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Global Die Attach Carrier Substrate Market Research Report 2024
Synopsis
Chip attach carrier substrate refers to the substrate used to attach chips (such as integrated circuit chips) to it. In the electronic manufacturing process, the die attach carrier substrate plays the role of fixing and supporting the chip. Die-attach carrier substrates are usually made of conductive materials such as metals or conductive polymers. It has good electrical and thermal conductivity, which can provide stable electrical connection and heat dissipation. During the die attach process, the die is precisely placed on the carrier substrate and fixed using an appropriate adhesive or soldering process. The carrier substrate may also contain circuit connectors, pins, or other electronic components for connection and integration with other components. The design and manufacture of die-attached carrier substrates need to consider factors such as chip size, pin layout, and heat dissipation requirements. It plays an important role in the manufacture of electronic devices, ensuring the stability, reliability and performance of chips.
Global Die Attach Carrier Substrate market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Die Attach Carrier Substrate market research.
Key manufacturers engaged in the Die Attach Carrier Substrate industry include Kyocera, Shinko Electric Industries, Hitachi Chemical, Sumitomo Bakelite, Mitsui High-tec, Nippon Electric Glass, Toray Industries, Panasonic and LG Innotek, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Die Attach Carrier Substrate production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Die Attach Carrier Substrate were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Die Attach Carrier Substrate market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Die Attach Carrier Substrate market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Kyocera
Shinko Electric Industries
Hitachi Chemical
Sumitomo Bakelite
Mitsui High-tec
Nippon Electric Glass
Toray Industries
Panasonic
LG Innotek
Samsung Electro-Mechanics
Murata Manufacturing
Taiyo Yuden
TDK Corporation
KEMET Corporation
Vishay Intertechnology
Segment by Type
PCB Substrate
Si Substrate
GaAs Substrate
SiC Substrate
Segment by Application
Automobile Industry
Medical Industry
Aerospace Industry
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Die Attach Carrier Substrate report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Chip attach carrier substrate refers to the substrate used to attach chips (such as integrated circuit chips) to it. In the electronic manufacturing process, the die attach carrier substrate plays the role of fixing and supporting the chip. Die-attach carrier substrates are usually made of conductive materials such as metals or conductive polymers. It has good electrical and thermal conductivity, which can provide stable electrical connection and heat dissipation. During the die attach process, the die is precisely placed on the carrier substrate and fixed using an appropriate adhesive or soldering process. The carrier substrate may also contain circuit connectors, pins, or other electronic components for connection and integration with other components. The design and manufacture of die-attached carrier substrates need to consider factors such as chip size, pin layout, and heat dissipation requirements. It plays an important role in the manufacture of electronic devices, ensuring the stability, reliability and performance of chips.
Global Die Attach Carrier Substrate market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Die Attach Carrier Substrate market research.
Key manufacturers engaged in the Die Attach Carrier Substrate industry include Kyocera, Shinko Electric Industries, Hitachi Chemical, Sumitomo Bakelite, Mitsui High-tec, Nippon Electric Glass, Toray Industries, Panasonic and LG Innotek, etc. Among those manufacturers, the top 3 players guaranteed % supply worldwide in 2022.
For production bases, global Die Attach Carrier Substrate production is dominated by and . The two regions contributed to % production share globally in 2022.
When refers to consumption region, % volume of Die Attach Carrier Substrate were sold to North America, Europe and Asia Pacific in 2022. Moreover, China, plays a key role in the whole Die Attach Carrier Substrate market and estimated to attract more attentions from industry insiders and investors.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Die Attach Carrier Substrate market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Kyocera
Shinko Electric Industries
Hitachi Chemical
Sumitomo Bakelite
Mitsui High-tec
Nippon Electric Glass
Toray Industries
Panasonic
LG Innotek
Samsung Electro-Mechanics
Murata Manufacturing
Taiyo Yuden
TDK Corporation
KEMET Corporation
Vishay Intertechnology
Segment by Type
PCB Substrate
Si Substrate
GaAs Substrate
SiC Substrate
Segment by Application
Automobile Industry
Medical Industry
Aerospace Industry
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Die Attach Carrier Substrate report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Die Attach Carrier Substrate Market Overview
1.1 Product Definition
1.2 Die Attach Carrier Substrate Segment by Type
1.2.1 Global Die Attach Carrier Substrate Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 PCB Substrate
1.2.3 Si Substrate
1.2.4 GaAs Substrate
1.2.5 SiC Substrate
1.3 Die Attach Carrier Substrate Segment by Application
1.3.1 Global Die Attach Carrier Substrate Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Automobile Industry
1.3.3 Medical Industry
1.3.4 Aerospace Industry
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Die Attach Carrier Substrate Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Die Attach Carrier Substrate Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Die Attach Carrier Substrate Production Estimates and Forecasts (2018-2029)
1.4.4 Global Die Attach Carrier Substrate Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Die Attach Carrier Substrate Production Market Share by Manufacturers (2018-2023)
2.2 Global Die Attach Carrier Substrate Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Die Attach Carrier Substrate, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Die Attach Carrier Substrate Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Die Attach Carrier Substrate Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Die Attach Carrier Substrate, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Die Attach Carrier Substrate, Product Offered and Application
2.8 Global Key Manufacturers of Die Attach Carrier Substrate, Date of Enter into This Industry
2.9 Die Attach Carrier Substrate Market Competitive Situation and Trends
2.9.1 Die Attach Carrier Substrate Market Concentration Rate
2.9.2 Global 5 and 10 Largest Die Attach Carrier Substrate Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Die Attach Carrier Substrate Production by Region
3.1 Global Die Attach Carrier Substrate Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Die Attach Carrier Substrate Production Value by Region (2018-2029)
3.2.1 Global Die Attach Carrier Substrate Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Die Attach Carrier Substrate by Region (2024-2029)
3.3 Global Die Attach Carrier Substrate Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Die Attach Carrier Substrate Production by Region (2018-2029)
3.4.1 Global Die Attach Carrier Substrate Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Die Attach Carrier Substrate by Region (2024-2029)
3.5 Global Die Attach Carrier Substrate Market Price Analysis by Region (2018-2023)
3.6 Global Die Attach Carrier Substrate Production and Value, Year-over-Year Growth
3.6.1 North America Die Attach Carrier Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Die Attach Carrier Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Die Attach Carrier Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Die Attach Carrier Substrate Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea Die Attach Carrier Substrate Production Value Estimates and Forecasts (2018-2029)
4 Die Attach Carrier Substrate Consumption by Region
4.1 Global Die Attach Carrier Substrate Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Die Attach Carrier Substrate Consumption by Region (2018-2029)
4.2.1 Global Die Attach Carrier Substrate Consumption by Region (2018-2023)
4.2.2 Global Die Attach Carrier Substrate Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Die Attach Carrier Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Die Attach Carrier Substrate Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Die Attach Carrier Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Die Attach Carrier Substrate Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Die Attach Carrier Substrate Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Die Attach Carrier Substrate Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Die Attach Carrier Substrate Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Die Attach Carrier Substrate Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Die Attach Carrier Substrate Production by Type (2018-2029)
5.1.1 Global Die Attach Carrier Substrate Production by Type (2018-2023)
5.1.2 Global Die Attach Carrier Substrate Production by Type (2024-2029)
5.1.3 Global Die Attach Carrier Substrate Production Market Share by Type (2018-2029)
5.2 Global Die Attach Carrier Substrate Production Value by Type (2018-2029)
5.2.1 Global Die Attach Carrier Substrate Production Value by Type (2018-2023)
5.2.2 Global Die Attach Carrier Substrate Production Value by Type (2024-2029)
5.2.3 Global Die Attach Carrier Substrate Production Value Market Share by Type (2018-2029)
5.3 Global Die Attach Carrier Substrate Price by Type (2018-2029)
6 Segment by Application
6.1 Global Die Attach Carrier Substrate Production by Application (2018-2029)
6.1.1 Global Die Attach Carrier Substrate Production by Application (2018-2023)
6.1.2 Global Die Attach Carrier Substrate Production by Application (2024-2029)
6.1.3 Global Die Attach Carrier Substrate Production Market Share by Application (2018-2029)
6.2 Global Die Attach Carrier Substrate Production Value by Application (2018-2029)
6.2.1 Global Die Attach Carrier Substrate Production Value by Application (2018-2023)
6.2.2 Global Die Attach Carrier Substrate Production Value by Application (2024-2029)
6.2.3 Global Die Attach Carrier Substrate Production Value Market Share by Application (2018-2029)
6.3 Global Die Attach Carrier Substrate Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Kyocera
7.1.1 Kyocera Die Attach Carrier Substrate Corporation Information
7.1.2 Kyocera Die Attach Carrier Substrate Product Portfolio
7.1.3 Kyocera Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Kyocera Main Business and Markets Served
7.1.5 Kyocera Recent Developments/Updates
7.2 Shinko Electric Industries
7.2.1 Shinko Electric Industries Die Attach Carrier Substrate Corporation Information
7.2.2 Shinko Electric Industries Die Attach Carrier Substrate Product Portfolio
7.2.3 Shinko Electric Industries Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Shinko Electric Industries Main Business and Markets Served
7.2.5 Shinko Electric Industries Recent Developments/Updates
7.3 Hitachi Chemical
7.3.1 Hitachi Chemical Die Attach Carrier Substrate Corporation Information
7.3.2 Hitachi Chemical Die Attach Carrier Substrate Product Portfolio
7.3.3 Hitachi Chemical Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Hitachi Chemical Main Business and Markets Served
7.3.5 Hitachi Chemical Recent Developments/Updates
7.4 Sumitomo Bakelite
7.4.1 Sumitomo Bakelite Die Attach Carrier Substrate Corporation Information
7.4.2 Sumitomo Bakelite Die Attach Carrier Substrate Product Portfolio
7.4.3 Sumitomo Bakelite Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Sumitomo Bakelite Main Business and Markets Served
7.4.5 Sumitomo Bakelite Recent Developments/Updates
7.5 Mitsui High-tec
7.5.1 Mitsui High-tec Die Attach Carrier Substrate Corporation Information
7.5.2 Mitsui High-tec Die Attach Carrier Substrate Product Portfolio
7.5.3 Mitsui High-tec Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Mitsui High-tec Main Business and Markets Served
7.5.5 Mitsui High-tec Recent Developments/Updates
7.6 Nippon Electric Glass
7.6.1 Nippon Electric Glass Die Attach Carrier Substrate Corporation Information
7.6.2 Nippon Electric Glass Die Attach Carrier Substrate Product Portfolio
7.6.3 Nippon Electric Glass Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Nippon Electric Glass Main Business and Markets Served
7.6.5 Nippon Electric Glass Recent Developments/Updates
7.7 Toray Industries
7.7.1 Toray Industries Die Attach Carrier Substrate Corporation Information
7.7.2 Toray Industries Die Attach Carrier Substrate Product Portfolio
7.7.3 Toray Industries Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Toray Industries Main Business and Markets Served
7.7.5 Toray Industries Recent Developments/Updates
7.8 Panasonic
7.8.1 Panasonic Die Attach Carrier Substrate Corporation Information
7.8.2 Panasonic Die Attach Carrier Substrate Product Portfolio
7.8.3 Panasonic Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Panasonic Main Business and Markets Served
7.7.5 Panasonic Recent Developments/Updates
7.9 LG Innotek
7.9.1 LG Innotek Die Attach Carrier Substrate Corporation Information
7.9.2 LG Innotek Die Attach Carrier Substrate Product Portfolio
7.9.3 LG Innotek Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.9.4 LG Innotek Main Business and Markets Served
7.9.5 LG Innotek Recent Developments/Updates
7.10 Samsung Electro-Mechanics
7.10.1 Samsung Electro-Mechanics Die Attach Carrier Substrate Corporation Information
7.10.2 Samsung Electro-Mechanics Die Attach Carrier Substrate Product Portfolio
7.10.3 Samsung Electro-Mechanics Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Samsung Electro-Mechanics Main Business and Markets Served
7.10.5 Samsung Electro-Mechanics Recent Developments/Updates
7.11 Murata Manufacturing
7.11.1 Murata Manufacturing Die Attach Carrier Substrate Corporation Information
7.11.2 Murata Manufacturing Die Attach Carrier Substrate Product Portfolio
7.11.3 Murata Manufacturing Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Murata Manufacturing Main Business and Markets Served
7.11.5 Murata Manufacturing Recent Developments/Updates
7.12 Taiyo Yuden
7.12.1 Taiyo Yuden Die Attach Carrier Substrate Corporation Information
7.12.2 Taiyo Yuden Die Attach Carrier Substrate Product Portfolio
7.12.3 Taiyo Yuden Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Taiyo Yuden Main Business and Markets Served
7.12.5 Taiyo Yuden Recent Developments/Updates
7.13 TDK Corporation
7.13.1 TDK Corporation Die Attach Carrier Substrate Corporation Information
7.13.2 TDK Corporation Die Attach Carrier Substrate Product Portfolio
7.13.3 TDK Corporation Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.13.4 TDK Corporation Main Business and Markets Served
7.13.5 TDK Corporation Recent Developments/Updates
7.14 KEMET Corporation
7.14.1 KEMET Corporation Die Attach Carrier Substrate Corporation Information
7.14.2 KEMET Corporation Die Attach Carrier Substrate Product Portfolio
7.14.3 KEMET Corporation Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.14.4 KEMET Corporation Main Business and Markets Served
7.14.5 KEMET Corporation Recent Developments/Updates
7.15 Vishay Intertechnology
7.15.1 Vishay Intertechnology Die Attach Carrier Substrate Corporation Information
7.15.2 Vishay Intertechnology Die Attach Carrier Substrate Product Portfolio
7.15.3 Vishay Intertechnology Die Attach Carrier Substrate Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Vishay Intertechnology Main Business and Markets Served
7.15.5 Vishay Intertechnology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Die Attach Carrier Substrate Industry Chain Analysis
8.2 Die Attach Carrier Substrate Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Die Attach Carrier Substrate Production Mode & Process
8.4 Die Attach Carrier Substrate Sales and Marketing
8.4.1 Die Attach Carrier Substrate Sales Channels
8.4.2 Die Attach Carrier Substrate Distributors
8.5 Die Attach Carrier Substrate Customers
9 Die Attach Carrier Substrate Market Dynamics
9.1 Die Attach Carrier Substrate Industry Trends
9.2 Die Attach Carrier Substrate Market Drivers
9.3 Die Attach Carrier Substrate Market Challenges
9.4 Die Attach Carrier Substrate Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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