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Global CSP Package Substrate Market Research Report 2025
Synopsis
The global market for CSP Package Substrate was valued at US$ 6142 million in the year 2024 and is projected to reach a revised size of US$ 9064 million by 2031, growing at a CAGR of 5.8% during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for CSP Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CSP Package Substrate.
The CSP Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global CSP Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the CSP Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
KYOCERA Corporation
SimmTech
Korea Circuit
SAMSUNG ELECTRO-MECHANICS
SEP Co ., Ltd
Unimicron
Shennan Circuits Company
Shenzhen Fastprint
Feixinwei
CEEPCB
Nan Ya PCB Corporation
Siliconware Precision Industries
IBIDEN
LG Innotek
KINSUS
Daeduck Electronics
ASE Technology
ACCESS
by Type
WBCSP
FCCSP
by Application
Smart Phone
Portable Device
PC Device
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of CSP Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of CSP Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of CSP Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global market for CSP Package Substrate was valued at US$ 6142 million in the year 2024 and is projected to reach a revised size of US$ 9064 million by 2031, growing at a CAGR of 5.8% during the forecast period.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for CSP Package Substrate, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding CSP Package Substrate.
The CSP Package Substrate market size, estimations, and forecasts are provided in terms of output/shipments (K Sqm) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global CSP Package Substrate market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the CSP Package Substrate manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
KYOCERA Corporation
SimmTech
Korea Circuit
SAMSUNG ELECTRO-MECHANICS
SEP Co ., Ltd
Unimicron
Shennan Circuits Company
Shenzhen Fastprint
Feixinwei
CEEPCB
Nan Ya PCB Corporation
Siliconware Precision Industries
IBIDEN
LG Innotek
KINSUS
Daeduck Electronics
ASE Technology
ACCESS
by Type
WBCSP
FCCSP
by Application
Smart Phone
Portable Device
PC Device
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of CSP Package Substrate manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of CSP Package Substrate by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of CSP Package Substrate in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 CSP Package Substrate Market Overview
1.1 Product Definition
1.2 CSP Package Substrate by Type
1.2.1 Global CSP Package Substrate Market Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 WBCSP
1.2.3 FCCSP
1.3 CSP Package Substrate by Application
1.3.1 Global CSP Package Substrate Market Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Smart Phone
1.3.3 Portable Device
1.3.4 PC Device
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global CSP Package Substrate Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global CSP Package Substrate Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global CSP Package Substrate Production Estimates and Forecasts (2020-2031)
1.4.4 Global CSP Package Substrate Market Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global CSP Package Substrate Production Market Share by Manufacturers (2020-2025)
2.2 Global CSP Package Substrate Production Value Market Share by Manufacturers (2020-2025)
2.3 Global Key Players of CSP Package Substrate, Industry Ranking, 2023 VS 2024
2.4 Global CSP Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global CSP Package Substrate Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of CSP Package Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of CSP Package Substrate, Product Offered and Application
2.8 Global Key Manufacturers of CSP Package Substrate, Date of Enter into This Industry
2.9 CSP Package Substrate Market Competitive Situation and Trends
2.9.1 CSP Package Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest CSP Package Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 CSP Package Substrate Production by Region
3.1 Global CSP Package Substrate Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global CSP Package Substrate Production Value by Region (2020-2031)
3.2.1 Global CSP Package Substrate Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of CSP Package Substrate by Region (2026-2031)
3.3 Global CSP Package Substrate Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global CSP Package Substrate Production Volume by Region (2020-2031)
3.4.1 Global CSP Package Substrate Production by Region (2020-2025)
3.4.2 Global Forecasted Production of CSP Package Substrate by Region (2026-2031)
3.5 Global CSP Package Substrate Market Price Analysis by Region (2020-2025)
3.6 Global CSP Package Substrate Production and Value, Year-over-Year Growth
3.6.1 North America CSP Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe CSP Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.3 China CSP Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan CSP Package Substrate Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea CSP Package Substrate Production Value Estimates and Forecasts (2020-2031)
4 CSP Package Substrate Consumption by Region
4.1 Global CSP Package Substrate Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global CSP Package Substrate Consumption by Region (2020-2031)
4.2.1 Global CSP Package Substrate Consumption by Region (2020-2025)
4.2.2 Global CSP Package Substrate Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America CSP Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America CSP Package Substrate Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe CSP Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe CSP Package Substrate Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific CSP Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific CSP Package Substrate Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa CSP Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa CSP Package Substrate Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global CSP Package Substrate Production by Type (2020-2031)
5.1.1 Global CSP Package Substrate Production by Type (2020-2025)
5.1.2 Global CSP Package Substrate Production by Type (2026-2031)
5.1.3 Global CSP Package Substrate Production Market Share by Type (2020-2031)
5.2 Global CSP Package Substrate Production Value by Type (2020-2031)
5.2.1 Global CSP Package Substrate Production Value by Type (2020-2025)
5.2.2 Global CSP Package Substrate Production Value by Type (2026-2031)
5.2.3 Global CSP Package Substrate Production Value Market Share by Type (2020-2031)
5.3 Global CSP Package Substrate Price by Type (2020-2031)
6 Segment by Application
6.1 Global CSP Package Substrate Production by Application (2020-2031)
6.1.1 Global CSP Package Substrate Production by Application (2020-2025)
6.1.2 Global CSP Package Substrate Production by Application (2026-2031)
6.1.3 Global CSP Package Substrate Production Market Share by Application (2020-2031)
6.2 Global CSP Package Substrate Production Value by Application (2020-2031)
6.2.1 Global CSP Package Substrate Production Value by Application (2020-2025)
6.2.2 Global CSP Package Substrate Production Value by Application (2026-2031)
6.2.3 Global CSP Package Substrate Production Value Market Share by Application (2020-2031)
6.3 Global CSP Package Substrate Price by Application (2020-2031)
7 Key Companies Profiled
7.1 KYOCERA Corporation
7.1.1 KYOCERA Corporation CSP Package Substrate Company Information
7.1.2 KYOCERA Corporation CSP Package Substrate Product Portfolio
7.1.3 KYOCERA Corporation CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.1.4 KYOCERA Corporation Main Business and Markets Served
7.1.5 KYOCERA Corporation Recent Developments/Updates
7.2 SimmTech
7.2.1 SimmTech CSP Package Substrate Company Information
7.2.2 SimmTech CSP Package Substrate Product Portfolio
7.2.3 SimmTech CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.2.4 SimmTech Main Business and Markets Served
7.2.5 SimmTech Recent Developments/Updates
7.3 Korea Circuit
7.3.1 Korea Circuit CSP Package Substrate Company Information
7.3.2 Korea Circuit CSP Package Substrate Product Portfolio
7.3.3 Korea Circuit CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Korea Circuit Main Business and Markets Served
7.3.5 Korea Circuit Recent Developments/Updates
7.4 SAMSUNG ELECTRO-MECHANICS
7.4.1 SAMSUNG ELECTRO-MECHANICS CSP Package Substrate Company Information
7.4.2 SAMSUNG ELECTRO-MECHANICS CSP Package Substrate Product Portfolio
7.4.3 SAMSUNG ELECTRO-MECHANICS CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.4.4 SAMSUNG ELECTRO-MECHANICS Main Business and Markets Served
7.4.5 SAMSUNG ELECTRO-MECHANICS Recent Developments/Updates
7.5 SEP Co ., Ltd
7.5.1 SEP Co ., Ltd CSP Package Substrate Company Information
7.5.2 SEP Co ., Ltd CSP Package Substrate Product Portfolio
7.5.3 SEP Co ., Ltd CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.5.4 SEP Co ., Ltd Main Business and Markets Served
7.5.5 SEP Co ., Ltd Recent Developments/Updates
7.6 Unimicron
7.6.1 Unimicron CSP Package Substrate Company Information
7.6.2 Unimicron CSP Package Substrate Product Portfolio
7.6.3 Unimicron CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Unimicron Main Business and Markets Served
7.6.5 Unimicron Recent Developments/Updates
7.7 Shennan Circuits Company
7.7.1 Shennan Circuits Company CSP Package Substrate Company Information
7.7.2 Shennan Circuits Company CSP Package Substrate Product Portfolio
7.7.3 Shennan Circuits Company CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Shennan Circuits Company Main Business and Markets Served
7.7.5 Shennan Circuits Company Recent Developments/Updates
7.8 Shenzhen Fastprint
7.8.1 Shenzhen Fastprint CSP Package Substrate Company Information
7.8.2 Shenzhen Fastprint CSP Package Substrate Product Portfolio
7.8.3 Shenzhen Fastprint CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Shenzhen Fastprint Main Business and Markets Served
7.8.5 Shenzhen Fastprint Recent Developments/Updates
7.9 Feixinwei
7.9.1 Feixinwei CSP Package Substrate Company Information
7.9.2 Feixinwei CSP Package Substrate Product Portfolio
7.9.3 Feixinwei CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Feixinwei Main Business and Markets Served
7.9.5 Feixinwei Recent Developments/Updates
7.10 CEEPCB
7.10.1 CEEPCB CSP Package Substrate Company Information
7.10.2 CEEPCB CSP Package Substrate Product Portfolio
7.10.3 CEEPCB CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.10.4 CEEPCB Main Business and Markets Served
7.10.5 CEEPCB Recent Developments/Updates
7.11 Nan Ya PCB Corporation
7.11.1 Nan Ya PCB Corporation CSP Package Substrate Company Information
7.11.2 Nan Ya PCB Corporation CSP Package Substrate Product Portfolio
7.11.3 Nan Ya PCB Corporation CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Nan Ya PCB Corporation Main Business and Markets Served
7.11.5 Nan Ya PCB Corporation Recent Developments/Updates
7.12 Siliconware Precision Industries
7.12.1 Siliconware Precision Industries CSP Package Substrate Company Information
7.12.2 Siliconware Precision Industries CSP Package Substrate Product Portfolio
7.12.3 Siliconware Precision Industries CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Siliconware Precision Industries Main Business and Markets Served
7.12.5 Siliconware Precision Industries Recent Developments/Updates
7.13 IBIDEN
7.13.1 IBIDEN CSP Package Substrate Company Information
7.13.2 IBIDEN CSP Package Substrate Product Portfolio
7.13.3 IBIDEN CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.13.4 IBIDEN Main Business and Markets Served
7.13.5 IBIDEN Recent Developments/Updates
7.14 LG Innotek
7.14.1 LG Innotek CSP Package Substrate Company Information
7.14.2 LG Innotek CSP Package Substrate Product Portfolio
7.14.3 LG Innotek CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.14.4 LG Innotek Main Business and Markets Served
7.14.5 LG Innotek Recent Developments/Updates
7.15 KINSUS
7.15.1 KINSUS CSP Package Substrate Company Information
7.15.2 KINSUS CSP Package Substrate Product Portfolio
7.15.3 KINSUS CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.15.4 KINSUS Main Business and Markets Served
7.15.5 KINSUS Recent Developments/Updates
7.16 Daeduck Electronics
7.16.1 Daeduck Electronics CSP Package Substrate Company Information
7.16.2 Daeduck Electronics CSP Package Substrate Product Portfolio
7.16.3 Daeduck Electronics CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Daeduck Electronics Main Business and Markets Served
7.16.5 Daeduck Electronics Recent Developments/Updates
7.17 ASE Technology
7.17.1 ASE Technology CSP Package Substrate Company Information
7.17.2 ASE Technology CSP Package Substrate Product Portfolio
7.17.3 ASE Technology CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.17.4 ASE Technology Main Business and Markets Served
7.17.5 ASE Technology Recent Developments/Updates
7.18 ACCESS
7.18.1 ACCESS CSP Package Substrate Company Information
7.18.2 ACCESS CSP Package Substrate Product Portfolio
7.18.3 ACCESS CSP Package Substrate Production, Value, Price and Gross Margin (2020-2025)
7.18.4 ACCESS Main Business and Markets Served
7.18.5 ACCESS Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 CSP Package Substrate Industry Chain Analysis
8.2 CSP Package Substrate Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 CSP Package Substrate Production Mode & Process Analysis
8.4 CSP Package Substrate Sales and Marketing
8.4.1 CSP Package Substrate Sales Channels
8.4.2 CSP Package Substrate Distributors
8.5 CSP Package Substrate Customer Analysis
9 CSP Package Substrate Market Dynamics
9.1 CSP Package Substrate Industry Trends
9.2 CSP Package Substrate Market Drivers
9.3 CSP Package Substrate Market Challenges
9.4 CSP Package Substrate Market Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
List of TablesList of Tables
Table 1. Global CSP Package Substrate Market Value by Type, (US$ Million) & (2024 VS 2031)
Table 2. Global CSP Package Substrate Market Value by Application, (US$ Million) & (2024 VS 2031)
Table 3. Global CSP Package Substrate Production Capacity (K Sqm) by Manufacturers in 2024
Table 4. Global CSP Package Substrate Production by Manufacturers (2020-2025) & (K Sqm)
Table 5. Global CSP Package Substrate Production Market Share by Manufacturers (2020-2025)
Table 6. Global CSP Package Substrate Production Value by Manufacturers (2020-2025) & (US$ Million)
Table 7. Global CSP Package Substrate Production Value Share by Manufacturers (2020-2025)
Table 8. Global Key Players of CSP Package Substrate, Industry Ranking, 2023 VS 2024
Table 9. Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in CSP Package Substrate as of 2024)
Table 10. Global Market CSP Package Substrate Average Price by Manufacturers (US$/Sqm) & (2020-2025)
Table 11. Global Key Manufacturers of CSP Package Substrate, Manufacturing Base Distribution and Headquarters
Table 12. Global Key Manufacturers of CSP Package Substrate, Product Offered and Application
Table 13. Global Key Manufacturers of CSP Package Substrate, Date of Enter into This Industry
Table 14. Global CSP Package Substrate Manufacturers Market Concentration Ratio (CR5 and HHI)
Table 15. Mergers & Acquisitions, Expansion Plans
Table 16. Global CSP Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Table 17. Global CSP Package Substrate Production Value (US$ Million) by Region (2020-2025)
Table 18. Global CSP Package Substrate Production Value Market Share by Region (2020-2025)
Table 19. Global CSP Package Substrate Production Value (US$ Million) Forecast by Region (2026-2031)
Table 20. Global CSP Package Substrate Production Value Market Share Forecast by Region (2026-2031)
Table 21. Global CSP Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)
Table 22. Global CSP Package Substrate Production (K Sqm) by Region (2020-2025)
Table 23. Global CSP Package Substrate Production Market Share by Region (2020-2025)
Table 24. Global CSP Package Substrate Production (K Sqm) Forecast by Region (2026-2031)
Table 25. Global CSP Package Substrate Production Market Share Forecast by Region (2026-2031)
Table 26. Global CSP Package Substrate Market Average Price (US$/Sqm) by Region (2020-2025)
Table 27. Global CSP Package Substrate Market Average Price (US$/Sqm) by Region (2026-2031)
Table 28. Global CSP Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)
Table 29. Global CSP Package Substrate Consumption by Region (2020-2025) & (K Sqm)
Table 30. Global CSP Package Substrate Consumption Market Share by Region (2020-2025)
Table 31. Global CSP Package Substrate Forecasted Consumption by Region (2026-2031) & (K Sqm)
Table 32. Global CSP Package Substrate Forecasted Consumption Market Share by Region (2026-2031)
Table 33. North America CSP Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
Table 34. North America CSP Package Substrate Consumption by Country (2020-2025) & (K Sqm)
Table 35. North America CSP Package Substrate Consumption by Country (2026-2031) & (K Sqm)
Table 36. Europe CSP Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
Table 37. Europe CSP Package Substrate Consumption by Country (2020-2025) & (K Sqm)
Table 38. Europe CSP Package Substrate Consumption by Country (2026-2031) & (K Sqm)
Table 39. Asia Pacific CSP Package Substrate Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (K Sqm)
Table 40. Asia Pacific CSP Package Substrate Consumption by Region (2020-2025) & (K Sqm)
Table 41. Asia Pacific CSP Package Substrate Consumption by Region (2026-2031) & (K Sqm)
Table 42. Latin America, Middle East & Africa CSP Package Substrate Consumption Growth Rate by Country: 2020 VS 2024 VS 2031 (K Sqm)
Table 43. Latin America, Middle East & Africa CSP Package Substrate Consumption by Country (2020-2025) & (K Sqm)
Table 44. Latin America, Middle East & Africa CSP Package Substrate Consumption by Country (2026-2031) & (K Sqm)
Table 45. Global CSP Package Substrate Production (K Sqm) by Type (2020-2025)
Table 46. Global CSP Package Substrate Production (K Sqm) by Type (2026-2031)
Table 47. Global CSP Package Substrate Production Market Share by Type (2020-2025)
Table 48. Global CSP Package Substrate Production Market Share by Type (2026-2031)
Table 49. Global CSP Package Substrate Production Value (US$ Million) by Type (2020-2025)
Table 50. Global CSP Package Substrate Production Value (US$ Million) by Type (2026-2031)
Table 51. Global CSP Package Substrate Production Value Market Share by Type (2020-2025)
Table 52. Global CSP Package Substrate Production Value Market Share by Type (2026-2031)
Table 53. Global CSP Package Substrate Price (US$/Sqm) by Type (2020-2025)
Table 54. Global CSP Package Substrate Price (US$/Sqm) by Type (2026-2031)
Table 55. Global CSP Package Substrate Production (K Sqm) by Application (2020-2025)
Table 56. Global CSP Package Substrate Production (K Sqm) by Application (2026-2031)
Table 57. Global CSP Package Substrate Production Market Share by Application (2020-2025)
Table 58. Global CSP Package Substrate Production Market Share by Application (2026-2031)
Table 59. Global CSP Package Substrate Production Value (US$ Million) by Application (2020-2025)
Table 60. Global CSP Package Substrate Production Value (US$ Million) by Application (2026-2031)
Table 61. Global CSP Package Substrate Production Value Market Share by Application (2020-2025)
Table 62. Global CSP Package Substrate Production Value Market Share by Application (2026-2031)
Table 63. Global CSP Package Substrate Price (US$/Sqm) by Application (2020-2025)
Table 64. Global CSP Package Substrate Price (US$/Sqm) by Application (2026-2031)
Table 65. KYOCERA Corporation CSP Package Substrate Company Information
Table 66. KYOCERA Corporation CSP Package Substrate Specification and Application
Table 67. KYOCERA Corporation CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 68. KYOCERA Corporation Main Business and Markets Served
Table 69. KYOCERA Corporation Recent Developments/Updates
Table 70. SimmTech CSP Package Substrate Company Information
Table 71. SimmTech CSP Package Substrate Specification and Application
Table 72. SimmTech CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 73. SimmTech Main Business and Markets Served
Table 74. SimmTech Recent Developments/Updates
Table 75. Korea Circuit CSP Package Substrate Company Information
Table 76. Korea Circuit CSP Package Substrate Specification and Application
Table 77. Korea Circuit CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 78. Korea Circuit Main Business and Markets Served
Table 79. Korea Circuit Recent Developments/Updates
Table 80. SAMSUNG ELECTRO-MECHANICS CSP Package Substrate Company Information
Table 81. SAMSUNG ELECTRO-MECHANICS CSP Package Substrate Specification and Application
Table 82. SAMSUNG ELECTRO-MECHANICS CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 83. SAMSUNG ELECTRO-MECHANICS Main Business and Markets Served
Table 84. SAMSUNG ELECTRO-MECHANICS Recent Developments/Updates
Table 85. SEP Co ., Ltd CSP Package Substrate Company Information
Table 86. SEP Co ., Ltd CSP Package Substrate Specification and Application
Table 87. SEP Co ., Ltd CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 88. SEP Co ., Ltd Main Business and Markets Served
Table 89. SEP Co ., Ltd Recent Developments/Updates
Table 90. Unimicron CSP Package Substrate Company Information
Table 91. Unimicron CSP Package Substrate Specification and Application
Table 92. Unimicron CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 93. Unimicron Main Business and Markets Served
Table 94. Unimicron Recent Developments/Updates
Table 95. Shennan Circuits Company CSP Package Substrate Company Information
Table 96. Shennan Circuits Company CSP Package Substrate Specification and Application
Table 97. Shennan Circuits Company CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 98. Shennan Circuits Company Main Business and Markets Served
Table 99. Shennan Circuits Company Recent Developments/Updates
Table 100. Shenzhen Fastprint CSP Package Substrate Company Information
Table 101. Shenzhen Fastprint CSP Package Substrate Specification and Application
Table 102. Shenzhen Fastprint CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 103. Shenzhen Fastprint Main Business and Markets Served
Table 104. Shenzhen Fastprint Recent Developments/Updates
Table 105. Feixinwei CSP Package Substrate Company Information
Table 106. Feixinwei CSP Package Substrate Specification and Application
Table 107. Feixinwei CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 108. Feixinwei Main Business and Markets Served
Table 109. Feixinwei Recent Developments/Updates
Table 110. CEEPCB CSP Package Substrate Company Information
Table 111. CEEPCB CSP Package Substrate Specification and Application
Table 112. CEEPCB CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 113. CEEPCB Main Business and Markets Served
Table 114. CEEPCB Recent Developments/Updates
Table 115. Nan Ya PCB Corporation CSP Package Substrate Company Information
Table 116. Nan Ya PCB Corporation CSP Package Substrate Specification and Application
Table 117. Nan Ya PCB Corporation CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 118. Nan Ya PCB Corporation Main Business and Markets Served
Table 119. Nan Ya PCB Corporation Recent Developments/Updates
Table 120. Siliconware Precision Industries CSP Package Substrate Company Information
Table 121. Siliconware Precision Industries CSP Package Substrate Specification and Application
Table 122. Siliconware Precision Industries CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 123. Siliconware Precision Industries Main Business and Markets Served
Table 124. Siliconware Precision Industries Recent Developments/Updates
Table 125. IBIDEN CSP Package Substrate Company Information
Table 126. IBIDEN CSP Package Substrate Specification and Application
Table 127. IBIDEN CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 128. IBIDEN Main Business and Markets Served
Table 129. IBIDEN Recent Developments/Updates
Table 130. LG Innotek CSP Package Substrate Company Information
Table 131. LG Innotek CSP Package Substrate Specification and Application
Table 132. LG Innotek CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 133. LG Innotek Main Business and Markets Served
Table 134. LG Innotek Recent Developments/Updates
Table 135. KINSUS CSP Package Substrate Company Information
Table 136. KINSUS CSP Package Substrate Specification and Application
Table 137. KINSUS CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 138. KINSUS Main Business and Markets Served
Table 139. KINSUS Recent Developments/Updates
Table 140. Daeduck Electronics CSP Package Substrate Company Information
Table 141. Daeduck Electronics CSP Package Substrate Specification and Application
Table 142. Daeduck Electronics CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 143. Daeduck Electronics Main Business and Markets Served
Table 144. Daeduck Electronics Recent Developments/Updates
Table 145. ASE Technology CSP Package Substrate Company Information
Table 146. ASE Technology CSP Package Substrate Specification and Application
Table 147. ASE Technology CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 148. ASE Technology Main Business and Markets Served
Table 149. ASE Technology Recent Developments/Updates
Table 150. ACCESS CSP Package Substrate Company Information
Table 151. ACCESS CSP Package Substrate Specification and Application
Table 152. ACCESS CSP Package Substrate Production (K Sqm), Value (US$ Million), Price (US$/Sqm) and Gross Margin (2020-2025)
Table 153. ACCESS Main Business and Markets Served
Table 154. ACCESS Recent Developments/Updates
Table 155. Key Raw Materials Lists
Table 156. Raw Materials Key Suppliers Lists
Table 157. CSP Package Substrate Distributors List
Table 158. CSP Package Substrate Customers List
Table 159. CSP Package Substrate Market Trends
Table 160. CSP Package Substrate Market Drivers
Table 161. CSP Package Substrate Market Challenges
Table 162. CSP Package Substrate Market Restraints
Table 163. Research Programs/Design for This Report
Table 164. Key Data Information from Secondary Sources
Table 165. Key Data Information from Primary Sources
Table 166. Authors List of This Report
List of Figures
Figure 1. Product Picture of CSP Package Substrate
Figure 2. Global CSP Package Substrate Market Value by Type, (US$ Million) & (2020-2031)
Figure 3. Global CSP Package Substrate Market Share by Type: 2024 VS 2031
Figure 4. WBCSP Product Picture
Figure 5. FCCSP Product Picture
Figure 6. Global CSP Package Substrate Market Value by Application, (US$ Million) & (2020-2031)
Figure 7. Global CSP Package Substrate Market Share by Application: 2024 VS 2031
Figure 8. Smart Phone
Figure 9. Portable Device
Figure 10. PC Device
Figure 11. Others
Figure 12. Global CSP Package Substrate Production Value (US$ Million), 2020 VS 2024 VS 2031
Figure 13. Global CSP Package Substrate Production Value (US$ Million) & (2020-2031)
Figure 14. Global CSP Package Substrate Production Capacity (K Sqm) & (2020-2031)
Figure 15. Global CSP Package Substrate Production (K Sqm) & (2020-2031)
Figure 16. Global CSP Package Substrate Average Price (US$/Sqm) & (2020-2031)
Figure 17. CSP Package Substrate Report Years Considered
Figure 18. CSP Package Substrate Production Share by Manufacturers in 2024
Figure 19. Global CSP Package Substrate Production Value Share by Manufacturers (2024)
Figure 20. CSP Package Substrate Market Share by Company Type (Tier 1, Tier 2, and Tier 3): 2020 VS 2024
Figure 21. The Global 5 and 10 Largest Players: Market Share by CSP Package Substrate Revenue in 2024
Figure 22. Global CSP Package Substrate Production Value by Region: 2020 VS 2024 VS 2031 (US$ Million)
Figure 23. Global CSP Package Substrate Production Value Market Share by Region: 2020 VS 2024 VS 2031
Figure 24. Global CSP Package Substrate Production Comparison by Region: 2020 VS 2024 VS 2031 (K Sqm)
Figure 25. Global CSP Package Substrate Production Market Share by Region: 2020 VS 2024 VS 2031
Figure 26. North America CSP Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 27. Europe CSP Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 28. China CSP Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 29. Japan CSP Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 30. South Korea CSP Package Substrate Production Value (US$ Million) Growth Rate (2020-2031)
Figure 31. Global CSP Package Substrate Consumption by Region: 2020 VS 2024 VS 2031 (K Sqm)
Figure 32. Global CSP Package Substrate Consumption Market Share by Region: 2020 VS 2024 VS 2031
Figure 33. North America CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 34. North America CSP Package Substrate Consumption Market Share by Country (2020-2031)
Figure 35. U.S. CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 36. Canada CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 37. Europe CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 38. Europe CSP Package Substrate Consumption Market Share by Country (2020-2031)
Figure 39. Germany CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 40. France CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 41. U.K. CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 42. Italy CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 43. Netherlands CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 44. Asia Pacific CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 45. Asia Pacific CSP Package Substrate Consumption Market Share by Region (2020-2031)
Figure 46. China CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 47. Japan CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 48. South Korea CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 49. China Taiwan CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 50. Southeast Asia CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 51. India CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 52. Latin America, Middle East & Africa CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 53. Latin America, Middle East & Africa CSP Package Substrate Consumption Market Share by Country (2020-2031)
Figure 54. Mexico CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 55. Brazil CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 56. Israel CSP Package Substrate Consumption and Growth Rate (2020-2031) & (K Sqm)
Figure 57. Global Production Market Share of CSP Package Substrate by Type (2020-2031)
Figure 58. Global Production Value Market Share of CSP Package Substrate by Type (2020-2031)
Figure 59. Global CSP Package Substrate Price (US$/Sqm) by Type (2020-2031)
Figure 60. Global Production Market Share of CSP Package Substrate by Application (2020-2031)
Figure 61. Global Production Value Market Share of CSP Package Substrate by Application (2020-2031)
Figure 62. Global CSP Package Substrate Price (US$/Sqm) by Application (2020-2031)
Figure 63. CSP Package Substrate Value Chain
Figure 64. Channels of Distribution (Direct Vs Distribution)
Figure 65. Bottom-up and Top-down Approaches for This Report
Figure 66. Data Triangulation
Published By : QY Research
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