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Global Display Driver Chip Packaging and Testing Market Research Report 2024
Synopsis
The semiconductor industry chain can be divided into three major links from top to bottom: design, manufacturing, and packaging and testing. Among them, packaging and testing is the last process in the manufacture of integrated circuit products. The process of packaging and testing wafers to obtain independent chips. Packaging and testing mainly includes two links of packaging and testing. Due to the relatively low added value of packaging and testing, high labor intensity, and relatively low entry barriers, the degree of localization of packaging and testing is relatively high. This report mainly studies the packaging and testing of display driver chips.
Global Display Driver Chip Packaging and Testing market is projected to reach US$ 4928.3 million in 2029, increasing from US$ 3176 million in 2022, with the CAGR of 6.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Display Driver Chip Packaging and Testing market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Display Driver Chip Packaging and Testing market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
Segment by Type
Chip Packaging
Chip Testing
Segment by Application
Communication
Consumer Electronics
Vehicle Electronics
Aerospace
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Display Driver Chip Packaging and Testing report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
The semiconductor industry chain can be divided into three major links from top to bottom: design, manufacturing, and packaging and testing. Among them, packaging and testing is the last process in the manufacture of integrated circuit products. The process of packaging and testing wafers to obtain independent chips. Packaging and testing mainly includes two links of packaging and testing. Due to the relatively low added value of packaging and testing, high labor intensity, and relatively low entry barriers, the degree of localization of packaging and testing is relatively high. This report mainly studies the packaging and testing of display driver chips.
Global Display Driver Chip Packaging and Testing market is projected to reach US$ 4928.3 million in 2029, increasing from US$ 3176 million in 2022, with the CAGR of 6.8% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Display Driver Chip Packaging and Testing market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Display Driver Chip Packaging and Testing market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Steco(LG)
LB-Lusem(Samsung)
Chipbond Technology Corporation
IMOS-ChipMOS TECHNOLOGIES INC.
Hefei Chipmore Technology Co.,Ltd.
Union Semiconductor (Hefei) Co., Ltd.
Jiangsu Napace Semiconductor Co., Ltd.
Tongfu Microelectronics Co.,ltd.
JCET Group Co.,Ltd.
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Hitech Semiconductor (Wuxi) Co., Ltd.
Hefei Chipmore Technology
Segment by Type
Chip Packaging
Chip Testing
Segment by Application
Communication
Consumer Electronics
Vehicle Electronics
Aerospace
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Display Driver Chip Packaging and Testing report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Display Driver Chip Packaging and Testing Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Chip Packaging
1.2.3 Chip Testing
1.3 Market by Application
1.3.1 Global Display Driver Chip Packaging and Testing Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Communication
1.3.3 Consumer Electronics
1.3.4 Vehicle Electronics
1.3.5 Aerospace
1.3.6 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Display Driver Chip Packaging and Testing Market Perspective (2018-2029)
2.2 Display Driver Chip Packaging and Testing Growth Trends by Region
2.2.1 Global Display Driver Chip Packaging and Testing Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Display Driver Chip Packaging and Testing Historic Market Size by Region (2018-2023)
2.2.3 Display Driver Chip Packaging and Testing Forecasted Market Size by Region (2024-2029)
2.3 Display Driver Chip Packaging and Testing Market Dynamics
2.3.1 Display Driver Chip Packaging and Testing Industry Trends
2.3.2 Display Driver Chip Packaging and Testing Market Drivers
2.3.3 Display Driver Chip Packaging and Testing Market Challenges
2.3.4 Display Driver Chip Packaging and Testing Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Display Driver Chip Packaging and Testing Players by Revenue
3.1.1 Global Top Display Driver Chip Packaging and Testing Players by Revenue (2018-2023)
3.1.2 Global Display Driver Chip Packaging and Testing Revenue Market Share by Players (2018-2023)
3.2 Global Display Driver Chip Packaging and Testing Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Display Driver Chip Packaging and Testing Revenue
3.4 Global Display Driver Chip Packaging and Testing Market Concentration Ratio
3.4.1 Global Display Driver Chip Packaging and Testing Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Display Driver Chip Packaging and Testing Revenue in 2022
3.5 Display Driver Chip Packaging and Testing Key Players Head office and Area Served
3.6 Key Players Display Driver Chip Packaging and Testing Product Solution and Service
3.7 Date of Enter into Display Driver Chip Packaging and Testing Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Display Driver Chip Packaging and Testing Breakdown Data by Type
4.1 Global Display Driver Chip Packaging and Testing Historic Market Size by Type (2018-2023)
4.2 Global Display Driver Chip Packaging and Testing Forecasted Market Size by Type (2024-2029)
5 Display Driver Chip Packaging and Testing Breakdown Data by Application
5.1 Global Display Driver Chip Packaging and Testing Historic Market Size by Application (2018-2023)
5.2 Global Display Driver Chip Packaging and Testing Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Display Driver Chip Packaging and Testing Market Size (2018-2029)
6.2 North America Display Driver Chip Packaging and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Display Driver Chip Packaging and Testing Market Size by Country (2018-2023)
6.4 North America Display Driver Chip Packaging and Testing Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Display Driver Chip Packaging and Testing Market Size (2018-2029)
7.2 Europe Display Driver Chip Packaging and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Display Driver Chip Packaging and Testing Market Size by Country (2018-2023)
7.4 Europe Display Driver Chip Packaging and Testing Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Display Driver Chip Packaging and Testing Market Size (2018-2029)
8.2 Asia-Pacific Display Driver Chip Packaging and Testing Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Display Driver Chip Packaging and Testing Market Size by Region (2018-2023)
8.4 Asia-Pacific Display Driver Chip Packaging and Testing Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Display Driver Chip Packaging and Testing Market Size (2018-2029)
9.2 Latin America Display Driver Chip Packaging and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Display Driver Chip Packaging and Testing Market Size by Country (2018-2023)
9.4 Latin America Display Driver Chip Packaging and Testing Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Display Driver Chip Packaging and Testing Market Size (2018-2029)
10.2 Middle East & Africa Display Driver Chip Packaging and Testing Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Display Driver Chip Packaging and Testing Market Size by Country (2018-2023)
10.4 Middle East & Africa Display Driver Chip Packaging and Testing Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Steco(LG)
11.1.1 Steco(LG) Company Detail
11.1.2 Steco(LG) Business Overview
11.1.3 Steco(LG) Display Driver Chip Packaging and Testing Introduction
11.1.4 Steco(LG) Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.1.5 Steco(LG) Recent Development
11.2 LB-Lusem(Samsung)
11.2.1 LB-Lusem(Samsung) Company Detail
11.2.2 LB-Lusem(Samsung) Business Overview
11.2.3 LB-Lusem(Samsung) Display Driver Chip Packaging and Testing Introduction
11.2.4 LB-Lusem(Samsung) Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.2.5 LB-Lusem(Samsung) Recent Development
11.3 Chipbond Technology Corporation
11.3.1 Chipbond Technology Corporation Company Detail
11.3.2 Chipbond Technology Corporation Business Overview
11.3.3 Chipbond Technology Corporation Display Driver Chip Packaging and Testing Introduction
11.3.4 Chipbond Technology Corporation Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.3.5 Chipbond Technology Corporation Recent Development
11.4 IMOS-ChipMOS TECHNOLOGIES INC.
11.4.1 IMOS-ChipMOS TECHNOLOGIES INC. Company Detail
11.4.2 IMOS-ChipMOS TECHNOLOGIES INC. Business Overview
11.4.3 IMOS-ChipMOS TECHNOLOGIES INC. Display Driver Chip Packaging and Testing Introduction
11.4.4 IMOS-ChipMOS TECHNOLOGIES INC. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.4.5 IMOS-ChipMOS TECHNOLOGIES INC. Recent Development
11.5 Hefei Chipmore Technology Co.,Ltd.
11.5.1 Hefei Chipmore Technology Co.,Ltd. Company Detail
11.5.2 Hefei Chipmore Technology Co.,Ltd. Business Overview
11.5.3 Hefei Chipmore Technology Co.,Ltd. Display Driver Chip Packaging and Testing Introduction
11.5.4 Hefei Chipmore Technology Co.,Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.5.5 Hefei Chipmore Technology Co.,Ltd. Recent Development
11.6 Union Semiconductor (Hefei) Co., Ltd.
11.6.1 Union Semiconductor (Hefei) Co., Ltd. Company Detail
11.6.2 Union Semiconductor (Hefei) Co., Ltd. Business Overview
11.6.3 Union Semiconductor (Hefei) Co., Ltd. Display Driver Chip Packaging and Testing Introduction
11.6.4 Union Semiconductor (Hefei) Co., Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.6.5 Union Semiconductor (Hefei) Co., Ltd. Recent Development
11.7 Jiangsu Napace Semiconductor Co., Ltd.
11.7.1 Jiangsu Napace Semiconductor Co., Ltd. Company Detail
11.7.2 Jiangsu Napace Semiconductor Co., Ltd. Business Overview
11.7.3 Jiangsu Napace Semiconductor Co., Ltd. Display Driver Chip Packaging and Testing Introduction
11.7.4 Jiangsu Napace Semiconductor Co., Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.7.5 Jiangsu Napace Semiconductor Co., Ltd. Recent Development
11.8 Tongfu Microelectronics Co.,ltd.
11.8.1 Tongfu Microelectronics Co.,ltd. Company Detail
11.8.2 Tongfu Microelectronics Co.,ltd. Business Overview
11.8.3 Tongfu Microelectronics Co.,ltd. Display Driver Chip Packaging and Testing Introduction
11.8.4 Tongfu Microelectronics Co.,ltd. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.8.5 Tongfu Microelectronics Co.,ltd. Recent Development
11.9 JCET Group Co.,Ltd.
11.9.1 JCET Group Co.,Ltd. Company Detail
11.9.2 JCET Group Co.,Ltd. Business Overview
11.9.3 JCET Group Co.,Ltd. Display Driver Chip Packaging and Testing Introduction
11.9.4 JCET Group Co.,Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.9.5 JCET Group Co.,Ltd. Recent Development
11.10 ADVANCED SEMICONDUCTOR ENGINEERING, INC.
11.10.1 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Company Detail
11.10.2 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Business Overview
11.10.3 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Display Driver Chip Packaging and Testing Introduction
11.10.4 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.10.5 ADVANCED SEMICONDUCTOR ENGINEERING, INC. Recent Development
11.11 Hitech Semiconductor (Wuxi) Co., Ltd.
11.11.1 Hitech Semiconductor (Wuxi) Co., Ltd. Company Detail
11.11.2 Hitech Semiconductor (Wuxi) Co., Ltd. Business Overview
11.11.3 Hitech Semiconductor (Wuxi) Co., Ltd. Display Driver Chip Packaging and Testing Introduction
11.11.4 Hitech Semiconductor (Wuxi) Co., Ltd. Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.11.5 Hitech Semiconductor (Wuxi) Co., Ltd. Recent Development
11.12 Hefei Chipmore Technology
11.12.1 Hefei Chipmore Technology Company Detail
11.12.2 Hefei Chipmore Technology Business Overview
11.12.3 Hefei Chipmore Technology Display Driver Chip Packaging and Testing Introduction
11.12.4 Hefei Chipmore Technology Revenue in Display Driver Chip Packaging and Testing Business (2018-2023)
11.12.5 Hefei Chipmore Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Published By : QY Research
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