
11.11.4 GlobalFoundries Revenue in 3D-IC Packaging Business (2019-2024)
11.11.5 GlobalFoundries Recent Development
11.12 Invensas
11.12.1 Invensas Company Detail
11.12.2 Invensas Business Overview
11.12.3 Invensas 3D-IC Packaging Introduction
11.12.4 Invensas Revenue in 3D-IC Packaging Business (2019-2024)
11.12.5 Invensas Recent Development
11.13 Toshiba Corporation
11.13.1 Toshiba Corporation Company Detail
11.13.2 Toshiba Corporation Business Overview
11.13.3 Toshiba Corporation 3D-IC Packaging Introduction
11.13.4 Toshiba Corporation Revenue in 3D-IC Packaging Business (2019-2024)
11.13.5 Toshiba Corporation Recent Development
11.14 Micron Technology
11.14.1 Micron Technology Company Detail
11.14.2 Micron Technology Business Overview
11.14.3 Micron Technology 3D-IC Packaging Introduction
11.14.4 Micron Technology Revenue in 3D-IC Packaging Business (2019-2024)
11.14.5 Micron Technology Recent Development
11.15 Xilinx
11.15.1 Xilinx Company Detail
11.15.2 Xilinx Business Overview
11.15.3 Xilinx 3D-IC Packaging Introduction
11.15.4 Xilinx Revenue in 3D-IC Packaging Business (2019-2024)
11.15.5 Xilinx Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
List of TablesList of Tables
Table 1. Global 3D-IC Packaging Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
Table 2. Key Players of TSV
Table 3. Key Players of TGV
Table 4. Key Players of Silicon Interposer
Table 5. Global 3D-IC Packaging Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
Table 6. Global 3D-IC Packaging Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 7. Global 3D-IC Packaging Market Size by Region (2019-2024) & (US$ Million)
Table 8. Global 3D-IC Packaging Market Share by Region (2019-2024)
Table 9. Global 3D-IC Packaging Forecasted Market Size by Region (2025-2030) & (US$ Million)
Table 10. Global 3D-IC Packaging Market Share by Region (2025-2030)
Table 11. 3D-IC Packaging Market Trends
Table 12. 3D-IC Packaging Market Drivers
Table 13. 3D-IC Packaging Market Challenges
Table 14. 3D-IC Packaging Market Restraints
Table 15. Global 3D-IC Packaging Revenue by Players (2019-2024) & (US$ Million)
Table 16. Global 3D-IC Packaging Market Share by Players (2019-2024)
Table 17. Global Top 3D-IC Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D-IC Packaging as of 2023)
Table 18. Ranking of Global Top 3D-IC Packaging Companies by Revenue (US$ Million) in 2023
Table 19. Global 5 Largest Players Market Share by 3D-IC Packaging Revenue (CR5 and HHI) & (2019-2024)
Table 20. Key Players Headquarters and Area Served
Table 21. Key Players 3D-IC Packaging Product Solution and Service
Table 22. Date of Enter into 3D-IC Packaging Market
Table 23. Mergers & Acquisitions, Expansion Plans
Table 24. Global 3D-IC Packaging Market Size by Type (2019-2024) & (US$ Million)
Table 25. Global 3D-IC Packaging Revenue Market Share by Type (2019-2024)
Table 26. Global 3D-IC Packaging Forecasted Market Size by Type (2025-2030) & (US$ Million)
Table 27. Global 3D-IC Packaging Revenue Market Share by Type (2025-2030)
Table 28. Global 3D-IC Packaging Market Size by Application (2019-2024) & (US$ Million)
Table 29. Global 3D-IC Packaging Revenue Market Share by Application (2019-2024)
Table 30. Global 3D-IC Packaging Forecasted Market Size by Application (2025-2030) & (US$ Million)
Table 31. Global 3D-IC Packaging Revenue Market Share by Application (2025-2030)
Table 32. North America 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 33. North America 3D-IC Packaging Market Size by Country (2019-2024) & (US$ Million)
Table 34. North America 3D-IC Packaging Market Size by Country (2025-2030) & (US$ Million)
Table 35. Europe 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 36. Europe 3D-IC Packaging Market Size by Country (2019-2024) & (US$ Million)
Table 37. Europe 3D-IC Packaging Market Size by Country (2025-2030) & (US$ Million)
Table 38. Asia-Pacific 3D-IC Packaging Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
Table 39. Asia-Pacific 3D-IC Packaging Market Size by Region (2019-2024) & (US$ Million)
Table 40. Asia-Pacific 3D-IC Packaging Market Size by Region (2025-2030) & (US$ Million)
Table 41. Latin America 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 42. Latin America 3D-IC Packaging Market Size by Country (2019-2024) & (US$ Million)
Table 43. Latin America 3D-IC Packaging Market Size by Country (2025-2030) & (US$ Million)
Table 44. Middle East & Africa 3D-IC Packaging Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 45. Middle East & Africa 3D-IC Packaging Market Size by Country (2019-2024) & (US$ Million)
Table 46. Middle East & Africa 3D-IC Packaging Market Size by Country (2025-2030) & (US$ Million)
Table 47. Synopsys Company Detail
Table 48. Synopsys Business Overview
Table 49. Synopsys 3D-IC Packaging Product
Table 50. Synopsys Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 51. Synopsys Recent Development
Table 52. Cadence Company Detail
Table 53. Cadence Business Overview
Table 54. Cadence 3D-IC Packaging Product
Table 55. Cadence Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 56. Cadence Recent Development
Table 57. XMC Company Detail
Table 58. XMC Business Overview
Table 59. XMC 3D-IC Packaging Product
Table 60. XMC Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 61. XMC Recent Development
Table 62. United Microelectronics Corp Company Detail
Table 63. United Microelectronics Corp Business Overview
Table 64. United Microelectronics Corp 3D-IC Packaging Product
Table 65. United Microelectronics Corp Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 66. United Microelectronics Corp Recent Development
Table 67. TSMC Company Detail
Table 68. TSMC Business Overview
Table 69. TSMC 3D-IC Packaging Product
Table 70. TSMC Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 71. TSMC Recent Development
Table 72. SPIL Company Detail
Table 73. SPIL Business Overview
Table 74. SPIL 3D-IC Packaging Product
Table 75. SPIL Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 76. SPIL Recent Development
Table 77. STMicroelectronics Company Detail
Table 78. STMicroelectronics Business Overview
Table 79. STMicroelectronics 3D-IC Packaging Product
Table 80. STMicroelectronics Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 81. STMicroelectronics Recent Development
Table 82. ASE Group Company Detail
Table 83. ASE Group Business Overview
Table 84. ASE Group 3D-IC Packaging Product
Table 85. ASE Group Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 86. ASE Group Recent Development
Table 87. Amkor Technology Company Detail
Table 88. Amkor Technology Business Overview
Table 89. Amkor Technology 3D-IC Packaging Product
Table 90. Amkor Technology Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 91. Amkor Technology Recent Development
Table 92. Intel Corporation Company Detail
Table 93. Intel Corporation Business Overview
Table 94. Intel Corporation 3D-IC Packaging Product
Table 95. Intel Corporation Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 96. Intel Corporation Recent Development
Table 97. GlobalFoundries Company Detail
Table 98. GlobalFoundries Business Overview
Table 99. GlobalFoundries 3D-IC Packaging Product
Table 100. GlobalFoundries Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 101. GlobalFoundries Recent Development
Table 102. Invensas Company Detail
Table 103. Invensas Business Overview
Table 104. Invensas 3D-IC Packaging Product
Table 105. Invensas Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 106. Invensas Recent Development
Table 107. Toshiba Corporation Company Detail
Table 108. Toshiba Corporation Business Overview
Table 109. Toshiba Corporation 3D-IC Packaging Product
Table 110. Toshiba Corporation Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 111. Toshiba Corporation Recent Development
Table 112. Micron Technology Company Detail
Table 113. Micron Technology Business Overview
Table 114. Micron Technology 3D-IC Packaging Product
Table 115. Micron Technology Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 116. Micron Technology Recent Development
Table 117. Xilinx Company Detail
Table 118. Xilinx Business Overview
Table 119. Xilinx 3D-IC Packaging Product
Table 120. Xilinx Revenue in 3D-IC Packaging Business (2019-2024) & (US$ Million)
Table 121. Xilinx Recent Development
Table 122. Research Programs/Design for This Report
Table 123. Key Data Information from Secondary Sources
Table 124. Key Data Information from Primary Sources
List of Figures
Figure 1. Global 3D-IC Packaging Market Size Comparison by Type (2024-2030) & (US$ Million)
Figure 2. Global 3D-IC Packaging Market Share by Type: 2023 VS 2030
Figure 3. TSV Features
Figure 4. TGV Features
Figure 5. Silicon Interposer Features
Figure 6. Global 3D-IC Packaging Market Size Comparison by Application (2024-2030) & (US$ Million)
Figure 7. Global 3D-IC Packaging Market Share by Application: 2023 VS 2030
Figure 8. Consumer Electronics Case Studies
Figure 9. Medical Devices Case Studies
Figure 10. Automotive Case Studies
Figure 11. Others Case Studies
Figure 12. 3D-IC Packaging Report Years Considered
Figure 13. Global 3D-IC Packaging Market Size (US$ Million), Year-over-Year: 2019-2030
Figure 14. Global 3D-IC Packaging Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 15. Global 3D-IC Packaging Market Share by Region: 2023 VS 2030
Figure 16. Global 3D-IC Packaging Market Share by Players in 2023
Figure 17. Global Top 3D-IC Packaging Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in 3D-IC Packaging as of 2023)
Figure 18. The Top 10 and 5 Players Market Share by 3D-IC Packaging Revenue in 2023
Figure 19. North America 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 20. North America 3D-IC Packaging Market Share by Country (2019-2030)
Figure 21. United States 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 22. Canada 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 23. Europe 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 24. Europe 3D-IC Packaging Market Share by Country (2019-2030)
Figure 25. Germany 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 26. France 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 27. U.K. 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 28. Italy 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 29. Russia 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 30. Nordic Countries 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 31. Asia-Pacific 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 32. Asia-Pacific 3D-IC Packaging Market Share by Region (2019-2030)
Figure 33. China 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 34. Japan 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 35. South Korea 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 36. Southeast Asia 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 37. India 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 38. Australia 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 39. Latin America 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 40. Latin America 3D-IC Packaging Market Share by Country (2019-2030)
Figure 41. Mexico 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 42. Brazil 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 43. Middle East & Africa 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 44. Middle East & Africa 3D-IC Packaging Market Share by Country (2019-2030)
Figure 45. Turkey 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 46. Saudi Arabia 3D-IC Packaging Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 47. Synopsys Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 48. Cadence Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 49. XMC Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 50. United Microelectronics Corp Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 51. TSMC Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 52. SPIL Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 53. STMicroelectronics Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 54. ASE Group Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 55. Amkor Technology Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 56. Intel Corporation Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 57. GlobalFoundries Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 58. Invensas Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 59. Toshiba Corporation Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 60. Micron Technology Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 61. Xilinx Revenue Growth Rate in 3D-IC Packaging Business (2019-2024)
Figure 62. Bottom-up and Top-down Approaches for This Report
Figure 63. Data Triangulation
Figure 64. Key Executives Interviewed
Published By : QY Research
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