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Global E-Chuck for Wafer Market Research Report 2024
Synopsis
E-Chuck for Wafer is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
The global E-Chuck for Wafer market was valued at US$ 1793.6 million in 2023 and is anticipated to reach US$ 2411.5 million by 2030, witnessing a CAGR of 4.7% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for E-Chuck for Wafer, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding E-Chuck for Wafer.
Report Scope
The E-Chuck for Wafer market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global E-Chuck for Wafer market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the E-Chuck for Wafer manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Applied Materials
Lam Research
SHINKO
TOTO
Sumitomo Osaka Cement
Creative Technology Corporation
Kyocera
Entegris
NTK CERATEC
NGK Insulators, Ltd.
II-VI M Cubed
Tsukuba Seiko
Calitech
Beijing U-PRECISION TECH CO., LTD.
Segment by Type
Coulomb Type
Johnsen-Rahbek (JR) Type
Segment by Application
300 mm Wafer
200 mm Wafer
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of E-Chuck for Wafer manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of E-Chuck for Wafer by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of E-Chuck for Wafer in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
E-Chuck for Wafer is a tool that clamps an object with the force generated between the electrode and the object by applying a voltage to the electrode. There are two different types of electrostatic clamping methods. One is Coulomb force type that utilizes an insulator as a dielectric material, and the other is Johnson-Rahbek force type that utilizes an attractive force induced by dielectric polarization caused by minute electric current flow across the boundary between an object and a dielectric material. ESCs which are widely used for wafer processing including etching, CVD, PVD, Ashing etc.
The global E-Chuck for Wafer market was valued at US$ 1793.6 million in 2023 and is anticipated to reach US$ 2411.5 million by 2030, witnessing a CAGR of 4.7% during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for E-Chuck for Wafer, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding E-Chuck for Wafer.
Report Scope
The E-Chuck for Wafer market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global E-Chuck for Wafer market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the E-Chuck for Wafer manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Applied Materials
Lam Research
SHINKO
TOTO
Sumitomo Osaka Cement
Creative Technology Corporation
Kyocera
Entegris
NTK CERATEC
NGK Insulators, Ltd.
II-VI M Cubed
Tsukuba Seiko
Calitech
Beijing U-PRECISION TECH CO., LTD.
Segment by Type
Coulomb Type
Johnsen-Rahbek (JR) Type
Segment by Application
300 mm Wafer
200 mm Wafer
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of E-Chuck for Wafer manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of E-Chuck for Wafer by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of E-Chuck for Wafer in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 E-Chuck for Wafer Market Overview
1.1 Product Definition
1.2 E-Chuck for Wafer Segment by Type
1.2.1 Global E-Chuck for Wafer Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Coulomb Type
1.2.3 Johnsen-Rahbek (JR) Type
1.3 E-Chuck for Wafer Segment by Application
1.3.1 Global E-Chuck for Wafer Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 300 mm Wafer
1.3.3 200 mm Wafer
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global E-Chuck for Wafer Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global E-Chuck for Wafer Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global E-Chuck for Wafer Production Estimates and Forecasts (2019-2030)
1.4.4 Global E-Chuck for Wafer Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global E-Chuck for Wafer Production Market Share by Manufacturers (2019-2024)
2.2 Global E-Chuck for Wafer Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of E-Chuck for Wafer, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global E-Chuck for Wafer Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global E-Chuck for Wafer Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of E-Chuck for Wafer, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of E-Chuck for Wafer, Product Offered and Application
2.8 Global Key Manufacturers of E-Chuck for Wafer, Date of Enter into This Industry
2.9 E-Chuck for Wafer Market Competitive Situation and Trends
2.9.1 E-Chuck for Wafer Market Concentration Rate
2.9.2 Global 5 and 10 Largest E-Chuck for Wafer Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 E-Chuck for Wafer Production by Region
3.1 Global E-Chuck for Wafer Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global E-Chuck for Wafer Production Value by Region (2019-2030)
3.2.1 Global E-Chuck for Wafer Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of E-Chuck for Wafer by Region (2025-2030)
3.3 Global E-Chuck for Wafer Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global E-Chuck for Wafer Production by Region (2019-2030)
3.4.1 Global E-Chuck for Wafer Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of E-Chuck for Wafer by Region (2025-2030)
3.5 Global E-Chuck for Wafer Market Price Analysis by Region (2019-2024)
3.6 Global E-Chuck for Wafer Production and Value, Year-over-Year Growth
3.6.1 North America E-Chuck for Wafer Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe E-Chuck for Wafer Production Value Estimates and Forecasts (2019-2030)
3.6.3 China E-Chuck for Wafer Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan E-Chuck for Wafer Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea E-Chuck for Wafer Production Value Estimates and Forecasts (2019-2030)
4 E-Chuck for Wafer Consumption by Region
4.1 Global E-Chuck for Wafer Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global E-Chuck for Wafer Consumption by Region (2019-2030)
4.2.1 Global E-Chuck for Wafer Consumption by Region (2019-2024)
4.2.2 Global E-Chuck for Wafer Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America E-Chuck for Wafer Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America E-Chuck for Wafer Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe E-Chuck for Wafer Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe E-Chuck for Wafer Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific E-Chuck for Wafer Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific E-Chuck for Wafer Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa E-Chuck for Wafer Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa E-Chuck for Wafer Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global E-Chuck for Wafer Production by Type (2019-2030)
5.1.1 Global E-Chuck for Wafer Production by Type (2019-2024)
5.1.2 Global E-Chuck for Wafer Production by Type (2025-2030)
5.1.3 Global E-Chuck for Wafer Production Market Share by Type (2019-2030)
5.2 Global E-Chuck for Wafer Production Value by Type (2019-2030)
5.2.1 Global E-Chuck for Wafer Production Value by Type (2019-2024)
5.2.2 Global E-Chuck for Wafer Production Value by Type (2025-2030)
5.2.3 Global E-Chuck for Wafer Production Value Market Share by Type (2019-2030)
5.3 Global E-Chuck for Wafer Price by Type (2019-2030)
6 Segment by Application
6.1 Global E-Chuck for Wafer Production by Application (2019-2030)
6.1.1 Global E-Chuck for Wafer Production by Application (2019-2024)
6.1.2 Global E-Chuck for Wafer Production by Application (2025-2030)
6.1.3 Global E-Chuck for Wafer Production Market Share by Application (2019-2030)
6.2 Global E-Chuck for Wafer Production Value by Application (2019-2030)
6.2.1 Global E-Chuck for Wafer Production Value by Application (2019-2024)
6.2.2 Global E-Chuck for Wafer Production Value by Application (2025-2030)
6.2.3 Global E-Chuck for Wafer Production Value Market Share by Application (2019-2030)
6.3 Global E-Chuck for Wafer Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Applied Materials
7.1.1 Applied Materials E-Chuck for Wafer Corporation Information
7.1.2 Applied Materials E-Chuck for Wafer Product Portfolio
7.1.3 Applied Materials E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Applied Materials Main Business and Markets Served
7.1.5 Applied Materials Recent Developments/Updates
7.2 Lam Research
7.2.1 Lam Research E-Chuck for Wafer Corporation Information
7.2.2 Lam Research E-Chuck for Wafer Product Portfolio
7.2.3 Lam Research E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Lam Research Main Business and Markets Served
7.2.5 Lam Research Recent Developments/Updates
7.3 SHINKO
7.3.1 SHINKO E-Chuck for Wafer Corporation Information
7.3.2 SHINKO E-Chuck for Wafer Product Portfolio
7.3.3 SHINKO E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.3.4 SHINKO Main Business and Markets Served
7.3.5 SHINKO Recent Developments/Updates
7.4 TOTO
7.4.1 TOTO E-Chuck for Wafer Corporation Information
7.4.2 TOTO E-Chuck for Wafer Product Portfolio
7.4.3 TOTO E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.4.4 TOTO Main Business and Markets Served
7.4.5 TOTO Recent Developments/Updates
7.5 Sumitomo Osaka Cement
7.5.1 Sumitomo Osaka Cement E-Chuck for Wafer Corporation Information
7.5.2 Sumitomo Osaka Cement E-Chuck for Wafer Product Portfolio
7.5.3 Sumitomo Osaka Cement E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Sumitomo Osaka Cement Main Business and Markets Served
7.5.5 Sumitomo Osaka Cement Recent Developments/Updates
7.6 Creative Technology Corporation
7.6.1 Creative Technology Corporation E-Chuck for Wafer Corporation Information
7.6.2 Creative Technology Corporation E-Chuck for Wafer Product Portfolio
7.6.3 Creative Technology Corporation E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Creative Technology Corporation Main Business and Markets Served
7.6.5 Creative Technology Corporation Recent Developments/Updates
7.7 Kyocera
7.7.1 Kyocera E-Chuck for Wafer Corporation Information
7.7.2 Kyocera E-Chuck for Wafer Product Portfolio
7.7.3 Kyocera E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Kyocera Main Business and Markets Served
7.7.5 Kyocera Recent Developments/Updates
7.8 Entegris
7.8.1 Entegris E-Chuck for Wafer Corporation Information
7.8.2 Entegris E-Chuck for Wafer Product Portfolio
7.8.3 Entegris E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Entegris Main Business and Markets Served
7.7.5 Entegris Recent Developments/Updates
7.9 NTK CERATEC
7.9.1 NTK CERATEC E-Chuck for Wafer Corporation Information
7.9.2 NTK CERATEC E-Chuck for Wafer Product Portfolio
7.9.3 NTK CERATEC E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.9.4 NTK CERATEC Main Business and Markets Served
7.9.5 NTK CERATEC Recent Developments/Updates
7.10 NGK Insulators, Ltd.
7.10.1 NGK Insulators, Ltd. E-Chuck for Wafer Corporation Information
7.10.2 NGK Insulators, Ltd. E-Chuck for Wafer Product Portfolio
7.10.3 NGK Insulators, Ltd. E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.10.4 NGK Insulators, Ltd. Main Business and Markets Served
7.10.5 NGK Insulators, Ltd. Recent Developments/Updates
7.11 II-VI M Cubed
7.11.1 II-VI M Cubed E-Chuck for Wafer Corporation Information
7.11.2 II-VI M Cubed E-Chuck for Wafer Product Portfolio
7.11.3 II-VI M Cubed E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.11.4 II-VI M Cubed Main Business and Markets Served
7.11.5 II-VI M Cubed Recent Developments/Updates
7.12 Tsukuba Seiko
7.12.1 Tsukuba Seiko E-Chuck for Wafer Corporation Information
7.12.2 Tsukuba Seiko E-Chuck for Wafer Product Portfolio
7.12.3 Tsukuba Seiko E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Tsukuba Seiko Main Business and Markets Served
7.12.5 Tsukuba Seiko Recent Developments/Updates
7.13 Calitech
7.13.1 Calitech E-Chuck for Wafer Corporation Information
7.13.2 Calitech E-Chuck for Wafer Product Portfolio
7.13.3 Calitech E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.13.4 Calitech Main Business and Markets Served
7.13.5 Calitech Recent Developments/Updates
7.14 Beijing U-PRECISION TECH CO., LTD.
7.14.1 Beijing U-PRECISION TECH CO., LTD. E-Chuck for Wafer Corporation Information
7.14.2 Beijing U-PRECISION TECH CO., LTD. E-Chuck for Wafer Product Portfolio
7.14.3 Beijing U-PRECISION TECH CO., LTD. E-Chuck for Wafer Production, Value, Price and Gross Margin (2019-2024)
7.14.4 Beijing U-PRECISION TECH CO., LTD. Main Business and Markets Served
7.14.5 Beijing U-PRECISION TECH CO., LTD. Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 E-Chuck for Wafer Industry Chain Analysis
8.2 E-Chuck for Wafer Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 E-Chuck for Wafer Production Mode & Process
8.4 E-Chuck for Wafer Sales and Marketing
8.4.1 E-Chuck for Wafer Sales Channels
8.4.2 E-Chuck for Wafer Distributors
8.5 E-Chuck for Wafer Customers
9 E-Chuck for Wafer Market Dynamics
9.1 E-Chuck for Wafer Industry Trends
9.2 E-Chuck for Wafer Market Drivers
9.3 E-Chuck for Wafer Market Challenges
9.4 E-Chuck for Wafer Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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