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Synopsis
The eSIM chip refers to he SIM card insert into the device and updating its configuration through wireless remote download. Compared with the traditional pluggable SIM card, eSIM greatly reduces the card space on the device, and its volume is reduced to 10% of the traditional SIM card. In addition, it is directly embedded in the device in form, realizing the true card-free device, thus increasing the flexibility of product design; Its seismic resistance, high temperature resistance and reliability are stronger, and it can better adapt to the harsh working environment; Not bound to a specific operator and remote configuration support flexible switching of operator data to ensure fast and stable connection.
Global eSIM IC market is projected to reach US$ 7842.5 million in 2029, increasing from US$ 4431 million in 2022, with the CAGR of 8.5% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole eSIM IC market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global eSIM IC market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Samsung Semiconductor
STMicroelectronics
Thales Group
Infineon
Qualcomm
Huawei Hisilicon
Spreadtrum Communications
China Mobile IoT Company Limit
Tongxin Microelectronics Co., Ltd.
Wuhan Tianyu Information Industry Co., Ltd.
Shenzhen Cmpyun
Segment by Type
Contact Chip
Contactless Chip
Segment by Application
Consumer Electronics
Automotive
Other
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The eSIM IC report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
The eSIM chip refers to he SIM card insert into the device and updating its configuration through wireless remote download. Compared with the traditional pluggable SIM card, eSIM greatly reduces the card space on the device, and its volume is reduced to 10% of the traditional SIM card. In addition, it is directly embedded in the device in form, realizing the true card-free device, thus increasing the flexibility of product design; Its seismic resistance, high temperature resistance and reliability are stronger, and it can better adapt to the harsh working environment; Not bound to a specific operator and remote configuration support flexible switching of operator data to ensure fast and stable connection.
Global eSIM IC market is projected to reach US$ 7842.5 million in 2029, increasing from US$ 4431 million in 2022, with the CAGR of 8.5% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole eSIM IC market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global eSIM IC market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Samsung Semiconductor
STMicroelectronics
Thales Group
Infineon
Qualcomm
Huawei Hisilicon
Spreadtrum Communications
China Mobile IoT Company Limit
Tongxin Microelectronics Co., Ltd.
Wuhan Tianyu Information Industry Co., Ltd.
Shenzhen Cmpyun
Segment by Type
Contact Chip
Contactless Chip
Segment by Application
Consumer Electronics
Automotive
Other
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The eSIM IC report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 eSIM IC Market Overview
1.1 Product Definition
1.2 eSIM IC Segment by Type
1.2.1 Global eSIM IC Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Contact Chip
1.2.3 Contactless Chip
1.3 eSIM IC Segment by Application
1.3.1 Global eSIM IC Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Other
1.4 Global Market Growth Prospects
1.4.1 Global eSIM IC Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global eSIM IC Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global eSIM IC Production Estimates and Forecasts (2018-2029)
1.4.4 Global eSIM IC Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global eSIM IC Production Market Share by Manufacturers (2018-2023)
2.2 Global eSIM IC Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of eSIM IC, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global eSIM IC Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global eSIM IC Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of eSIM IC, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of eSIM IC, Product Offered and Application
2.8 Global Key Manufacturers of eSIM IC, Date of Enter into This Industry
2.9 eSIM IC Market Competitive Situation and Trends
2.9.1 eSIM IC Market Concentration Rate
2.9.2 Global 5 and 10 Largest eSIM IC Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 eSIM IC Production by Region
3.1 Global eSIM IC Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global eSIM IC Production Value by Region (2018-2029)
3.2.1 Global eSIM IC Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of eSIM IC by Region (2024-2029)
3.3 Global eSIM IC Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global eSIM IC Production by Region (2018-2029)
3.4.1 Global eSIM IC Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of eSIM IC by Region (2024-2029)
3.5 Global eSIM IC Market Price Analysis by Region (2018-2023)
3.6 Global eSIM IC Production and Value, Year-over-Year Growth
3.6.1 North America eSIM IC Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe eSIM IC Production Value Estimates and Forecasts (2018-2029)
3.6.3 China eSIM IC Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan eSIM IC Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea eSIM IC Production Value Estimates and Forecasts (2018-2029)
4 eSIM IC Consumption by Region
4.1 Global eSIM IC Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global eSIM IC Consumption by Region (2018-2029)
4.2.1 Global eSIM IC Consumption by Region (2018-2023)
4.2.2 Global eSIM IC Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America eSIM IC Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America eSIM IC Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe eSIM IC Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe eSIM IC Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific eSIM IC Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific eSIM IC Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa eSIM IC Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa eSIM IC Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global eSIM IC Production by Type (2018-2029)
5.1.1 Global eSIM IC Production by Type (2018-2023)
5.1.2 Global eSIM IC Production by Type (2024-2029)
5.1.3 Global eSIM IC Production Market Share by Type (2018-2029)
5.2 Global eSIM IC Production Value by Type (2018-2029)
5.2.1 Global eSIM IC Production Value by Type (2018-2023)
5.2.2 Global eSIM IC Production Value by Type (2024-2029)
5.2.3 Global eSIM IC Production Value Market Share by Type (2018-2029)
5.3 Global eSIM IC Price by Type (2018-2029)
6 Segment by Application
6.1 Global eSIM IC Production by Application (2018-2029)
6.1.1 Global eSIM IC Production by Application (2018-2023)
6.1.2 Global eSIM IC Production by Application (2024-2029)
6.1.3 Global eSIM IC Production Market Share by Application (2018-2029)
6.2 Global eSIM IC Production Value by Application (2018-2029)
6.2.1 Global eSIM IC Production Value by Application (2018-2023)
6.2.2 Global eSIM IC Production Value by Application (2024-2029)
6.2.3 Global eSIM IC Production Value Market Share by Application (2018-2029)
6.3 Global eSIM IC Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Samsung Semiconductor
7.1.1 Samsung Semiconductor eSIM IC Corporation Information
7.1.2 Samsung Semiconductor eSIM IC Product Portfolio
7.1.3 Samsung Semiconductor eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Samsung Semiconductor Main Business and Markets Served
7.1.5 Samsung Semiconductor Recent Developments/Updates
7.2 STMicroelectronics
7.2.1 STMicroelectronics eSIM IC Corporation Information
7.2.2 STMicroelectronics eSIM IC Product Portfolio
7.2.3 STMicroelectronics eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.2.4 STMicroelectronics Main Business and Markets Served
7.2.5 STMicroelectronics Recent Developments/Updates
7.3 Thales Group
7.3.1 Thales Group eSIM IC Corporation Information
7.3.2 Thales Group eSIM IC Product Portfolio
7.3.3 Thales Group eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Thales Group Main Business and Markets Served
7.3.5 Thales Group Recent Developments/Updates
7.4 Infineon
7.4.1 Infineon eSIM IC Corporation Information
7.4.2 Infineon eSIM IC Product Portfolio
7.4.3 Infineon eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Infineon Main Business and Markets Served
7.4.5 Infineon Recent Developments/Updates
7.5 Qualcomm
7.5.1 Qualcomm eSIM IC Corporation Information
7.5.2 Qualcomm eSIM IC Product Portfolio
7.5.3 Qualcomm eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Qualcomm Main Business and Markets Served
7.5.5 Qualcomm Recent Developments/Updates
7.6 Huawei Hisilicon
7.6.1 Huawei Hisilicon eSIM IC Corporation Information
7.6.2 Huawei Hisilicon eSIM IC Product Portfolio
7.6.3 Huawei Hisilicon eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Huawei Hisilicon Main Business and Markets Served
7.6.5 Huawei Hisilicon Recent Developments/Updates
7.7 Spreadtrum Communications
7.7.1 Spreadtrum Communications eSIM IC Corporation Information
7.7.2 Spreadtrum Communications eSIM IC Product Portfolio
7.7.3 Spreadtrum Communications eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Spreadtrum Communications Main Business and Markets Served
7.7.5 Spreadtrum Communications Recent Developments/Updates
7.8 China Mobile IoT Company Limit
7.8.1 China Mobile IoT Company Limit eSIM IC Corporation Information
7.8.2 China Mobile IoT Company Limit eSIM IC Product Portfolio
7.8.3 China Mobile IoT Company Limit eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.8.4 China Mobile IoT Company Limit Main Business and Markets Served
7.7.5 China Mobile IoT Company Limit Recent Developments/Updates
7.9 Tongxin Microelectronics Co., Ltd.
7.9.1 Tongxin Microelectronics Co., Ltd. eSIM IC Corporation Information
7.9.2 Tongxin Microelectronics Co., Ltd. eSIM IC Product Portfolio
7.9.3 Tongxin Microelectronics Co., Ltd. eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Tongxin Microelectronics Co., Ltd. Main Business and Markets Served
7.9.5 Tongxin Microelectronics Co., Ltd. Recent Developments/Updates
7.10 Wuhan Tianyu Information Industry Co., Ltd.
7.10.1 Wuhan Tianyu Information Industry Co., Ltd. eSIM IC Corporation Information
7.10.2 Wuhan Tianyu Information Industry Co., Ltd. eSIM IC Product Portfolio
7.10.3 Wuhan Tianyu Information Industry Co., Ltd. eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Wuhan Tianyu Information Industry Co., Ltd. Main Business and Markets Served
7.10.5 Wuhan Tianyu Information Industry Co., Ltd. Recent Developments/Updates
7.11 Shenzhen Cmpyun
7.11.1 Shenzhen Cmpyun eSIM IC Corporation Information
7.11.2 Shenzhen Cmpyun eSIM IC Product Portfolio
7.11.3 Shenzhen Cmpyun eSIM IC Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Shenzhen Cmpyun Main Business and Markets Served
7.11.5 Shenzhen Cmpyun Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 eSIM IC Industry Chain Analysis
8.2 eSIM IC Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 eSIM IC Production Mode & Process
8.4 eSIM IC Sales and Marketing
8.4.1 eSIM IC Sales Channels
8.4.2 eSIM IC Distributors
8.5 eSIM IC Customers
9 eSIM IC Market Dynamics
9.1 eSIM IC Industry Trends
9.2 eSIM IC Market Drivers
9.3 eSIM IC Market Challenges
9.4 eSIM IC Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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