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Global Chip Encapsulation Material Market Research Report 2025
Synopsis
The global Chip Encapsulation Material market was valued at US$ 23780 million in 2023 and is anticipated to reach US$ 34470 million by 2030, witnessing a CAGR of 4.9% during the forecast period 2024-2030.
Global key players of chip encapsulation material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, etc. Global top five manufacturers hold a share over 19%. In terms of product, substrate is the largest segment, with a share over 32%. And in terms of application, the largest application is consumer electronics, with a share over 35%.
This report aims to provide a comprehensive presentation of the global market for Chip Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Encapsulation Material.
Report Scope
The Chip Encapsulation Material market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Encapsulation Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Encapsulation Material companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Segment by Type
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Segment by Application
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Encapsulation Material companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
The global Chip Encapsulation Material market was valued at US$ 23780 million in 2023 and is anticipated to reach US$ 34470 million by 2030, witnessing a CAGR of 4.9% during the forecast period 2024-2030.
Global key players of chip encapsulation material include Shennan Circuit Company Limited, Xingsen Technology, Kangqiang Electronics, Kyocera, etc. Global top five manufacturers hold a share over 19%. In terms of product, substrate is the largest segment, with a share over 32%. And in terms of application, the largest application is consumer electronics, with a share over 35%.
This report aims to provide a comprehensive presentation of the global market for Chip Encapsulation Material, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Encapsulation Material.
Report Scope
The Chip Encapsulation Material market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Encapsulation Material market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Encapsulation Material companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Shennan Circuit Company Limited
Xingsen Technology
Kangqiang Electronics
Kyocera
Mitsui High-tec, Inc.
Chang Wah Technology
Panasonic
Henkel
Sumitomo Bakelite
Heraeus
Tanaka
Segment by Type
Substrates
Lead Frame
Bonding Wires
Encapsulating Resin
Others
Segment by Application
Consumer Electronics
Automotive Electronics
IT and Communication Industry
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Encapsulation Material companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Encapsulation Material Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Substrates
1.2.3 Lead Frame
1.2.4 Bonding Wires
1.2.5 Encapsulating Resin
1.2.6 Others
1.3 Market by Application
1.3.1 Global Chip Encapsulation Material Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automotive Electronics
1.3.4 IT and Communication Industry
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Encapsulation Material Market Perspective (2019-2030)
2.2 Chip Encapsulation Material Growth Trends by Region
2.2.1 Global Chip Encapsulation Material Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Encapsulation Material Historic Market Size by Region (2019-2024)
2.2.3 Chip Encapsulation Material Forecasted Market Size by Region (2025-2030)
2.3 Chip Encapsulation Material Market Dynamics
2.3.1 Chip Encapsulation Material Industry Trends
2.3.2 Chip Encapsulation Material Market Drivers
2.3.3 Chip Encapsulation Material Market Challenges
2.3.4 Chip Encapsulation Material Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip Encapsulation Material Players by Revenue
3.1.1 Global Top Chip Encapsulation Material Players by Revenue (2019-2024)
3.1.2 Global Chip Encapsulation Material Revenue Market Share by Players (2019-2024)
3.2 Global Chip Encapsulation Material Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip Encapsulation Material Revenue
3.4 Global Chip Encapsulation Material Market Concentration Ratio
3.4.1 Global Chip Encapsulation Material Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Encapsulation Material Revenue in 2023
3.5 Chip Encapsulation Material Key Players Head office and Area Served
3.6 Key Players Chip Encapsulation Material Product Solution and Service
3.7 Date of Enter into Chip Encapsulation Material Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Encapsulation Material Breakdown Data by Type
4.1 Global Chip Encapsulation Material Historic Market Size by Type (2019-2024)
4.2 Global Chip Encapsulation Material Forecasted Market Size by Type (2025-2030)
5 Chip Encapsulation Material Breakdown Data by Application
5.1 Global Chip Encapsulation Material Historic Market Size by Application (2019-2024)
5.2 Global Chip Encapsulation Material Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Encapsulation Material Market Size (2019-2030)
6.2 North America Chip Encapsulation Material Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Chip Encapsulation Material Market Size by Country (2019-2024)
6.4 North America Chip Encapsulation Material Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip Encapsulation Material Market Size (2019-2030)
7.2 Europe Chip Encapsulation Material Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Chip Encapsulation Material Market Size by Country (2019-2024)
7.4 Europe Chip Encapsulation Material Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip Encapsulation Material Market Size (2019-2030)
8.2 Asia-Pacific Chip Encapsulation Material Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Chip Encapsulation Material Market Size by Region (2019-2024)
8.4 Asia-Pacific Chip Encapsulation Material Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip Encapsulation Material Market Size (2019-2030)
9.2 Latin America Chip Encapsulation Material Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Chip Encapsulation Material Market Size by Country (2019-2024)
9.4 Latin America Chip Encapsulation Material Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip Encapsulation Material Market Size (2019-2030)
10.2 Middle East & Africa Chip Encapsulation Material Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Chip Encapsulation Material Market Size by Country (2019-2024)
10.4 Middle East & Africa Chip Encapsulation Material Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Shennan Circuit Company Limited
11.1.1 Shennan Circuit Company Limited Company Detail
11.1.2 Shennan Circuit Company Limited Business Overview
11.1.3 Shennan Circuit Company Limited Chip Encapsulation Material Introduction
11.1.4 Shennan Circuit Company Limited Revenue in Chip Encapsulation Material Business (2019-2024)
11.1.5 Shennan Circuit Company Limited Recent Development
11.2 Xingsen Technology
11.2.1 Xingsen Technology Company Detail
11.2.2 Xingsen Technology Business Overview
11.2.3 Xingsen Technology Chip Encapsulation Material Introduction
11.2.4 Xingsen Technology Revenue in Chip Encapsulation Material Business (2019-2024)
11.2.5 Xingsen Technology Recent Development
11.3 Kangqiang Electronics
11.3.1 Kangqiang Electronics Company Detail
11.3.2 Kangqiang Electronics Business Overview
11.3.3 Kangqiang Electronics Chip Encapsulation Material Introduction
11.3.4 Kangqiang Electronics Revenue in Chip Encapsulation Material Business (2019-2024)
11.3.5 Kangqiang Electronics Recent Development
11.4 Kyocera
11.4.1 Kyocera Company Detail
11.4.2 Kyocera Business Overview
11.4.3 Kyocera Chip Encapsulation Material Introduction
11.4.4 Kyocera Revenue in Chip Encapsulation Material Business (2019-2024)
11.4.5 Kyocera Recent Development
11.5 Mitsui High-tec, Inc.
11.5.1 Mitsui High-tec, Inc. Company Detail
11.5.2 Mitsui High-tec, Inc. Business Overview
11.5.3 Mitsui High-tec, Inc. Chip Encapsulation Material Introduction
11.5.4 Mitsui High-tec, Inc. Revenue in Chip Encapsulation Material Business (2019-2024)
11.5.5 Mitsui High-tec, Inc. Recent Development
11.6 Chang Wah Technology
11.6.1 Chang Wah Technology Company Detail
11.6.2 Chang Wah Technology Business Overview
11.6.3 Chang Wah Technology Chip Encapsulation Material Introduction
11.6.4 Chang Wah Technology Revenue in Chip Encapsulation Material Business (2019-2024)
11.6.5 Chang Wah Technology Recent Development
11.7 Panasonic
11.7.1 Panasonic Company Detail
11.7.2 Panasonic Business Overview
11.7.3 Panasonic Chip Encapsulation Material Introduction
11.7.4 Panasonic Revenue in Chip Encapsulation Material Business (2019-2024)
11.7.5 Panasonic Recent Development
11.8 Henkel
11.8.1 Henkel Company Detail
11.8.2 Henkel Business Overview
11.8.3 Henkel Chip Encapsulation Material Introduction
11.8.4 Henkel Revenue in Chip Encapsulation Material Business (2019-2024)
11.8.5 Henkel Recent Development
11.9 Sumitomo Bakelite
11.9.1 Sumitomo Bakelite Company Detail
11.9.2 Sumitomo Bakelite Business Overview
11.9.3 Sumitomo Bakelite Chip Encapsulation Material Introduction
11.9.4 Sumitomo Bakelite Revenue in Chip Encapsulation Material Business (2019-2024)
11.9.5 Sumitomo Bakelite Recent Development
11.10 Heraeus
11.10.1 Heraeus Company Detail
11.10.2 Heraeus Business Overview
11.10.3 Heraeus Chip Encapsulation Material Introduction
11.10.4 Heraeus Revenue in Chip Encapsulation Material Business (2019-2024)
11.10.5 Heraeus Recent Development
11.11 Tanaka
11.11.1 Tanaka Company Detail
11.11.2 Tanaka Business Overview
11.11.3 Tanaka Chip Encapsulation Material Introduction
11.11.4 Tanaka Revenue in Chip Encapsulation Material Business (2019-2024)
11.11.5 Tanaka Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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