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Global Embedded Chip Packaging Market Research Report 2024

Global Embedded Chip Packaging Market Research Report 2024

Publishing Date : Oct, 2023

License Type :
 

Report Code : 1797514

No of Pages : 95

Synopsis
Embedding components into substrates using a multi-step manufacturing process.Single-chip, multi-chip, MEMS or passive components can be embedded in an organic laminate substrate in a side-by-side manner. These components are connected by copper-plated vias.
Global Embedded Chip Packaging market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Embedded Chip Packaging market research.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Embedded Chip Packaging market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
ASE
ATS
GE
Shinko
Taiyo Yuden
TDK
Würth Elektronik
Texas Instruments
Siemens
Infineon
ST
Analog Devices
NXP
ATMEL
Samsung
MTK
Allwinner
Rockchip
Segment by Type
Single Chip
Multichip
MEMS
Passive Components
Segment by Application
Tiny package
System-in-Boards
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Embedded Chip Packaging report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. Market Opportunities and Challenges
Chapter 3: Companies’ Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies’ Outline
Chapter 12: Market Conclusions
Chapter 13: Research Methodology and Data Source
Index
1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Embedded Chip Packaging Market Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Single Chip
1.2.3 Multichip
1.2.4 MEMS
1.2.5 Passive Components
1.3 Market by Application
1.3.1 Global Embedded Chip Packaging Market Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Tiny package
1.3.3 System-in-Boards
1.3.4 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Embedded Chip Packaging Market Perspective (2018-2029)
2.2 Embedded Chip Packaging Growth Trends by Region
2.2.1 Global Embedded Chip Packaging Market Size by Region: 2018 VS 2022 VS 2029
2.2.2 Embedded Chip Packaging Historic Market Size by Region (2018-2023)
2.2.3 Embedded Chip Packaging Forecasted Market Size by Region (2024-2029)
2.3 Embedded Chip Packaging Market Dynamics
2.3.1 Embedded Chip Packaging Industry Trends
2.3.2 Embedded Chip Packaging Market Drivers
2.3.3 Embedded Chip Packaging Market Challenges
2.3.4 Embedded Chip Packaging Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Embedded Chip Packaging Players by Revenue
3.1.1 Global Top Embedded Chip Packaging Players by Revenue (2018-2023)
3.1.2 Global Embedded Chip Packaging Revenue Market Share by Players (2018-2023)
3.2 Global Embedded Chip Packaging Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Embedded Chip Packaging Revenue
3.4 Global Embedded Chip Packaging Market Concentration Ratio
3.4.1 Global Embedded Chip Packaging Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Embedded Chip Packaging Revenue in 2022
3.5 Embedded Chip Packaging Key Players Head office and Area Served
3.6 Key Players Embedded Chip Packaging Product Solution and Service
3.7 Date of Enter into Embedded Chip Packaging Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Embedded Chip Packaging Breakdown Data by Type
4.1 Global Embedded Chip Packaging Historic Market Size by Type (2018-2023)
4.2 Global Embedded Chip Packaging Forecasted Market Size by Type (2024-2029)
5 Embedded Chip Packaging Breakdown Data by Application
5.1 Global Embedded Chip Packaging Historic Market Size by Application (2018-2023)
5.2 Global Embedded Chip Packaging Forecasted Market Size by Application (2024-2029)
6 North America
6.1 North America Embedded Chip Packaging Market Size (2018-2029)
6.2 North America Embedded Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Embedded Chip Packaging Market Size by Country (2018-2023)
6.4 North America Embedded Chip Packaging Market Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Embedded Chip Packaging Market Size (2018-2029)
7.2 Europe Embedded Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Embedded Chip Packaging Market Size by Country (2018-2023)
7.4 Europe Embedded Chip Packaging Market Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Embedded Chip Packaging Market Size (2018-2029)
8.2 Asia-Pacific Embedded Chip Packaging Market Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Embedded Chip Packaging Market Size by Region (2018-2023)
8.4 Asia-Pacific Embedded Chip Packaging Market Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Embedded Chip Packaging Market Size (2018-2029)
9.2 Latin America Embedded Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Embedded Chip Packaging Market Size by Country (2018-2023)
9.4 Latin America Embedded Chip Packaging Market Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Embedded Chip Packaging Market Size (2018-2029)
10.2 Middle East & Africa Embedded Chip Packaging Market Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Embedded Chip Packaging Market Size by Country (2018-2023)
10.4 Middle East & Africa Embedded Chip Packaging Market Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Detail
11.1.2 ASE Business Overview
11.1.3 ASE Embedded Chip Packaging Introduction
11.1.4 ASE Revenue in Embedded Chip Packaging Business (2018-2023)
11.1.5 ASE Recent Development
11.2 ATS
11.2.1 ATS Company Detail
11.2.2 ATS Business Overview
11.2.3 ATS Embedded Chip Packaging Introduction
11.2.4 ATS Revenue in Embedded Chip Packaging Business (2018-2023)
11.2.5 ATS Recent Development
11.3 GE
11.3.1 GE Company Detail
11.3.2 GE Business Overview
11.3.3 GE Embedded Chip Packaging Introduction
11.3.4 GE Revenue in Embedded Chip Packaging Business (2018-2023)
11.3.5 GE Recent Development
11.4 Shinko
11.4.1 Shinko Company Detail
11.4.2 Shinko Business Overview
11.4.3 Shinko Embedded Chip Packaging Introduction
11.4.4 Shinko Revenue in Embedded Chip Packaging Business (2018-2023)
11.4.5 Shinko Recent Development
11.5 Taiyo Yuden
11.5.1 Taiyo Yuden Company Detail
11.5.2 Taiyo Yuden Business Overview
11.5.3 Taiyo Yuden Embedded Chip Packaging Introduction
11.5.4 Taiyo Yuden Revenue in Embedded Chip Packaging Business (2018-2023)
11.5.5 Taiyo Yuden Recent Development
11.6 TDK
11.6.1 TDK Company Detail
11.6.2 TDK Business Overview
11.6.3 TDK Embedded Chip Packaging Introduction
11.6.4 TDK Revenue in Embedded Chip Packaging Business (2018-2023)
11.6.5 TDK Recent Development
11.7 Würth Elektronik
11.7.1 Würth Elektronik Company Detail
11.7.2 Würth Elektronik Business Overview
11.7.3 Würth Elektronik Embedded Chip Packaging Introduction
11.7.4 Würth Elektronik Revenue in Embedded Chip Packaging Business (2018-2023)
11.7.5 Würth Elektronik Recent Development
11.8 Texas Instruments
11.8.1 Texas Instruments Company Detail
11.8.2 Texas Instruments Business Overview
11.8.3 Texas Instruments Embedded Chip Packaging Introduction
11.8.4 Texas Instruments Revenue in Embedded Chip Packaging Business (2018-2023)
11.8.5 Texas Instruments Recent Development
11.9 Siemens
11.9.1 Siemens Company Detail
11.9.2 Siemens Business Overview
11.9.3 Siemens Embedded Chip Packaging Introduction
11.9.4 Siemens Revenue in Embedded Chip Packaging Business (2018-2023)
11.9.5 Siemens Recent Development
11.10 Infineon
11.10.1 Infineon Company Detail
11.10.2 Infineon Business Overview
11.10.3 Infineon Embedded Chip Packaging Introduction
11.10.4 Infineon Revenue in Embedded Chip Packaging Business (2018-2023)
11.10.5 Infineon Recent Development
11.11 ST
11.11.1 ST Company Detail
11.11.2 ST Business Overview
11.11.3 ST Embedded Chip Packaging Introduction
11.11.4 ST Revenue in Embedded Chip Packaging Business (2018-2023)
11.11.5 ST Recent Development
11.12 Analog Devices
11.12.1 Analog Devices Company Detail
11.12.2 Analog Devices Business Overview
11.12.3 Analog Devices Embedded Chip Packaging Introduction
11.12.4 Analog Devices Revenue in Embedded Chip Packaging Business (2018-2023)
11.12.5 Analog Devices Recent Development
11.13 NXP
11.13.1 NXP Company Detail
11.13.2 NXP Business Overview
11.13.3 NXP Embedded Chip Packaging Introduction
11.13.4 NXP Revenue in Embedded Chip Packaging Business (2018-2023)
11.13.5 NXP Recent Development
11.14 ATMEL
11.14.1 ATMEL Company Detail
11.14.2 ATMEL Business Overview
11.14.3 ATMEL Embedded Chip Packaging Introduction
11.14.4 ATMEL Revenue in Embedded Chip Packaging Business (2018-2023)
11.14.5 ATMEL Recent Development
11.15 Samsung
11.15.1 Samsung Company Detail
11.15.2 Samsung Business Overview
11.15.3 Samsung Embedded Chip Packaging Introduction
11.15.4 Samsung Revenue in Embedded Chip Packaging Business (2018-2023)
11.15.5 Samsung Recent Development
11.16 MTK
11.16.1 MTK Company Detail
11.16.2 MTK Business Overview
11.16.3 MTK Embedded Chip Packaging Introduction
11.16.4 MTK Revenue in Embedded Chip Packaging Business (2018-2023)
11.16.5 MTK Recent Development
11.17 Allwinner
11.17.1 Allwinner Company Detail
11.17.2 Allwinner Business Overview
11.17.3 Allwinner Embedded Chip Packaging Introduction
11.17.4 Allwinner Revenue in Embedded Chip Packaging Business (2018-2023)
11.17.5 Allwinner Recent Development
11.18 Rockchip
11.18.1 Rockchip Company Detail
11.18.2 Rockchip Business Overview
11.18.3 Rockchip Embedded Chip Packaging Introduction
11.18.4 Rockchip Revenue in Embedded Chip Packaging Business (2018-2023)
11.18.5 Rockchip Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Published By : QY Research

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