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Global Bonding Wires Market Research Report 2024
Synopsis
Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
The global Bonding Wires market was valued at US$ 9574.5 million in 2023 and is anticipated to reach US$ 15360 million by 2030, witnessing a CAGR of 6.9% during the forecast period 2024-2030.
Heraeus, Tanaka, Sumitomo Metal Mining and MK Electron are the top 4 of Bonding Wires with about 29% market shares.
This report aims to provide a comprehensive presentation of the global market for Bonding Wires, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Bonding Wires.
Report Scope
The Bonding Wires market size, estimations, and forecasts are provided in terms of output/shipments (KG) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Bonding Wires market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Bonding Wires manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Heraeus
Tanaka
Nippon Micrometal Corporation
MK Electron
Ametek
LT Metals
Doublink Solders
Yantai Zhaojin Kanfort
Tatsuta Electric Wire & Cable
Kangqiang Electronics
Custom Chip Connections
Yantai YesNo Electronic Materials
World Star Electronic Material Co.,Ltd.
Nichetech
Segment by Type
Gold Bonding Wire
Copper Bonding Wire
Silver Bonding Wire
Palladium Coated Copper
Others
Segment by Application
IC
Transistor
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Bonding Wires manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Bonding Wires by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Bonding Wires in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Bonding wire is the material of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication.
The global Bonding Wires market was valued at US$ 9574.5 million in 2023 and is anticipated to reach US$ 15360 million by 2030, witnessing a CAGR of 6.9% during the forecast period 2024-2030.
Heraeus, Tanaka, Sumitomo Metal Mining and MK Electron are the top 4 of Bonding Wires with about 29% market shares.
This report aims to provide a comprehensive presentation of the global market for Bonding Wires, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Bonding Wires.
Report Scope
The Bonding Wires market size, estimations, and forecasts are provided in terms of output/shipments (KG) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Bonding Wires market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Bonding Wires manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Heraeus
Tanaka
Nippon Micrometal Corporation
MK Electron
Ametek
LT Metals
Doublink Solders
Yantai Zhaojin Kanfort
Tatsuta Electric Wire & Cable
Kangqiang Electronics
Custom Chip Connections
Yantai YesNo Electronic Materials
World Star Electronic Material Co.,Ltd.
Nichetech
Segment by Type
Gold Bonding Wire
Copper Bonding Wire
Silver Bonding Wire
Palladium Coated Copper
Others
Segment by Application
IC
Transistor
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Bonding Wires manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Bonding Wires by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Bonding Wires in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Bonding Wires Market Overview
1.1 Product Definition
1.2 Bonding Wires Segment by Type
1.2.1 Global Bonding Wires Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Gold Bonding Wire
1.2.3 Copper Bonding Wire
1.2.4 Silver Bonding Wire
1.2.5 Palladium Coated Copper
1.2.6 Others
1.3 Bonding Wires Segment by Application
1.3.1 Global Bonding Wires Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IC
1.3.3 Transistor
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Bonding Wires Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Bonding Wires Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Bonding Wires Production Estimates and Forecasts (2019-2030)
1.4.4 Global Bonding Wires Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Bonding Wires Production Market Share by Manufacturers (2019-2024)
2.2 Global Bonding Wires Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Bonding Wires, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Bonding Wires Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Bonding Wires Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Bonding Wires, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Bonding Wires, Product Offered and Application
2.8 Global Key Manufacturers of Bonding Wires, Date of Enter into This Industry
2.9 Bonding Wires Market Competitive Situation and Trends
2.9.1 Bonding Wires Market Concentration Rate
2.9.2 Global 5 and 10 Largest Bonding Wires Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Bonding Wires Production by Region
3.1 Global Bonding Wires Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Bonding Wires Production Value by Region (2019-2030)
3.2.1 Global Bonding Wires Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Bonding Wires by Region (2025-2030)
3.3 Global Bonding Wires Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Bonding Wires Production by Region (2019-2030)
3.4.1 Global Bonding Wires Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Bonding Wires by Region (2025-2030)
3.5 Global Bonding Wires Market Price Analysis by Region (2019-2024)
3.6 Global Bonding Wires Production and Value, Year-over-Year Growth
3.6.1 North America Bonding Wires Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Bonding Wires Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Bonding Wires Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Bonding Wires Production Value Estimates and Forecasts (2019-2030)
4 Bonding Wires Consumption by Region
4.1 Global Bonding Wires Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Bonding Wires Consumption by Region (2019-2030)
4.2.1 Global Bonding Wires Consumption by Region (2019-2024)
4.2.2 Global Bonding Wires Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Bonding Wires Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Bonding Wires Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Bonding Wires Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Bonding Wires Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Bonding Wires Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Bonding Wires Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Bonding Wires Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Bonding Wires Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Bonding Wires Production by Type (2019-2030)
5.1.1 Global Bonding Wires Production by Type (2019-2024)
5.1.2 Global Bonding Wires Production by Type (2025-2030)
5.1.3 Global Bonding Wires Production Market Share by Type (2019-2030)
5.2 Global Bonding Wires Production Value by Type (2019-2030)
5.2.1 Global Bonding Wires Production Value by Type (2019-2024)
5.2.2 Global Bonding Wires Production Value by Type (2025-2030)
5.2.3 Global Bonding Wires Production Value Market Share by Type (2019-2030)
5.3 Global Bonding Wires Price by Type (2019-2030)
6 Segment by Application
6.1 Global Bonding Wires Production by Application (2019-2030)
6.1.1 Global Bonding Wires Production by Application (2019-2024)
6.1.2 Global Bonding Wires Production by Application (2025-2030)
6.1.3 Global Bonding Wires Production Market Share by Application (2019-2030)
6.2 Global Bonding Wires Production Value by Application (2019-2030)
6.2.1 Global Bonding Wires Production Value by Application (2019-2024)
6.2.2 Global Bonding Wires Production Value by Application (2025-2030)
6.2.3 Global Bonding Wires Production Value Market Share by Application (2019-2030)
6.3 Global Bonding Wires Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Heraeus
7.1.1 Heraeus Bonding Wires Corporation Information
7.1.2 Heraeus Bonding Wires Product Portfolio
7.1.3 Heraeus Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Heraeus Main Business and Markets Served
7.1.5 Heraeus Recent Developments/Updates
7.2 Tanaka
7.2.1 Tanaka Bonding Wires Corporation Information
7.2.2 Tanaka Bonding Wires Product Portfolio
7.2.3 Tanaka Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Tanaka Main Business and Markets Served
7.2.5 Tanaka Recent Developments/Updates
7.3 Nippon Micrometal Corporation
7.3.1 Nippon Micrometal Corporation Bonding Wires Corporation Information
7.3.2 Nippon Micrometal Corporation Bonding Wires Product Portfolio
7.3.3 Nippon Micrometal Corporation Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Nippon Micrometal Corporation Main Business and Markets Served
7.3.5 Nippon Micrometal Corporation Recent Developments/Updates
7.4 MK Electron
7.4.1 MK Electron Bonding Wires Corporation Information
7.4.2 MK Electron Bonding Wires Product Portfolio
7.4.3 MK Electron Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.4.4 MK Electron Main Business and Markets Served
7.4.5 MK Electron Recent Developments/Updates
7.5 Ametek
7.5.1 Ametek Bonding Wires Corporation Information
7.5.2 Ametek Bonding Wires Product Portfolio
7.5.3 Ametek Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Ametek Main Business and Markets Served
7.5.5 Ametek Recent Developments/Updates
7.6 LT Metals
7.6.1 LT Metals Bonding Wires Corporation Information
7.6.2 LT Metals Bonding Wires Product Portfolio
7.6.3 LT Metals Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.6.4 LT Metals Main Business and Markets Served
7.6.5 LT Metals Recent Developments/Updates
7.7 Doublink Solders
7.7.1 Doublink Solders Bonding Wires Corporation Information
7.7.2 Doublink Solders Bonding Wires Product Portfolio
7.7.3 Doublink Solders Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Doublink Solders Main Business and Markets Served
7.7.5 Doublink Solders Recent Developments/Updates
7.8 Yantai Zhaojin Kanfort
7.8.1 Yantai Zhaojin Kanfort Bonding Wires Corporation Information
7.8.2 Yantai Zhaojin Kanfort Bonding Wires Product Portfolio
7.8.3 Yantai Zhaojin Kanfort Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Yantai Zhaojin Kanfort Main Business and Markets Served
7.7.5 Yantai Zhaojin Kanfort Recent Developments/Updates
7.9 Tatsuta Electric Wire & Cable
7.9.1 Tatsuta Electric Wire & Cable Bonding Wires Corporation Information
7.9.2 Tatsuta Electric Wire & Cable Bonding Wires Product Portfolio
7.9.3 Tatsuta Electric Wire & Cable Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Tatsuta Electric Wire & Cable Main Business and Markets Served
7.9.5 Tatsuta Electric Wire & Cable Recent Developments/Updates
7.10 Kangqiang Electronics
7.10.1 Kangqiang Electronics Bonding Wires Corporation Information
7.10.2 Kangqiang Electronics Bonding Wires Product Portfolio
7.10.3 Kangqiang Electronics Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Kangqiang Electronics Main Business and Markets Served
7.10.5 Kangqiang Electronics Recent Developments/Updates
7.11 Custom Chip Connections
7.11.1 Custom Chip Connections Bonding Wires Corporation Information
7.11.2 Custom Chip Connections Bonding Wires Product Portfolio
7.11.3 Custom Chip Connections Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.11.4 Custom Chip Connections Main Business and Markets Served
7.11.5 Custom Chip Connections Recent Developments/Updates
7.12 Yantai YesNo Electronic Materials
7.12.1 Yantai YesNo Electronic Materials Bonding Wires Corporation Information
7.12.2 Yantai YesNo Electronic Materials Bonding Wires Product Portfolio
7.12.3 Yantai YesNo Electronic Materials Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Yantai YesNo Electronic Materials Main Business and Markets Served
7.12.5 Yantai YesNo Electronic Materials Recent Developments/Updates
7.13 World Star Electronic Material Co.,Ltd.
7.13.1 World Star Electronic Material Co.,Ltd. Bonding Wires Corporation Information
7.13.2 World Star Electronic Material Co.,Ltd. Bonding Wires Product Portfolio
7.13.3 World Star Electronic Material Co.,Ltd. Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.13.4 World Star Electronic Material Co.,Ltd. Main Business and Markets Served
7.13.5 World Star Electronic Material Co.,Ltd. Recent Developments/Updates
7.14 Nichetech
7.14.1 Nichetech Bonding Wires Corporation Information
7.14.2 Nichetech Bonding Wires Product Portfolio
7.14.3 Nichetech Bonding Wires Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Nichetech Main Business and Markets Served
7.14.5 Nichetech Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Bonding Wires Industry Chain Analysis
8.2 Bonding Wires Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Bonding Wires Production Mode & Process
8.4 Bonding Wires Sales and Marketing
8.4.1 Bonding Wires Sales Channels
8.4.2 Bonding Wires Distributors
8.5 Bonding Wires Customers
9 Bonding Wires Market Dynamics
9.1 Bonding Wires Industry Trends
9.2 Bonding Wires Market Drivers
9.3 Bonding Wires Market Challenges
9.4 Bonding Wires Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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