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Global Ball Grid Array (BGA) Packages Market Research Report 2024
Synopsis
The global Ball Grid Array (BGA) Packages market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Ball Grid Array (BGA) Packages, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ball Grid Array (BGA) Packages.
Report Scope
The Ball Grid Array (BGA) Packages market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Ball Grid Array (BGA) Packages market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Ball Grid Array (BGA) Packages manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd.
ASE Group
Advanced Semiconductor Engineering, Inc.
PARPRO
Intel
Corintech Ltd
Integrated Circuit Engineering Corporation
Segment by Type
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA
Segment by Application
OEM
Aftermarket
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Ball Grid Array (BGA) Packages manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Ball Grid Array (BGA) Packages by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Ball Grid Array (BGA) Packages in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global Ball Grid Array (BGA) Packages market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Ball Grid Array (BGA) Packages, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ball Grid Array (BGA) Packages.
Report Scope
The Ball Grid Array (BGA) Packages market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Ball Grid Array (BGA) Packages market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Ball Grid Array (BGA) Packages manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor Technology
TriQuint Semiconductor Inc.
Jiangsu Changjiang Electronics Technology Co.
STATS ChipPAC Ltd.
ASE Group
Advanced Semiconductor Engineering, Inc.
PARPRO
Intel
Corintech Ltd
Integrated Circuit Engineering Corporation
Segment by Type
Molded Array Process BGA
Thermally Enhanced BGA
Package on Package (PoP) BGA
Micro BGA
Segment by Application
OEM
Aftermarket
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Ball Grid Array (BGA) Packages manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Ball Grid Array (BGA) Packages by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Ball Grid Array (BGA) Packages in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Ball Grid Array (BGA) Packages Market Overview
1.1 Product Definition
1.2 Ball Grid Array (BGA) Packages Segment by Type
1.2.1 Global Ball Grid Array (BGA) Packages Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Molded Array Process BGA
1.2.3 Thermally Enhanced BGA
1.2.4 Package on Package (PoP) BGA
1.2.5 Micro BGA
1.3 Ball Grid Array (BGA) Packages Segment by Application
1.3.1 Global Ball Grid Array (BGA) Packages Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 OEM
1.3.3 Aftermarket
1.4 Global Market Growth Prospects
1.4.1 Global Ball Grid Array (BGA) Packages Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Ball Grid Array (BGA) Packages Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Ball Grid Array (BGA) Packages Production Estimates and Forecasts (2019-2030)
1.4.4 Global Ball Grid Array (BGA) Packages Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Ball Grid Array (BGA) Packages Production Market Share by Manufacturers (2019-2024)
2.2 Global Ball Grid Array (BGA) Packages Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Ball Grid Array (BGA) Packages, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Ball Grid Array (BGA) Packages Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Ball Grid Array (BGA) Packages Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Ball Grid Array (BGA) Packages, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Ball Grid Array (BGA) Packages, Product Offered and Application
2.8 Global Key Manufacturers of Ball Grid Array (BGA) Packages, Date of Enter into This Industry
2.9 Ball Grid Array (BGA) Packages Market Competitive Situation and Trends
2.9.1 Ball Grid Array (BGA) Packages Market Concentration Rate
2.9.2 Global 5 and 10 Largest Ball Grid Array (BGA) Packages Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Ball Grid Array (BGA) Packages Production by Region
3.1 Global Ball Grid Array (BGA) Packages Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Ball Grid Array (BGA) Packages Production Value by Region (2019-2030)
3.2.1 Global Ball Grid Array (BGA) Packages Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Ball Grid Array (BGA) Packages by Region (2025-2030)
3.3 Global Ball Grid Array (BGA) Packages Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Ball Grid Array (BGA) Packages Production by Region (2019-2030)
3.4.1 Global Ball Grid Array (BGA) Packages Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Ball Grid Array (BGA) Packages by Region (2025-2030)
3.5 Global Ball Grid Array (BGA) Packages Market Price Analysis by Region (2019-2024)
3.6 Global Ball Grid Array (BGA) Packages Production and Value, Year-over-Year Growth
3.6.1 North America Ball Grid Array (BGA) Packages Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Ball Grid Array (BGA) Packages Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Ball Grid Array (BGA) Packages Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Ball Grid Array (BGA) Packages Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Ball Grid Array (BGA) Packages Production Value Estimates and Forecasts (2019-2030)
4 Ball Grid Array (BGA) Packages Consumption by Region
4.1 Global Ball Grid Array (BGA) Packages Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Ball Grid Array (BGA) Packages Consumption by Region (2019-2030)
4.2.1 Global Ball Grid Array (BGA) Packages Consumption by Region (2019-2024)
4.2.2 Global Ball Grid Array (BGA) Packages Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Ball Grid Array (BGA) Packages Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Ball Grid Array (BGA) Packages Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Ball Grid Array (BGA) Packages Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Ball Grid Array (BGA) Packages Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Ball Grid Array (BGA) Packages Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Ball Grid Array (BGA) Packages Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Ball Grid Array (BGA) Packages Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Ball Grid Array (BGA) Packages Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Ball Grid Array (BGA) Packages Production by Type (2019-2030)
5.1.1 Global Ball Grid Array (BGA) Packages Production by Type (2019-2024)
5.1.2 Global Ball Grid Array (BGA) Packages Production by Type (2025-2030)
5.1.3 Global Ball Grid Array (BGA) Packages Production Market Share by Type (2019-2030)
5.2 Global Ball Grid Array (BGA) Packages Production Value by Type (2019-2030)
5.2.1 Global Ball Grid Array (BGA) Packages Production Value by Type (2019-2024)
5.2.2 Global Ball Grid Array (BGA) Packages Production Value by Type (2025-2030)
5.2.3 Global Ball Grid Array (BGA) Packages Production Value Market Share by Type (2019-2030)
5.3 Global Ball Grid Array (BGA) Packages Price by Type (2019-2030)
6 Segment by Application
6.1 Global Ball Grid Array (BGA) Packages Production by Application (2019-2030)
6.1.1 Global Ball Grid Array (BGA) Packages Production by Application (2019-2024)
6.1.2 Global Ball Grid Array (BGA) Packages Production by Application (2025-2030)
6.1.3 Global Ball Grid Array (BGA) Packages Production Market Share by Application (2019-2030)
6.2 Global Ball Grid Array (BGA) Packages Production Value by Application (2019-2030)
6.2.1 Global Ball Grid Array (BGA) Packages Production Value by Application (2019-2024)
6.2.2 Global Ball Grid Array (BGA) Packages Production Value by Application (2025-2030)
6.2.3 Global Ball Grid Array (BGA) Packages Production Value Market Share by Application (2019-2030)
6.3 Global Ball Grid Array (BGA) Packages Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Amkor Technology
7.1.1 Amkor Technology Ball Grid Array (BGA) Packages Corporation Information
7.1.2 Amkor Technology Ball Grid Array (BGA) Packages Product Portfolio
7.1.3 Amkor Technology Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Amkor Technology Main Business and Markets Served
7.1.5 Amkor Technology Recent Developments/Updates
7.2 TriQuint Semiconductor Inc.
7.2.1 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Corporation Information
7.2.2 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Product Portfolio
7.2.3 TriQuint Semiconductor Inc. Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.2.4 TriQuint Semiconductor Inc. Main Business and Markets Served
7.2.5 TriQuint Semiconductor Inc. Recent Developments/Updates
7.3 Jiangsu Changjiang Electronics Technology Co.
7.3.1 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages Corporation Information
7.3.2 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages Product Portfolio
7.3.3 Jiangsu Changjiang Electronics Technology Co. Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Jiangsu Changjiang Electronics Technology Co. Main Business and Markets Served
7.3.5 Jiangsu Changjiang Electronics Technology Co. Recent Developments/Updates
7.4 STATS ChipPAC Ltd.
7.4.1 STATS ChipPAC Ltd. Ball Grid Array (BGA) Packages Corporation Information
7.4.2 STATS ChipPAC Ltd. Ball Grid Array (BGA) Packages Product Portfolio
7.4.3 STATS ChipPAC Ltd. Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.4.4 STATS ChipPAC Ltd. Main Business and Markets Served
7.4.5 STATS ChipPAC Ltd. Recent Developments/Updates
7.5 ASE Group
7.5.1 ASE Group Ball Grid Array (BGA) Packages Corporation Information
7.5.2 ASE Group Ball Grid Array (BGA) Packages Product Portfolio
7.5.3 ASE Group Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.5.4 ASE Group Main Business and Markets Served
7.5.5 ASE Group Recent Developments/Updates
7.6 Advanced Semiconductor Engineering, Inc.
7.6.1 Advanced Semiconductor Engineering, Inc. Ball Grid Array (BGA) Packages Corporation Information
7.6.2 Advanced Semiconductor Engineering, Inc. Ball Grid Array (BGA) Packages Product Portfolio
7.6.3 Advanced Semiconductor Engineering, Inc. Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Advanced Semiconductor Engineering, Inc. Main Business and Markets Served
7.6.5 Advanced Semiconductor Engineering, Inc. Recent Developments/Updates
7.7 PARPRO
7.7.1 PARPRO Ball Grid Array (BGA) Packages Corporation Information
7.7.2 PARPRO Ball Grid Array (BGA) Packages Product Portfolio
7.7.3 PARPRO Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.7.4 PARPRO Main Business and Markets Served
7.7.5 PARPRO Recent Developments/Updates
7.8 Intel
7.8.1 Intel Ball Grid Array (BGA) Packages Corporation Information
7.8.2 Intel Ball Grid Array (BGA) Packages Product Portfolio
7.8.3 Intel Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Intel Main Business and Markets Served
7.7.5 Intel Recent Developments/Updates
7.9 Corintech Ltd
7.9.1 Corintech Ltd Ball Grid Array (BGA) Packages Corporation Information
7.9.2 Corintech Ltd Ball Grid Array (BGA) Packages Product Portfolio
7.9.3 Corintech Ltd Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Corintech Ltd Main Business and Markets Served
7.9.5 Corintech Ltd Recent Developments/Updates
7.10 Integrated Circuit Engineering Corporation
7.10.1 Integrated Circuit Engineering Corporation Ball Grid Array (BGA) Packages Corporation Information
7.10.2 Integrated Circuit Engineering Corporation Ball Grid Array (BGA) Packages Product Portfolio
7.10.3 Integrated Circuit Engineering Corporation Ball Grid Array (BGA) Packages Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Integrated Circuit Engineering Corporation Main Business and Markets Served
7.10.5 Integrated Circuit Engineering Corporation Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Ball Grid Array (BGA) Packages Industry Chain Analysis
8.2 Ball Grid Array (BGA) Packages Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Ball Grid Array (BGA) Packages Production Mode & Process
8.4 Ball Grid Array (BGA) Packages Sales and Marketing
8.4.1 Ball Grid Array (BGA) Packages Sales Channels
8.4.2 Ball Grid Array (BGA) Packages Distributors
8.5 Ball Grid Array (BGA) Packages Customers
9 Ball Grid Array (BGA) Packages Market Dynamics
9.1 Ball Grid Array (BGA) Packages Industry Trends
9.2 Ball Grid Array (BGA) Packages Market Drivers
9.3 Ball Grid Array (BGA) Packages Market Challenges
9.4 Ball Grid Array (BGA) Packages Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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