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Global Chiplet Packaging Technology Market Research Report 2024
Synopsis
Chiplet packaging technology, also known as chiplet-based packaging or chiplet integration, is an advanced semiconductor packaging approach that involves dividing a complex system-on-chip (SoC) or integrated circuit (IC) into smaller functional chiplets. These chiplets are then interconnected and assembled into a single package to create a highly integrated and efficient semiconductor solution. Chiplet packaging aims to address the challenges posed by the increasing complexity and size of modern ICs and enable better performance, scalability, and customization in semiconductor devices.
Global Chiplet Packaging Technology market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Chiplet Packaging Technology market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.51% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Chiplet Packaging Technology market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
AMD
Intel
Marvell
TSMC
NVIDIA
Tongfu Microelectronics
Northrop Grumman
Jiangsu Dagang
Cambrian
Tianshui Huatian Technology
JCET Group
Samsung
ARM
ASE Group
Segment by Type
2D Packaging Technology
2.5D Packaging Technology
3D Packaging Technology
Segment by Application
GPU
CPU
ISP
NPU
VPU
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Chiplet Packaging Technology report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
Chiplet packaging technology, also known as chiplet-based packaging or chiplet integration, is an advanced semiconductor packaging approach that involves dividing a complex system-on-chip (SoC) or integrated circuit (IC) into smaller functional chiplets. These chiplets are then interconnected and assembled into a single package to create a highly integrated and efficient semiconductor solution. Chiplet packaging aims to address the challenges posed by the increasing complexity and size of modern ICs and enable better performance, scalability, and customization in semiconductor devices.
Global Chiplet Packaging Technology market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Chiplet Packaging Technology market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.51% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Chiplet Packaging Technology market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
AMD
Intel
Marvell
TSMC
NVIDIA
Tongfu Microelectronics
Northrop Grumman
Jiangsu Dagang
Cambrian
Tianshui Huatian Technology
JCET Group
Samsung
ARM
ASE Group
Segment by Type
2D Packaging Technology
2.5D Packaging Technology
3D Packaging Technology
Segment by Application
GPU
CPU
ISP
NPU
VPU
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Chiplet Packaging Technology report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Chiplet Packaging Technology Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 2D Packaging Technology
1.2.3 2.5D Packaging Technology
1.2.4 3D Packaging Technology
1.3 Market by Application
1.3.1 Global Chiplet Packaging Technology Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 GPU
1.3.3 CPU
1.3.4 ISP
1.3.5 NPU
1.3.6 VPU
1.3.7 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chiplet Packaging Technology Market Perspective (2018-2029)
2.2 Chiplet Packaging Technology Growth Trends by Region
2.2.1 Global Chiplet Packaging Technology Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Chiplet Packaging Technology Historic Market Size by Region (2018-2023)
2.2.3 Chiplet Packaging Technology Forecasted Market Size by Region (2024-2029)
2.3 Chiplet Packaging Technology Market Dynamics
2.3.1 Chiplet Packaging Technology Industry Trends
2.3.2 Chiplet Packaging Technology Market Drivers
2.3.3 Chiplet Packaging Technology Market Challenges
2.3.4 Chiplet Packaging Technology Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chiplet Packaging Technology Players by Revenue
3.1.1 Global Top Chiplet Packaging Technology Players by Revenue (2018-2023)
3.1.2 Global Chiplet Packaging Technology Revenue Market Share by Players (2018-2023)
3.2 Global Chiplet Packaging Technology Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chiplet Packaging Technology Revenue
3.4 Global Chiplet Packaging Technology Market Concentration Ratio
3.4.1 Global Chiplet Packaging Technology Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chiplet Packaging Technology Revenue in 2022
3.5 Chiplet Packaging Technology Key Players Head office and Area Served
3.6 Key Players Chiplet Packaging Technology Product Solution and Service
3.7 Date of Enter into Chiplet Packaging Technology Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Chiplet Packaging Technology Breakdown Data by Type
4.1 Global Chiplet Packaging Technology Historic Market Size by Type (2018-2023)
4.2 Global Chiplet Packaging Technology Forecasted Market Size by Type (2024-2029)
5 Chiplet Packaging Technology Breakdown Data by Application
5.1 Global Chiplet Packaging Technology Historic Market Size by Application (2018-2023)
5.2 Global Chiplet Packaging Technology Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Chiplet Packaging Technology Market Size (2018-2029)
6.2 North America Chiplet Packaging Technology Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Chiplet Packaging Technology Market Size by Country (2018-2023)
6.4 North America Chiplet Packaging Technology Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chiplet Packaging Technology Market Size (2018-2029)
7.2 Europe Chiplet Packaging Technology Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Chiplet Packaging Technology Market Size by Country (2018-2023)
7.4 Europe Chiplet Packaging Technology Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chiplet Packaging Technology Market Size (2018-2029)
8.2 Asia-Pacific Chiplet Packaging Technology Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Chiplet Packaging Technology Market Size by Region (2018-2023)
8.4 Asia-Pacific Chiplet Packaging Technology Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chiplet Packaging Technology Market Size (2018-2029)
9.2 Latin America Chiplet Packaging Technology Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Chiplet Packaging Technology Market Size by Country (2018-2023)
9.4 Latin America Chiplet Packaging Technology Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chiplet Packaging Technology Market Size (2018-2029)
10.2 Middle East & Africa Chiplet Packaging Technology Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Chiplet Packaging Technology Market Size by Country (2018-2023)
10.4 Middle East & Africa Chiplet Packaging Technology Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 AMD
11.1.1 AMD Company Detail
11.1.2 AMD Business Overview
11.1.3 AMD Chiplet Packaging Technology Introduction
11.1.4 AMD Revenue in Chiplet Packaging Technology Business (2018-2023)
11.1.5 AMD Recent Development
11.2 Intel
11.2.1 Intel Company Detail
11.2.2 Intel Business Overview
11.2.3 Intel Chiplet Packaging Technology Introduction
11.2.4 Intel Revenue in Chiplet Packaging Technology Business (2018-2023)
11.2.5 Intel Recent Development
11.3 Marvell
11.3.1 Marvell Company Detail
11.3.2 Marvell Business Overview
11.3.3 Marvell Chiplet Packaging Technology Introduction
11.3.4 Marvell Revenue in Chiplet Packaging Technology Business (2018-2023)
11.3.5 Marvell Recent Development
11.4 TSMC
11.4.1 TSMC Company Detail
11.4.2 TSMC Business Overview
11.4.3 TSMC Chiplet Packaging Technology Introduction
11.4.4 TSMC Revenue in Chiplet Packaging Technology Business (2018-2023)
11.4.5 TSMC Recent Development
11.5 NVIDIA
11.5.1 NVIDIA Company Detail
11.5.2 NVIDIA Business Overview
11.5.3 NVIDIA Chiplet Packaging Technology Introduction
11.5.4 NVIDIA Revenue in Chiplet Packaging Technology Business (2018-2023)
11.5.5 NVIDIA Recent Development
11.6 Tongfu Microelectronics
11.6.1 Tongfu Microelectronics Company Detail
11.6.2 Tongfu Microelectronics Business Overview
11.6.3 Tongfu Microelectronics Chiplet Packaging Technology Introduction
11.6.4 Tongfu Microelectronics Revenue in Chiplet Packaging Technology Business (2018-2023)
11.6.5 Tongfu Microelectronics Recent Development
11.7 Northrop Grumman
11.7.1 Northrop Grumman Company Detail
11.7.2 Northrop Grumman Business Overview
11.7.3 Northrop Grumman Chiplet Packaging Technology Introduction
11.7.4 Northrop Grumman Revenue in Chiplet Packaging Technology Business (2018-2023)
11.7.5 Northrop Grumman Recent Development
11.8 Jiangsu Dagang
11.8.1 Jiangsu Dagang Company Detail
11.8.2 Jiangsu Dagang Business Overview
11.8.3 Jiangsu Dagang Chiplet Packaging Technology Introduction
11.8.4 Jiangsu Dagang Revenue in Chiplet Packaging Technology Business (2018-2023)
11.8.5 Jiangsu Dagang Recent Development
11.9 Cambrian
11.9.1 Cambrian Company Detail
11.9.2 Cambrian Business Overview
11.9.3 Cambrian Chiplet Packaging Technology Introduction
11.9.4 Cambrian Revenue in Chiplet Packaging Technology Business (2018-2023)
11.9.5 Cambrian Recent Development
11.10 Tianshui Huatian Technology
11.10.1 Tianshui Huatian Technology Company Detail
11.10.2 Tianshui Huatian Technology Business Overview
11.10.3 Tianshui Huatian Technology Chiplet Packaging Technology Introduction
11.10.4 Tianshui Huatian Technology Revenue in Chiplet Packaging Technology Business (2018-2023)
11.10.5 Tianshui Huatian Technology Recent Development
11.11 JCET Group
11.11.1 JCET Group Company Detail
11.11.2 JCET Group Business Overview
11.11.3 JCET Group Chiplet Packaging Technology Introduction
11.11.4 JCET Group Revenue in Chiplet Packaging Technology Business (2018-2023)
11.11.5 JCET Group Recent Development
11.12 Samsung
11.12.1 Samsung Company Detail
11.12.2 Samsung Business Overview
11.12.3 Samsung Chiplet Packaging Technology Introduction
11.12.4 Samsung Revenue in Chiplet Packaging Technology Business (2018-2023)
11.12.5 Samsung Recent Development
11.13 ARM
11.13.1 ARM Company Detail
11.13.2 ARM Business Overview
11.13.3 ARM Chiplet Packaging Technology Introduction
11.13.4 ARM Revenue in Chiplet Packaging Technology Business (2018-2023)
11.13.5 ARM Recent Development
11.14 ASE Group
11.14.1 ASE Group Company Detail
11.14.2 ASE Group Business Overview
11.14.3 ASE Group Chiplet Packaging Technology Introduction
11.14.4 ASE Group Revenue in Chiplet Packaging Technology Business (2018-2023)
11.14.5 ASE Group Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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