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Global Flip Chip CSP Market Research Report 2024
Synopsis
Flip Chip CSP (FC CSP) utilizes flip chip bumping technology instead of wire bonding to connect the bump pads on the substrate directly to the bonding pads of the chip. With the high density layout and smaller package size, this technology provides cost reductions.
The global Flip Chip CSP market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Flip Chip CSP, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip CSP.
Report Scope
The Flip Chip CSP market size, estimations, and forecasts are provided in terms of output/shipments (K Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Flip Chip CSP market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip Chip CSP manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
SEP Co., Ltd
LG Innotek
Ibiden
Amkor
ASE Group
Korea Circuit
SimmTech Co., Ltd
TTM Technologies
JCET Group
Segment by Type
2-Layer
4-Layer
Segment by Application
Smartphone
Tablet PC
Digital Camera
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip Chip CSP manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip Chip CSP by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip Chip CSP in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Flip Chip CSP (FC CSP) utilizes flip chip bumping technology instead of wire bonding to connect the bump pads on the substrate directly to the bonding pads of the chip. With the high density layout and smaller package size, this technology provides cost reductions.
The global Flip Chip CSP market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report aims to provide a comprehensive presentation of the global market for Flip Chip CSP, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Flip Chip CSP.
Report Scope
The Flip Chip CSP market size, estimations, and forecasts are provided in terms of output/shipments (K Pcs) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Flip Chip CSP market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Flip Chip CSP manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
SEP Co., Ltd
LG Innotek
Ibiden
Amkor
ASE Group
Korea Circuit
SimmTech Co., Ltd
TTM Technologies
JCET Group
Segment by Type
2-Layer
4-Layer
Segment by Application
Smartphone
Tablet PC
Digital Camera
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Flip Chip CSP manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Flip Chip CSP by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Flip Chip CSP in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Flip Chip CSP Market Overview
1.1 Product Definition
1.2 Flip Chip CSP Segment by Type
1.2.1 Global Flip Chip CSP Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 2-Layer
1.2.3 4-Layer
1.3 Flip Chip CSP Segment by Application
1.3.1 Global Flip Chip CSP Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Smartphone
1.3.3 Tablet PC
1.3.4 Digital Camera
1.3.5 Others
1.4 Global Market Growth Prospects
1.4.1 Global Flip Chip CSP Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Flip Chip CSP Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Flip Chip CSP Production Estimates and Forecasts (2019-2030)
1.4.4 Global Flip Chip CSP Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Flip Chip CSP Production Market Share by Manufacturers (2019-2024)
2.2 Global Flip Chip CSP Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Flip Chip CSP, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Flip Chip CSP Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Flip Chip CSP Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Flip Chip CSP, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Flip Chip CSP, Product Offered and Application
2.8 Global Key Manufacturers of Flip Chip CSP, Date of Enter into This Industry
2.9 Flip Chip CSP Market Competitive Situation and Trends
2.9.1 Flip Chip CSP Market Concentration Rate
2.9.2 Global 5 and 10 Largest Flip Chip CSP Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Flip Chip CSP Production by Region
3.1 Global Flip Chip CSP Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Flip Chip CSP Production Value by Region (2019-2030)
3.2.1 Global Flip Chip CSP Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Flip Chip CSP by Region (2025-2030)
3.3 Global Flip Chip CSP Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Flip Chip CSP Production by Region (2019-2030)
3.4.1 Global Flip Chip CSP Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Flip Chip CSP by Region (2025-2030)
3.5 Global Flip Chip CSP Market Price Analysis by Region (2019-2024)
3.6 Global Flip Chip CSP Production and Value, Year-over-Year Growth
3.6.1 North America Flip Chip CSP Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Flip Chip CSP Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Flip Chip CSP Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Flip Chip CSP Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea Flip Chip CSP Production Value Estimates and Forecasts (2019-2030)
4 Flip Chip CSP Consumption by Region
4.1 Global Flip Chip CSP Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Flip Chip CSP Consumption by Region (2019-2030)
4.2.1 Global Flip Chip CSP Consumption by Region (2019-2024)
4.2.2 Global Flip Chip CSP Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Flip Chip CSP Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Flip Chip CSP Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Flip Chip CSP Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Flip Chip CSP Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Flip Chip CSP Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Flip Chip CSP Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Flip Chip CSP Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Flip Chip CSP Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Flip Chip CSP Production by Type (2019-2030)
5.1.1 Global Flip Chip CSP Production by Type (2019-2024)
5.1.2 Global Flip Chip CSP Production by Type (2025-2030)
5.1.3 Global Flip Chip CSP Production Market Share by Type (2019-2030)
5.2 Global Flip Chip CSP Production Value by Type (2019-2030)
5.2.1 Global Flip Chip CSP Production Value by Type (2019-2024)
5.2.2 Global Flip Chip CSP Production Value by Type (2025-2030)
5.2.3 Global Flip Chip CSP Production Value Market Share by Type (2019-2030)
5.3 Global Flip Chip CSP Price by Type (2019-2030)
6 Segment by Application
6.1 Global Flip Chip CSP Production by Application (2019-2030)
6.1.1 Global Flip Chip CSP Production by Application (2019-2024)
6.1.2 Global Flip Chip CSP Production by Application (2025-2030)
6.1.3 Global Flip Chip CSP Production Market Share by Application (2019-2030)
6.2 Global Flip Chip CSP Production Value by Application (2019-2030)
6.2.1 Global Flip Chip CSP Production Value by Application (2019-2024)
6.2.2 Global Flip Chip CSP Production Value by Application (2025-2030)
6.2.3 Global Flip Chip CSP Production Value Market Share by Application (2019-2030)
6.3 Global Flip Chip CSP Price by Application (2019-2030)
7 Key Companies Profiled
7.1 SEP Co., Ltd
7.1.1 SEP Co., Ltd Flip Chip CSP Corporation Information
7.1.2 SEP Co., Ltd Flip Chip CSP Product Portfolio
7.1.3 SEP Co., Ltd Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.1.4 SEP Co., Ltd Main Business and Markets Served
7.1.5 SEP Co., Ltd Recent Developments/Updates
7.2 LG Innotek
7.2.1 LG Innotek Flip Chip CSP Corporation Information
7.2.2 LG Innotek Flip Chip CSP Product Portfolio
7.2.3 LG Innotek Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.2.4 LG Innotek Main Business and Markets Served
7.2.5 LG Innotek Recent Developments/Updates
7.3 Ibiden
7.3.1 Ibiden Flip Chip CSP Corporation Information
7.3.2 Ibiden Flip Chip CSP Product Portfolio
7.3.3 Ibiden Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Ibiden Main Business and Markets Served
7.3.5 Ibiden Recent Developments/Updates
7.4 Amkor
7.4.1 Amkor Flip Chip CSP Corporation Information
7.4.2 Amkor Flip Chip CSP Product Portfolio
7.4.3 Amkor Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Amkor Main Business and Markets Served
7.4.5 Amkor Recent Developments/Updates
7.5 ASE Group
7.5.1 ASE Group Flip Chip CSP Corporation Information
7.5.2 ASE Group Flip Chip CSP Product Portfolio
7.5.3 ASE Group Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.5.4 ASE Group Main Business and Markets Served
7.5.5 ASE Group Recent Developments/Updates
7.6 Korea Circuit
7.6.1 Korea Circuit Flip Chip CSP Corporation Information
7.6.2 Korea Circuit Flip Chip CSP Product Portfolio
7.6.3 Korea Circuit Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Korea Circuit Main Business and Markets Served
7.6.5 Korea Circuit Recent Developments/Updates
7.7 SimmTech Co., Ltd
7.7.1 SimmTech Co., Ltd Flip Chip CSP Corporation Information
7.7.2 SimmTech Co., Ltd Flip Chip CSP Product Portfolio
7.7.3 SimmTech Co., Ltd Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.7.4 SimmTech Co., Ltd Main Business and Markets Served
7.7.5 SimmTech Co., Ltd Recent Developments/Updates
7.8 TTM Technologies
7.8.1 TTM Technologies Flip Chip CSP Corporation Information
7.8.2 TTM Technologies Flip Chip CSP Product Portfolio
7.8.3 TTM Technologies Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.8.4 TTM Technologies Main Business and Markets Served
7.7.5 TTM Technologies Recent Developments/Updates
7.9 JCET Group
7.9.1 JCET Group Flip Chip CSP Corporation Information
7.9.2 JCET Group Flip Chip CSP Product Portfolio
7.9.3 JCET Group Flip Chip CSP Production, Value, Price and Gross Margin (2019-2024)
7.9.4 JCET Group Main Business and Markets Served
7.9.5 JCET Group Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Flip Chip CSP Industry Chain Analysis
8.2 Flip Chip CSP Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Flip Chip CSP Production Mode & Process
8.4 Flip Chip CSP Sales and Marketing
8.4.1 Flip Chip CSP Sales Channels
8.4.2 Flip Chip CSP Distributors
8.5 Flip Chip CSP Customers
9 Flip Chip CSP Market Dynamics
9.1 Flip Chip CSP Industry Trends
9.2 Flip Chip CSP Market Drivers
9.3 Flip Chip CSP Market Challenges
9.4 Flip Chip CSP Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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