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Global Chip Packaging Market Research Report 2024
Synopsis
Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
The global Chip Packaging market was valued at US$ 31150 million in 2023 and is anticipated to reach US$ 48660 million by 2030, witnessing a CAGR of 6.5% during the forecast period 2024-2030.
By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.
The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.
From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.
This report aims to provide a comprehensive presentation of the global market for Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging.
Report Scope
The Chip Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Segment by Type
Traditional Packaging
Advanced Packaging
Segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
The global Chip Packaging market was valued at US$ 31150 million in 2023 and is anticipated to reach US$ 48660 million by 2030, witnessing a CAGR of 6.5% during the forecast period 2024-2030.
By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.
The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.
From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.
This report aims to provide a comprehensive presentation of the global market for Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging.
Report Scope
The Chip Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Segment by Type
Traditional Packaging
Advanced Packaging
Segment by Application
Automotive and Traffic
Consumer Electronics
Communication
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Packaging companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chip Packaging Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Traditional Packaging
1.2.3 Advanced Packaging
1.3 Market by Application
1.3.1 Global Chip Packaging Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive and Traffic
1.3.3 Consumer Electronics
1.3.4 Communication
1.3.5 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Packaging Market Perspective (2019-2030)
2.2 Chip Packaging Growth Trends by Region
2.2.1 Global Chip Packaging Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Packaging Historic Market Size by Region (2019-2024)
2.2.3 Chip Packaging Forecasted Market Size by Region (2025-2030)
2.3 Chip Packaging Market Dynamics
2.3.1 Chip Packaging Industry Trends
2.3.2 Chip Packaging Market Drivers
2.3.3 Chip Packaging Market Challenges
2.3.4 Chip Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip Packaging Players by Revenue
3.1.1 Global Top Chip Packaging Players by Revenue (2019-2024)
3.1.2 Global Chip Packaging Revenue Market Share by Players (2019-2024)
3.2 Global Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip Packaging Revenue
3.4 Global Chip Packaging Market Concentration Ratio
3.4.1 Global Chip Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Packaging Revenue in 2023
3.5 Chip Packaging Key Players Head office and Area Served
3.6 Key Players Chip Packaging Product Solution and Service
3.7 Date of Enter into Chip Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Packaging Breakdown Data by Type
4.1 Global Chip Packaging Historic Market Size by Type (2019-2024)
4.2 Global Chip Packaging Forecasted Market Size by Type (2025-2030)
5 Chip Packaging Breakdown Data by Application
5.1 Global Chip Packaging Historic Market Size by Application (2019-2024)
5.2 Global Chip Packaging Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Chip Packaging Market Size (2019-2030)
6.2 North America Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Chip Packaging Market Size by Country (2019-2024)
6.4 North America Chip Packaging Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip Packaging Market Size (2019-2030)
7.2 Europe Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Chip Packaging Market Size by Country (2019-2024)
7.4 Europe Chip Packaging Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip Packaging Market Size (2019-2030)
8.2 Asia-Pacific Chip Packaging Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Chip Packaging Market Size by Region (2019-2024)
8.4 Asia-Pacific Chip Packaging Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip Packaging Market Size (2019-2030)
9.2 Latin America Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Chip Packaging Market Size by Country (2019-2024)
9.4 Latin America Chip Packaging Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip Packaging Market Size (2019-2030)
10.2 Middle East & Africa Chip Packaging Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Chip Packaging Market Size by Country (2019-2024)
10.4 Middle East & Africa Chip Packaging Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Group
11.1.1 ASE Group Company Detail
11.1.2 ASE Group Business Overview
11.1.3 ASE Group Chip Packaging Introduction
11.1.4 ASE Group Revenue in Chip Packaging Business (2019-2024)
11.1.5 ASE Group Recent Development
11.2 Amkor Technology
11.2.1 Amkor Technology Company Detail
11.2.2 Amkor Technology Business Overview
11.2.3 Amkor Technology Chip Packaging Introduction
11.2.4 Amkor Technology Revenue in Chip Packaging Business (2019-2024)
11.2.5 Amkor Technology Recent Development
11.3 JCET
11.3.1 JCET Company Detail
11.3.2 JCET Business Overview
11.3.3 JCET Chip Packaging Introduction
11.3.4 JCET Revenue in Chip Packaging Business (2019-2024)
11.3.5 JCET Recent Development
11.4 Siliconware Precision Industries
11.4.1 Siliconware Precision Industries Company Detail
11.4.2 Siliconware Precision Industries Business Overview
11.4.3 Siliconware Precision Industries Chip Packaging Introduction
11.4.4 Siliconware Precision Industries Revenue in Chip Packaging Business (2019-2024)
11.4.5 Siliconware Precision Industries Recent Development
11.5 Powertech Technology
11.5.1 Powertech Technology Company Detail
11.5.2 Powertech Technology Business Overview
11.5.3 Powertech Technology Chip Packaging Introduction
11.5.4 Powertech Technology Revenue in Chip Packaging Business (2019-2024)
11.5.5 Powertech Technology Recent Development
11.6 TongFu Microelectronics
11.6.1 TongFu Microelectronics Company Detail
11.6.2 TongFu Microelectronics Business Overview
11.6.3 TongFu Microelectronics Chip Packaging Introduction
11.6.4 TongFu Microelectronics Revenue in Chip Packaging Business (2019-2024)
11.6.5 TongFu Microelectronics Recent Development
11.7 Tianshui Huatian Technology
11.7.1 Tianshui Huatian Technology Company Detail
11.7.2 Tianshui Huatian Technology Business Overview
11.7.3 Tianshui Huatian Technology Chip Packaging Introduction
11.7.4 Tianshui Huatian Technology Revenue in Chip Packaging Business (2019-2024)
11.7.5 Tianshui Huatian Technology Recent Development
11.8 UTAC
11.8.1 UTAC Company Detail
11.8.2 UTAC Business Overview
11.8.3 UTAC Chip Packaging Introduction
11.8.4 UTAC Revenue in Chip Packaging Business (2019-2024)
11.8.5 UTAC Recent Development
11.9 Chipbond Technology
11.9.1 Chipbond Technology Company Detail
11.9.2 Chipbond Technology Business Overview
11.9.3 Chipbond Technology Chip Packaging Introduction
11.9.4 Chipbond Technology Revenue in Chip Packaging Business (2019-2024)
11.9.5 Chipbond Technology Recent Development
11.10 Hana Micron
11.10.1 Hana Micron Company Detail
11.10.2 Hana Micron Business Overview
11.10.3 Hana Micron Chip Packaging Introduction
11.10.4 Hana Micron Revenue in Chip Packaging Business (2019-2024)
11.10.5 Hana Micron Recent Development
11.11 OSE
11.11.1 OSE Company Detail
11.11.2 OSE Business Overview
11.11.3 OSE Chip Packaging Introduction
11.11.4 OSE Revenue in Chip Packaging Business (2019-2024)
11.11.5 OSE Recent Development
11.12 Walton Advanced Engineering
11.12.1 Walton Advanced Engineering Company Detail
11.12.2 Walton Advanced Engineering Business Overview
11.12.3 Walton Advanced Engineering Chip Packaging Introduction
11.12.4 Walton Advanced Engineering Revenue in Chip Packaging Business (2019-2024)
11.12.5 Walton Advanced Engineering Recent Development
11.13 NEPES
11.13.1 NEPES Company Detail
11.13.2 NEPES Business Overview
11.13.3 NEPES Chip Packaging Introduction
11.13.4 NEPES Revenue in Chip Packaging Business (2019-2024)
11.13.5 NEPES Recent Development
11.14 Unisem
11.14.1 Unisem Company Detail
11.14.2 Unisem Business Overview
11.14.3 Unisem Chip Packaging Introduction
11.14.4 Unisem Revenue in Chip Packaging Business (2019-2024)
11.14.5 Unisem Recent Development
11.15 ChipMOS
11.15.1 ChipMOS Company Detail
11.15.2 ChipMOS Business Overview
11.15.3 ChipMOS Chip Packaging Introduction
11.15.4 ChipMOS Revenue in Chip Packaging Business (2019-2024)
11.15.5 ChipMOS Recent Development
11.16 Signetics
11.16.1 Signetics Company Detail
11.16.2 Signetics Business Overview
11.16.3 Signetics Chip Packaging Introduction
11.16.4 Signetics Revenue in Chip Packaging Business (2019-2024)
11.16.5 Signetics Recent Development
11.17 Carsem
11.17.1 Carsem Company Detail
11.17.2 Carsem Business Overview
11.17.3 Carsem Chip Packaging Introduction
11.17.4 Carsem Revenue in Chip Packaging Business (2019-2024)
11.17.5 Carsem Recent Development
11.18 King Yuan ELECTRONICS
11.18.1 King Yuan ELECTRONICS Company Detail
11.18.2 King Yuan ELECTRONICS Business Overview
11.18.3 King Yuan ELECTRONICS Chip Packaging Introduction
11.18.4 King Yuan ELECTRONICS Revenue in Chip Packaging Business (2019-2024)
11.18.5 King Yuan ELECTRONICS Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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