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Global Chip Packaging COF Substrate Market Research Report 2025

Global Chip Packaging COF Substrate Market Research Report 2025

Publishing Date : Mar, 2025

License Type :
 

Report Code : 1745602

No of Pages : 89

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Synopsis
The chip packaging COF substrate is the key to the current screen transformation. The main principle is to put the display driver IC chip into the flexible FPC cable, and then use the characteristics of the FPC itself to fold it to the bottom of the screen. Specifically, through thermocompression bonding, the gold bumps of the IC chip and the inner pins on the flexible substrate circuit will be combined. Since the space occupied by the IC chip is released, generally speaking, the width of the lower frame can be reduced by at least 1.5mm.

Global Chip Packaging COF Substrate market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Chip Packaging COF Substrate market research.

Key manufacturers engaged in the Chip Packaging COF Substrate industry include STEMCO, JMCT, LGIT, FLEXCEED, Chipbond, Shenzhen Danbond Technology Co.Ltd, Leader-Tech Electronics (Shenzhen) Co.,Ltd and Suzhou Hengmairui Material Technology Co., Ltd, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.

For production bases, global Chip Packaging COF Substrate production is dominated by and . The two regions contributed to % production share globally in 2022.

When refers to consumption region, % volume of Chip Packaging COF Substrate were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Chip Packaging COF Substrate market and estimated to attract more attentions from industry insiders and investors.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Chip Packaging COF Substrate market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company

  • STEMCO
  • JMCT
  • LGIT
  • FLEXCEED
  • Chipbond
  • Shenzhen Danbond Technology Co.Ltd
  • Leader-Tech Electronics (Shenzhen) Co.,Ltd
  • Suzhou Hengmairui Material Technology Co., Ltd

Segment by Type

  • Single Layer
  • Double Layer

Segment by Application

  • LCD TV
  • Laptop
  • Cell Phone
  • MP3
  • Others

Production by Region

  • North America
  • Europe
  • China
  • Japan
  • South Korea

Consumption by Region

  • North America (United States, Canada)
  • Europe (Germany, France, U.K., Italy, Russia)
  • Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
  • Latin America (Mexico, Brazil,Turkey, GCC Countries)

The Chip Packaging COF Substrate report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Index

1 Chip Packaging COF Substrate Market Overview
1.1 Product Definition
1.2 Chip Packaging COF Substrate Segment by Type
1.2.1 Global Chip Packaging COF Substrate Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Single Layer
1.2.3 Double Layer
1.3 Chip Packaging COF Substrate Segment by Application
1.3.1 Global Chip Packaging COF Substrate Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 LCD TV
1.3.3 Laptop
1.3.4 Cell Phone
1.3.5 MP3
1.3.6 Others
1.4 Global Market Growth Prospects
1.4.1 Global Chip Packaging COF Substrate Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Chip Packaging COF Substrate Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Chip Packaging COF Substrate Production Estimates and Forecasts (2018-2029)
1.4.4 Global Chip Packaging COF Substrate Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Chip Packaging COF Substrate Production Market Share by Manufacturers (2018-2023)
2.2 Global Chip Packaging COF Substrate Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Chip Packaging COF Substrate, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Chip Packaging COF Substrate Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Chip Packaging COF Substrate Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Chip Packaging COF Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Chip Packaging COF Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Chip Packaging COF Substrate, Date of Enter into This Industry
2.9 Chip Packaging COF Substrate Market Competitive Situation and Trends
2.9.1 Chip Packaging COF Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Chip Packaging COF Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Chip Packaging COF Substrate Production by Region
3.1 Global Chip Packaging COF Substrate Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Chip Packaging COF Substrate Production Value by Region (2018-2029)
3.2.1 Global Chip Packaging COF Substrate Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Chip Packaging COF Substrate by Region (2024-2029)
3.3 Global Chip Packaging COF Substrate Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Chip Packaging COF Substrate Production by Region (2018-2029)
3.4.1 Global Chip Packaging COF Substrate Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Chip Packaging COF Substrate by Region (2024-2029)
3.5 Global Chip Packaging COF Substrate Market Price Analysis by Region (2018-2023)
3.6 Global Chip Packaging COF Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Chip Packaging COF Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Chip Packaging COF Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Chip Packaging COF Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Chip Packaging COF Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Chip Packaging COF Substrate Production Value Estimates and Forecasts (2018-2029)
4 Chip Packaging COF Substrate Consumption by Region
4.1 Global Chip Packaging COF Substrate Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Chip Packaging COF Substrate Consumption by Region (2018-2029)
4.2.1 Global Chip Packaging COF Substrate Consumption by Region (2018-2023)
4.2.2 Global Chip Packaging COF Substrate Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Chip Packaging COF Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Chip Packaging COF Substrate Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Chip Packaging COF Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Chip Packaging COF Substrate Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Chip Packaging COF Substrate Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Chip Packaging COF Substrate Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Chip Packaging COF Substrate Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Chip Packaging COF Substrate Production by Type (2018-2029)
5.1.1 Global Chip Packaging COF Substrate Production by Type (2018-2023)
5.1.2 Global Chip Packaging COF Substrate Production by Type (2024-2029)
5.1.3 Global Chip Packaging COF Substrate Production Market Share by Type (2018-2029)
5.2 Global Chip Packaging COF Substrate Production Value by Type (2018-2029)
5.2.1 Global Chip Packaging COF Substrate Production Value by Type (2018-2023)
5.2.2 Global Chip Packaging COF Substrate Production Value by Type (2024-2029)
5.2.3 Global Chip Packaging COF Substrate Production Value Market Share by Type (2018-2029)
5.3 Global Chip Packaging COF Substrate Price by Type (2018-2029)
6 Segment by Application
6.1 Global Chip Packaging COF Substrate Production by Application (2018-2029)
6.1.1 Global Chip Packaging COF Substrate Production by Application (2018-2023)
6.1.2 Global Chip Packaging COF Substrate Production by Application (2024-2029)
6.1.3 Global Chip Packaging COF Substrate Production Market Share by Application (2018-2029)
6.2 Global Chip Packaging COF Substrate Production Value by Application (2018-2029)
6.2.1 Global Chip Packaging COF Substrate Production Value by Application (2018-2023)
6.2.2 Global Chip Packaging COF Substrate Production Value by Application (2024-2029)
6.2.3 Global Chip Packaging COF Substrate Production Value Market Share by Application (2018-2029)
6.3 Global Chip Packaging COF Substrate Price by Application (2018-2029)
7 Key Companies Profiled
7.1 STEMCO
7.1.1 STEMCO Chip Packaging COF Substrate Corporation Information
7.1.2 STEMCO Chip Packaging COF Substrate Product Portfolio
7.1.3 STEMCO Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.1.4 STEMCO Main Business and Markets Served
7.1.5 STEMCO Recent Developments/Updates
7.2 JMCT
7.2.1 JMCT Chip Packaging COF Substrate Corporation Information
7.2.2 JMCT Chip Packaging COF Substrate Product Portfolio
7.2.3 JMCT Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.2.4 JMCT Main Business and Markets Served
7.2.5 JMCT Recent Developments/Updates
7.3 LGIT
7.3.1 LGIT Chip Packaging COF Substrate Corporation Information
7.3.2 LGIT Chip Packaging COF Substrate Product Portfolio
7.3.3 LGIT Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.3.4 LGIT Main Business and Markets Served
7.3.5 LGIT Recent Developments/Updates
7.4 FLEXCEED
7.4.1 FLEXCEED Chip Packaging COF Substrate Corporation Information
7.4.2 FLEXCEED Chip Packaging COF Substrate Product Portfolio
7.4.3 FLEXCEED Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.4.4 FLEXCEED Main Business and Markets Served
7.4.5 FLEXCEED Recent Developments/Updates
7.5 Chipbond
7.5.1 Chipbond Chip Packaging COF Substrate Corporation Information
7.5.2 Chipbond Chip Packaging COF Substrate Product Portfolio
7.5.3 Chipbond Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Chipbond Main Business and Markets Served
7.5.5 Chipbond Recent Developments/Updates
7.6 Shenzhen Danbond Technology Co.Ltd
7.6.1 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Corporation Information
7.6.2 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Product Portfolio
7.6.3 Shenzhen Danbond Technology Co.Ltd Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Shenzhen Danbond Technology Co.Ltd Main Business and Markets Served
7.6.5 Shenzhen Danbond Technology Co.Ltd Recent Developments/Updates
7.7 Leader-Tech Electronics (Shenzhen) Co.,Ltd
7.7.1 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Corporation Information
7.7.2 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Product Portfolio
7.7.3 Leader-Tech Electronics (Shenzhen) Co.,Ltd Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Leader-Tech Electronics (Shenzhen) Co.,Ltd Main Business and Markets Served
7.7.5 Leader-Tech Electronics (Shenzhen) Co.,Ltd Recent Developments/Updates
7.8 Suzhou Hengmairui Material Technology Co., Ltd
7.8.1 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Corporation Information
7.8.2 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Product Portfolio
7.8.3 Suzhou Hengmairui Material Technology Co., Ltd Chip Packaging COF Substrate Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Suzhou Hengmairui Material Technology Co., Ltd Main Business and Markets Served
7.7.5 Suzhou Hengmairui Material Technology Co., Ltd Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Chip Packaging COF Substrate Industry Chain Analysis
8.2 Chip Packaging COF Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Chip Packaging COF Substrate Production Mode & Process
8.4 Chip Packaging COF Substrate Sales and Marketing
8.4.1 Chip Packaging COF Substrate Sales Channels
8.4.2 Chip Packaging COF Substrate Distributors
8.5 Chip Packaging COF Substrate Customers
9 Chip Packaging COF Substrate Market Dynamics
9.1 Chip Packaging COF Substrate Industry Trends
9.2 Chip Packaging COF Substrate Market Drivers
9.3 Chip Packaging COF Substrate Market Challenges
9.4 Chip Packaging COF Substrate Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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