The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Global Back Grinding Tape and Dicing Tape Market Research Report 2024
Synopsis
BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling. Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape. It is usually made of polyimide film, with high strength and high temperature resistance. In semiconductor manufacturing, chips need to be separated by cutting them into small pieces. Dicing Tape fixes the chip on the back cutting machine and protects the chip surface from damage during the cutting process. The selection of Dicing Tape depends on the size and shape of the chip, as well as the cutting disc and cutting parameters used during the cutting process. Usually, manufacturers provide different types and specifications of Dicing Tapes to meet different application requirements.
The global Back Grinding Tape and Dicing Tape market was valued at US$ 1014 million in 2023 and is anticipated to reach US$ 1178.4 million by 2030, witnessing a CAGR of 5.7% during the forecast period 2024-2030.
North American market for Back Grinding Tape and Dicing Tape is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Back Grinding Tape and Dicing Tape is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Back Grinding Tape and Dicing Tape include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, LG Chem, Maxell, D&X and AI Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Back Grinding Tape and Dicing Tape, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Back Grinding Tape and Dicing Tape.
Report Scope
The Back Grinding Tape and Dicing Tape market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Back Grinding Tape and Dicing Tape market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Back Grinding Tape and Dicing Tape manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Suzhou Boyan Jingjin Photoelectric
Shanghai Guke Adhesive Tape
WISE New Material
Taicang Zhanxin Adhesive Material
Shanghai Plusco Tech
Kunshan BYE Science Macromolecule Material
Cybrid Technologies
Segment by Type
Back Grinding Tape
Dicing Tape
Segment by Application
Front-End Process
Back-End Process
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Back Grinding Tape and Dicing Tape manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Back Grinding Tape and Dicing Tape by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Back Grinding Tape and Dicing Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
BGT (Backside Grinding Tape) is used to protect the wafer surface during back grinding after the IC is formed on the wafer. Attached on the circuit surface, it prevents damages to the circuit surface and pollutions to the wafer surface and improves the grinding accuracy of the wafer. Especially, it can perfectly protect the wafer pattern surface and the chip during the manufacturing process with its excellent physical and chemical properties. With developments of jumbo-sized and thinned wafer and high-bumped wafer, the function required to the BG tape are (1) low contamination levels, (2) highly close contact to wafer-, and (3) easiness of peeling. Dicing Tape is a type of adhesive tape used in semiconductor manufacturing, also known as cutting tape. It is usually made of polyimide film, with high strength and high temperature resistance. In semiconductor manufacturing, chips need to be separated by cutting them into small pieces. Dicing Tape fixes the chip on the back cutting machine and protects the chip surface from damage during the cutting process. The selection of Dicing Tape depends on the size and shape of the chip, as well as the cutting disc and cutting parameters used during the cutting process. Usually, manufacturers provide different types and specifications of Dicing Tapes to meet different application requirements.
The global Back Grinding Tape and Dicing Tape market was valued at US$ 1014 million in 2023 and is anticipated to reach US$ 1178.4 million by 2030, witnessing a CAGR of 5.7% during the forecast period 2024-2030.
North American market for Back Grinding Tape and Dicing Tape is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Back Grinding Tape and Dicing Tape is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Back Grinding Tape and Dicing Tape include Mitsui Chemicals Tohcello, Nitto, LINTEC, Furukawa Electric, Denka, LG Chem, Maxell, D&X and AI Technology, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Back Grinding Tape and Dicing Tape, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Back Grinding Tape and Dicing Tape.
Report Scope
The Back Grinding Tape and Dicing Tape market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Back Grinding Tape and Dicing Tape market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Back Grinding Tape and Dicing Tape manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Mitsui Chemicals Tohcello
Nitto
LINTEC
Furukawa Electric
Denka
LG Chem
Maxell
D&X
AI Technology
Suzhou Boyan Jingjin Photoelectric
Shanghai Guke Adhesive Tape
WISE New Material
Taicang Zhanxin Adhesive Material
Shanghai Plusco Tech
Kunshan BYE Science Macromolecule Material
Cybrid Technologies
Segment by Type
Back Grinding Tape
Dicing Tape
Segment by Application
Front-End Process
Back-End Process
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Back Grinding Tape and Dicing Tape manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Back Grinding Tape and Dicing Tape by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Back Grinding Tape and Dicing Tape in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Back Grinding Tape and Dicing Tape Market Overview
1.1 Product Definition
1.2 Back Grinding Tape and Dicing Tape Segment by Type
1.2.1 Global Back Grinding Tape and Dicing Tape Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Back Grinding Tape
1.2.3 Dicing Tape
1.3 Back Grinding Tape and Dicing Tape Segment by Application
1.3.1 Global Back Grinding Tape and Dicing Tape Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Front-End Process
1.3.3 Back-End Process
1.4 Global Market Growth Prospects
1.4.1 Global Back Grinding Tape and Dicing Tape Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Back Grinding Tape and Dicing Tape Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Back Grinding Tape and Dicing Tape Production Estimates and Forecasts (2019-2030)
1.4.4 Global Back Grinding Tape and Dicing Tape Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Back Grinding Tape and Dicing Tape Production Market Share by Manufacturers (2019-2024)
2.2 Global Back Grinding Tape and Dicing Tape Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Back Grinding Tape and Dicing Tape, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Back Grinding Tape and Dicing Tape Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Back Grinding Tape and Dicing Tape Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Back Grinding Tape and Dicing Tape, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Back Grinding Tape and Dicing Tape, Product Offered and Application
2.8 Global Key Manufacturers of Back Grinding Tape and Dicing Tape, Date of Enter into This Industry
2.9 Back Grinding Tape and Dicing Tape Market Competitive Situation and Trends
2.9.1 Back Grinding Tape and Dicing Tape Market Concentration Rate
2.9.2 Global 5 and 10 Largest Back Grinding Tape and Dicing Tape Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Back Grinding Tape and Dicing Tape Production by Region
3.1 Global Back Grinding Tape and Dicing Tape Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Back Grinding Tape and Dicing Tape Production Value by Region (2019-2030)
3.2.1 Global Back Grinding Tape and Dicing Tape Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Back Grinding Tape and Dicing Tape by Region (2025-2030)
3.3 Global Back Grinding Tape and Dicing Tape Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Back Grinding Tape and Dicing Tape Production by Region (2019-2030)
3.4.1 Global Back Grinding Tape and Dicing Tape Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Back Grinding Tape and Dicing Tape by Region (2025-2030)
3.5 Global Back Grinding Tape and Dicing Tape Market Price Analysis by Region (2019-2024)
3.6 Global Back Grinding Tape and Dicing Tape Production and Value, Year-over-Year Growth
3.6.1 North America Back Grinding Tape and Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Back Grinding Tape and Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Back Grinding Tape and Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Back Grinding Tape and Dicing Tape Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Back Grinding Tape and Dicing Tape Production Value Estimates and Forecasts (2019-2030)
4 Back Grinding Tape and Dicing Tape Consumption by Region
4.1 Global Back Grinding Tape and Dicing Tape Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Back Grinding Tape and Dicing Tape Consumption by Region (2019-2030)
4.2.1 Global Back Grinding Tape and Dicing Tape Consumption by Region (2019-2024)
4.2.2 Global Back Grinding Tape and Dicing Tape Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Back Grinding Tape and Dicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Back Grinding Tape and Dicing Tape Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Back Grinding Tape and Dicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Back Grinding Tape and Dicing Tape Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Back Grinding Tape and Dicing Tape Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Back Grinding Tape and Dicing Tape Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Back Grinding Tape and Dicing Tape Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Back Grinding Tape and Dicing Tape Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Back Grinding Tape and Dicing Tape Production by Type (2019-2030)
5.1.1 Global Back Grinding Tape and Dicing Tape Production by Type (2019-2024)
5.1.2 Global Back Grinding Tape and Dicing Tape Production by Type (2025-2030)
5.1.3 Global Back Grinding Tape and Dicing Tape Production Market Share by Type (2019-2030)
5.2 Global Back Grinding Tape and Dicing Tape Production Value by Type (2019-2030)
5.2.1 Global Back Grinding Tape and Dicing Tape Production Value by Type (2019-2024)
5.2.2 Global Back Grinding Tape and Dicing Tape Production Value by Type (2025-2030)
5.2.3 Global Back Grinding Tape and Dicing Tape Production Value Market Share by Type (2019-2030)
5.3 Global Back Grinding Tape and Dicing Tape Price by Type (2019-2030)
6 Segment by Application
6.1 Global Back Grinding Tape and Dicing Tape Production by Application (2019-2030)
6.1.1 Global Back Grinding Tape and Dicing Tape Production by Application (2019-2024)
6.1.2 Global Back Grinding Tape and Dicing Tape Production by Application (2025-2030)
6.1.3 Global Back Grinding Tape and Dicing Tape Production Market Share by Application (2019-2030)
6.2 Global Back Grinding Tape and Dicing Tape Production Value by Application (2019-2030)
6.2.1 Global Back Grinding Tape and Dicing Tape Production Value by Application (2019-2024)
6.2.2 Global Back Grinding Tape and Dicing Tape Production Value by Application (2025-2030)
6.2.3 Global Back Grinding Tape and Dicing Tape Production Value Market Share by Application (2019-2030)
6.3 Global Back Grinding Tape and Dicing Tape Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Mitsui Chemicals Tohcello
7.1.1 Mitsui Chemicals Tohcello Back Grinding Tape and Dicing Tape Corporation Information
7.1.2 Mitsui Chemicals Tohcello Back Grinding Tape and Dicing Tape Product Portfolio
7.1.3 Mitsui Chemicals Tohcello Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Mitsui Chemicals Tohcello Main Business and Markets Served
7.1.5 Mitsui Chemicals Tohcello Recent Developments/Updates
7.2 Nitto
7.2.1 Nitto Back Grinding Tape and Dicing Tape Corporation Information
7.2.2 Nitto Back Grinding Tape and Dicing Tape Product Portfolio
7.2.3 Nitto Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Nitto Main Business and Markets Served
7.2.5 Nitto Recent Developments/Updates
7.3 LINTEC
7.3.1 LINTEC Back Grinding Tape and Dicing Tape Corporation Information
7.3.2 LINTEC Back Grinding Tape and Dicing Tape Product Portfolio
7.3.3 LINTEC Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.3.4 LINTEC Main Business and Markets Served
7.3.5 LINTEC Recent Developments/Updates
7.4 Furukawa Electric
7.4.1 Furukawa Electric Back Grinding Tape and Dicing Tape Corporation Information
7.4.2 Furukawa Electric Back Grinding Tape and Dicing Tape Product Portfolio
7.4.3 Furukawa Electric Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Furukawa Electric Main Business and Markets Served
7.4.5 Furukawa Electric Recent Developments/Updates
7.5 Denka
7.5.1 Denka Back Grinding Tape and Dicing Tape Corporation Information
7.5.2 Denka Back Grinding Tape and Dicing Tape Product Portfolio
7.5.3 Denka Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Denka Main Business and Markets Served
7.5.5 Denka Recent Developments/Updates
7.6 LG Chem
7.6.1 LG Chem Back Grinding Tape and Dicing Tape Corporation Information
7.6.2 LG Chem Back Grinding Tape and Dicing Tape Product Portfolio
7.6.3 LG Chem Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.6.4 LG Chem Main Business and Markets Served
7.6.5 LG Chem Recent Developments/Updates
7.7 Maxell
7.7.1 Maxell Back Grinding Tape and Dicing Tape Corporation Information
7.7.2 Maxell Back Grinding Tape and Dicing Tape Product Portfolio
7.7.3 Maxell Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Maxell Main Business and Markets Served
7.7.5 Maxell Recent Developments/Updates
7.8 D&X
7.8.1 D&X Back Grinding Tape and Dicing Tape Corporation Information
7.8.2 D&X Back Grinding Tape and Dicing Tape Product Portfolio
7.8.3 D&X Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.8.4 D&X Main Business and Markets Served
7.7.5 D&X Recent Developments/Updates
7.9 AI Technology
7.9.1 AI Technology Back Grinding Tape and Dicing Tape Corporation Information
7.9.2 AI Technology Back Grinding Tape and Dicing Tape Product Portfolio
7.9.3 AI Technology Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.9.4 AI Technology Main Business and Markets Served
7.9.5 AI Technology Recent Developments/Updates
7.10 Suzhou Boyan Jingjin Photoelectric
7.10.1 Suzhou Boyan Jingjin Photoelectric Back Grinding Tape and Dicing Tape Corporation Information
7.10.2 Suzhou Boyan Jingjin Photoelectric Back Grinding Tape and Dicing Tape Product Portfolio
7.10.3 Suzhou Boyan Jingjin Photoelectric Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Suzhou Boyan Jingjin Photoelectric Main Business and Markets Served
7.10.5 Suzhou Boyan Jingjin Photoelectric Recent Developments/Updates
7.11 Shanghai Guke Adhesive Tape
7.11.1 Shanghai Guke Adhesive Tape Back Grinding Tape and Dicing Tape Corporation Information
7.11.2 Shanghai Guke Adhesive Tape Back Grinding Tape and Dicing Tape Product Portfolio
7.11.3 Shanghai Guke Adhesive Tape Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Shanghai Guke Adhesive Tape Main Business and Markets Served
7.11.5 Shanghai Guke Adhesive Tape Recent Developments/Updates
7.12 WISE New Material
7.12.1 WISE New Material Back Grinding Tape and Dicing Tape Corporation Information
7.12.2 WISE New Material Back Grinding Tape and Dicing Tape Product Portfolio
7.12.3 WISE New Material Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.12.4 WISE New Material Main Business and Markets Served
7.12.5 WISE New Material Recent Developments/Updates
7.13 Taicang Zhanxin Adhesive Material
7.13.1 Taicang Zhanxin Adhesive Material Back Grinding Tape and Dicing Tape Corporation Information
7.13.2 Taicang Zhanxin Adhesive Material Back Grinding Tape and Dicing Tape Product Portfolio
7.13.3 Taicang Zhanxin Adhesive Material Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Taicang Zhanxin Adhesive Material Main Business and Markets Served
7.13.5 Taicang Zhanxin Adhesive Material Recent Developments/Updates
7.14 Shanghai Plusco Tech
7.14.1 Shanghai Plusco Tech Back Grinding Tape and Dicing Tape Corporation Information
7.14.2 Shanghai Plusco Tech Back Grinding Tape and Dicing Tape Product Portfolio
7.14.3 Shanghai Plusco Tech Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Shanghai Plusco Tech Main Business and Markets Served
7.14.5 Shanghai Plusco Tech Recent Developments/Updates
7.15 Kunshan BYE Science Macromolecule Material
7.15.1 Kunshan BYE Science Macromolecule Material Back Grinding Tape and Dicing Tape Corporation Information
7.15.2 Kunshan BYE Science Macromolecule Material Back Grinding Tape and Dicing Tape Product Portfolio
7.15.3 Kunshan BYE Science Macromolecule Material Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.15.4 Kunshan BYE Science Macromolecule Material Main Business and Markets Served
7.15.5 Kunshan BYE Science Macromolecule Material Recent Developments/Updates
7.16 Cybrid Technologies
7.16.1 Cybrid Technologies Back Grinding Tape and Dicing Tape Corporation Information
7.16.2 Cybrid Technologies Back Grinding Tape and Dicing Tape Product Portfolio
7.16.3 Cybrid Technologies Back Grinding Tape and Dicing Tape Production, Value, Price and Gross Margin (2019-2024)
7.16.4 Cybrid Technologies Main Business and Markets Served
7.16.5 Cybrid Technologies Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Back Grinding Tape and Dicing Tape Industry Chain Analysis
8.2 Back Grinding Tape and Dicing Tape Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Back Grinding Tape and Dicing Tape Production Mode & Process
8.4 Back Grinding Tape and Dicing Tape Sales and Marketing
8.4.1 Back Grinding Tape and Dicing Tape Sales Channels
8.4.2 Back Grinding Tape and Dicing Tape Distributors
8.5 Back Grinding Tape and Dicing Tape Customers
9 Back Grinding Tape and Dicing Tape Market Dynamics
9.1 Back Grinding Tape and Dicing Tape Industry Trends
9.2 Back Grinding Tape and Dicing Tape Market Drivers
9.3 Back Grinding Tape and Dicing Tape Market Challenges
9.4 Back Grinding Tape and Dicing Tape Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest IT & Electronics Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
