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Global Epoxy Molding Compound for Power Device Market Research Report 2025

Global Epoxy Molding Compound for Power Device Market Research Report 2025

Publishing Date : Mar, 2025

License Type :

Report Code : 1765227

No of Pages : 108

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Report Description
Table of Content

Synopsis
Epoxy Molding Compound (EMC) for power devices is a type of material used to encapsulate and protect power electronic devices. It is commonly used in the semiconductor industry for packaging high-power devices such as power transistors, diodes, and integrated circuits. The epoxy molding compound provides electrical insulation, mechanical support, and environmental protection to the power devices.

Global Epoxy Molding Compound for Power Device market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Epoxy Molding Compound for Power Device market research.

Here are some key features and advantages of epoxy molding compound for power devices:

Electrical Insulation: EMC has excellent electrical insulation properties, which help prevent electrical shorts and ensure proper functioning of the power devices.

Thermal Conductivity: Epoxy molding compounds can be formulated with additives to enhance their thermal conductivity. This helps dissipate heat generated by the power devices, ensuring their efficient operation and preventing overheating.

Mechanical Strength: EMC provides mechanical support to the delicate components inside the power devices, protecting them from physical stresses and mechanical shocks.

Chemical Resistance: Epoxy molding compounds exhibit good resistance to various chemicals and solvents, providing protection against corrosive substances that could potentially damage the power devices.

Moisture and Environmental Protection: EMC offers a high level of moisture and environmental protection, shielding the internal components of the power devices from moisture, dust, and other contaminants.

Adhesion and Bonding: Epoxy molding compounds have good adhesion properties, allowing them to bond well with different substrates and provide a secure encapsulation for the power devices.

Processability: EMC can be easily molded and processed into different shapes and sizes, making it suitable for mass production in the semiconductor industry.

Report Scope

This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Epoxy Molding Compound for Power Device market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.

By Company

Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Eternal Materials
Jiangsu zhongpeng new material
Shin-Etsu Chemical
Nagase ChemteX Corporation
Tianjin Kaihua Insulating Material
HHCK
Scienchem
Beijing Sino-tech Electronic Material

Segment by Type

SC
SOT
TO
Other

Segment by Application

Automotive
Consumer Electronics
Industrial
Other

Production by Region

North America
Europe
China
Japan

Consumption by Region

North America (United States, Canada)
Europe (Germany, France, U.K., Italy, Russia)
Asia-Pacific (China, Japan, South Korea, India, Australia, China Taiwan, Indonesia, Thailand, Malaysia)
Latin America (Mexico, Brazil,Turkey, GCC Countries)

The Epoxy Molding Compound for Power Device report covers below items:

Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source

Index

1 Epoxy Molding Compound for Power Device Market Overview
1.1 Product Definition
1.2 Epoxy Molding Compound for Power Device Segment by Type
1.2.1 Global Epoxy Molding Compound for Power Device Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 SC
1.2.3 SOT
1.2.4 TO
1.2.5 Other
1.3 Epoxy Molding Compound for Power Device Segment by Application
1.3.1 Global Epoxy Molding Compound for Power Device Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Automotive
1.3.3 Consumer Electronics
1.3.4 Industrial
1.3.5 Other
1.4 Global Market Growth Prospects
1.4.1 Global Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Epoxy Molding Compound for Power Device Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Epoxy Molding Compound for Power Device Production Estimates and Forecasts (2018-2029)
1.4.4 Global Epoxy Molding Compound for Power Device Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Epoxy Molding Compound for Power Device Production Market Share by Manufacturers (2018-2023)
2.2 Global Epoxy Molding Compound for Power Device Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Epoxy Molding Compound for Power Device, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Epoxy Molding Compound for Power Device Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Epoxy Molding Compound for Power Device Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Epoxy Molding Compound for Power Device, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Epoxy Molding Compound for Power Device, Product Offered and Application
2.8 Global Key Manufacturers of Epoxy Molding Compound for Power Device, Date of Enter into This Industry
2.9 Epoxy Molding Compound for Power Device Market Competitive Situation and Trends
2.9.1 Epoxy Molding Compound for Power Device Market Concentration Rate
2.9.2 Global 5 and 10 Largest Epoxy Molding Compound for Power Device Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Epoxy Molding Compound for Power Device Production by Region
3.1 Global Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Epoxy Molding Compound for Power Device Production Value by Region (2018-2029)
3.2.1 Global Epoxy Molding Compound for Power Device Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Epoxy Molding Compound for Power Device by Region (2024-2029)
3.3 Global Epoxy Molding Compound for Power Device Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Epoxy Molding Compound for Power Device Production by Region (2018-2029)
3.4.1 Global Epoxy Molding Compound for Power Device Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Epoxy Molding Compound for Power Device by Region (2024-2029)
3.5 Global Epoxy Molding Compound for Power Device Market Price Analysis by Region (2018-2023)
3.6 Global Epoxy Molding Compound for Power Device Production and Value, Year-over-Year Growth
3.6.1 North America Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Epoxy Molding Compound for Power Device Production Value Estimates and Forecasts (2018-2029)
4 Epoxy Molding Compound for Power Device Consumption by Region
4.1 Global Epoxy Molding Compound for Power Device Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Epoxy Molding Compound for Power Device Consumption by Region (2018-2029)
4.2.1 Global Epoxy Molding Compound for Power Device Consumption by Region (2018-2023)
4.2.2 Global Epoxy Molding Compound for Power Device Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Epoxy Molding Compound for Power Device Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Epoxy Molding Compound for Power Device Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Epoxy Molding Compound for Power Device Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Epoxy Molding Compound for Power Device Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Epoxy Molding Compound for Power Device Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Epoxy Molding Compound for Power Device Production by Type (2018-2029)
5.1.1 Global Epoxy Molding Compound for Power Device Production by Type (2018-2023)
5.1.2 Global Epoxy Molding Compound for Power Device Production by Type (2024-2029)
5.1.3 Global Epoxy Molding Compound for Power Device Production Market Share by Type (2018-2029)
5.2 Global Epoxy Molding Compound for Power Device Production Value by Type (2018-2029)
5.2.1 Global Epoxy Molding Compound for Power Device Production Value by Type (2018-2023)
5.2.2 Global Epoxy Molding Compound for Power Device Production Value by Type (2024-2029)
5.2.3 Global Epoxy Molding Compound for Power Device Production Value Market Share by Type (2018-2029)
5.3 Global Epoxy Molding Compound for Power Device Price by Type (2018-2029)
6 Segment by Application
6.1 Global Epoxy Molding Compound for Power Device Production by Application (2018-2029)
6.1.1 Global Epoxy Molding Compound for Power Device Production by Application (2018-2023)
6.1.2 Global Epoxy Molding Compound for Power Device Production by Application (2024-2029)
6.1.3 Global Epoxy Molding Compound for Power Device Production Market Share by Application (2018-2029)
6.2 Global Epoxy Molding Compound for Power Device Production Value by Application (2018-2029)
6.2.1 Global Epoxy Molding Compound for Power Device Production Value by Application (2018-2023)
6.2.2 Global Epoxy Molding Compound for Power Device Production Value by Application (2024-2029)
6.2.3 Global Epoxy Molding Compound for Power Device Production Value Market Share by Application (2018-2029)
6.3 Global Epoxy Molding Compound for Power Device Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Sumitomo Bakelite
7.1.1 Sumitomo Bakelite Epoxy Molding Compound for Power Device Corporation Information
7.1.2 Sumitomo Bakelite Epoxy Molding Compound for Power Device Product Portfolio
7.1.3 Sumitomo Bakelite Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Sumitomo Bakelite Main Business and Markets Served
7.1.5 Sumitomo Bakelite Recent Developments/Updates
7.2 Showa Denko
7.2.1 Showa Denko Epoxy Molding Compound for Power Device Corporation Information
7.2.2 Showa Denko Epoxy Molding Compound for Power Device Product Portfolio
7.2.3 Showa Denko Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Showa Denko Main Business and Markets Served
7.2.5 Showa Denko Recent Developments/Updates
7.3 Chang Chun Group
7.3.1 Chang Chun Group Epoxy Molding Compound for Power Device Corporation Information
7.3.2 Chang Chun Group Epoxy Molding Compound for Power Device Product Portfolio
7.3.3 Chang Chun Group Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Chang Chun Group Main Business and Markets Served
7.3.5 Chang Chun Group Recent Developments/Updates
7.4 Hysol Huawei Electronics
7.4.1 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Corporation Information
7.4.2 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Product Portfolio
7.4.3 Hysol Huawei Electronics Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Hysol Huawei Electronics Main Business and Markets Served
7.4.5 Hysol Huawei Electronics Recent Developments/Updates
7.5 Panasonic
7.5.1 Panasonic Epoxy Molding Compound for Power Device Corporation Information
7.5.2 Panasonic Epoxy Molding Compound for Power Device Product Portfolio
7.5.3 Panasonic Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Panasonic Main Business and Markets Served
7.5.5 Panasonic Recent Developments/Updates
7.6 Kyocera
7.6.1 Kyocera Epoxy Molding Compound for Power Device Corporation Information
7.6.2 Kyocera Epoxy Molding Compound for Power Device Product Portfolio
7.6.3 Kyocera Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Kyocera Main Business and Markets Served
7.6.5 Kyocera Recent Developments/Updates
7.7 KCC
7.7.1 KCC Epoxy Molding Compound for Power Device Corporation Information
7.7.2 KCC Epoxy Molding Compound for Power Device Product Portfolio
7.7.3 KCC Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.7.4 KCC Main Business and Markets Served
7.7.5 KCC Recent Developments/Updates
7.8 Eternal Materials
7.8.1 Eternal Materials Epoxy Molding Compound for Power Device Corporation Information
7.8.2 Eternal Materials Epoxy Molding Compound for Power Device Product Portfolio
7.8.3 Eternal Materials Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Eternal Materials Main Business and Markets Served
7.7.5 Eternal Materials Recent Developments/Updates
7.9 Jiangsu zhongpeng new material
7.9.1 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Corporation Information
7.9.2 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Product Portfolio
7.9.3 Jiangsu zhongpeng new material Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Jiangsu zhongpeng new material Main Business and Markets Served
7.9.5 Jiangsu zhongpeng new material Recent Developments/Updates
7.10 Shin-Etsu Chemical
7.10.1 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Corporation Information
7.10.2 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Product Portfolio
7.10.3 Shin-Etsu Chemical Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Shin-Etsu Chemical Main Business and Markets Served
7.10.5 Shin-Etsu Chemical Recent Developments/Updates
7.11 Nagase ChemteX Corporation
7.11.1 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Corporation Information
7.11.2 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Product Portfolio
7.11.3 Nagase ChemteX Corporation Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Nagase ChemteX Corporation Main Business and Markets Served
7.11.5 Nagase ChemteX Corporation Recent Developments/Updates
7.12 Tianjin Kaihua Insulating Material
7.12.1 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Corporation Information
7.12.2 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Product Portfolio
7.12.3 Tianjin Kaihua Insulating Material Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Tianjin Kaihua Insulating Material Main Business and Markets Served
7.12.5 Tianjin Kaihua Insulating Material Recent Developments/Updates
7.13 HHCK
7.13.1 HHCK Epoxy Molding Compound for Power Device Corporation Information
7.13.2 HHCK Epoxy Molding Compound for Power Device Product Portfolio
7.13.3 HHCK Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.13.4 HHCK Main Business and Markets Served
7.13.5 HHCK Recent Developments/Updates
7.14 Scienchem
7.14.1 Scienchem Epoxy Molding Compound for Power Device Corporation Information
7.14.2 Scienchem Epoxy Molding Compound for Power Device Product Portfolio
7.14.3 Scienchem Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Scienchem Main Business and Markets Served
7.14.5 Scienchem Recent Developments/Updates
7.15 Beijing Sino-tech Electronic Material
7.15.1 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Corporation Information
7.15.2 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Product Portfolio
7.15.3 Beijing Sino-tech Electronic Material Epoxy Molding Compound for Power Device Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Beijing Sino-tech Electronic Material Main Business and Markets Served
7.15.5 Beijing Sino-tech Electronic Material Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Epoxy Molding Compound for Power Device Industry Chain Analysis
8.2 Epoxy Molding Compound for Power Device Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Epoxy Molding Compound for Power Device Production Mode & Process
8.4 Epoxy Molding Compound for Power Device Sales and Marketing
8.4.1 Epoxy Molding Compound for Power Device Sales Channels
8.4.2 Epoxy Molding Compound for Power Device Distributors
8.5 Epoxy Molding Compound for Power Device Customers
9 Epoxy Molding Compound for Power Device Market Dynamics
9.1 Epoxy Molding Compound for Power Device Industry Trends
9.2 Epoxy Molding Compound for Power Device Market Drivers
9.3 Epoxy Molding Compound for Power Device Market Challenges
9.4 Epoxy Molding Compound for Power Device Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

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