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Global FOUP for Thin Wafer Market Research Report 2024

Global FOUP for Thin Wafer Market Research Report 2024

Publishing Date : Jul, 2023

License Type :
 

Report Code : 1748645

No of Pages : 93

Synopsis
300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate. 25 slots type uses for general wafer. 13 slots type can store glass carrier and thin wafer.
Global FOUP for Thin Wafer market is projected to reach US$ 225.9 million in 2029, increasing from US$ 130.2 million in 2022, with the CAGR of 8.2% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole FOUP for Thin Wafer market research.
North America is the largest consumption region of FOUP, with a consumption market share of 19.80% in 2022. The second place is Taiwan (China); following North America with the consumption market share 19.71% in 2022. New investment requires large capital, and it is difficult for small-scale enterprises to enter the industry. At present, the market is occupied by American companies, Japan, Korea and Taiwan. The market is not only influenced by the price, but also influenced by the product performance. The leading companies own the advantages on better performance, more abundant product’s types, better technical and impeccable after-sales service. Consequently, they take the majority of the market share of high-end market. Looking to the future years, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.

For manufacturers that have already entered, they need to constantly raise the technical threshold to prevent more companies from entering; by reducing costs and reducing prices, they will quickly occupy the market, develop incremental customer markets, and establish market share advantages; create a brand image and lay an advantage for entering the consumer goods market.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global FOUP for Thin Wafer market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Entegris
Shin-Etsu Polymer
Miraial
Chuang King Enterprise
Dainichi Shoji
Gudeng Precision
Segment by Materials
PC
PEEK
Others
Segment by Application
IDM
Foundry
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The FOUP for Thin Wafer report covers below items:
Chapter 1: Product Basic Information (Definition, materials and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Materials Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index
1 FOUP for Thin Wafer Market Overview
1.1 Product Definition
1.2 FOUP for Thin Wafer Segment by Materials
1.2.1 Global FOUP for Thin Wafer Market Value Growth Rate Analysis by Materials 2022 VS 2029
1.2.2 PC
1.2.3 PEEK
1.2.4 Others
1.3 FOUP for Thin Wafer Segment by Application
1.3.1 Global FOUP for Thin Wafer Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 IDM
1.3.3 Foundry
1.4 Global Market Growth Prospects
1.4.1 Global FOUP for Thin Wafer Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global FOUP for Thin Wafer Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global FOUP for Thin Wafer Production Estimates and Forecasts (2018-2029)
1.4.4 Global FOUP for Thin Wafer Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global FOUP for Thin Wafer Production Market Share by Manufacturers (2018-2023)
2.2 Global FOUP for Thin Wafer Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of FOUP for Thin Wafer, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global FOUP for Thin Wafer Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global FOUP for Thin Wafer Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of FOUP for Thin Wafer, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of FOUP for Thin Wafer, Product Offered and Application
2.8 Global Key Manufacturers of FOUP for Thin Wafer, Date of Enter into This Industry
2.9 FOUP for Thin Wafer Market Competitive Situation and Trends
2.9.1 FOUP for Thin Wafer Market Concentration Rate
2.9.2 Global 5 and 10 Largest FOUP for Thin Wafer Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 FOUP for Thin Wafer Production by Region
3.1 Global FOUP for Thin Wafer Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global FOUP for Thin Wafer Production Value by Region (2018-2029)
3.2.1 Global FOUP for Thin Wafer Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of FOUP for Thin Wafer by Region (2024-2029)
3.3 Global FOUP for Thin Wafer Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global FOUP for Thin Wafer Production by Region (2018-2029)
3.4.1 Global FOUP for Thin Wafer Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of FOUP for Thin Wafer by Region (2024-2029)
3.5 Global FOUP for Thin Wafer Market Price Analysis by Region (2018-2023)
3.6 Global FOUP for Thin Wafer Production and Value, Year-over-Year Growth
3.6.1 North America FOUP for Thin Wafer Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe FOUP for Thin Wafer Production Value Estimates and Forecasts (2018-2029)
3.6.3 China FOUP for Thin Wafer Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan FOUP for Thin Wafer Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea FOUP for Thin Wafer Production Value Estimates and Forecasts (2018-2029)
3.6.6 Taiwan FOUP for Thin Wafer Production Value Estimates and Forecasts (2018-2029)
4 FOUP for Thin Wafer Consumption by Region
4.1 Global FOUP for Thin Wafer Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global FOUP for Thin Wafer Consumption by Region (2018-2029)
4.2.1 Global FOUP for Thin Wafer Consumption by Region (2018-2023)
4.2.2 Global FOUP for Thin Wafer Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America FOUP for Thin Wafer Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America FOUP for Thin Wafer Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe FOUP for Thin Wafer Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe FOUP for Thin Wafer Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific FOUP for Thin Wafer Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific FOUP for Thin Wafer Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa FOUP for Thin Wafer Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa FOUP for Thin Wafer Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Materials
5.1 Global FOUP for Thin Wafer Production by Materials (2018-2029)
5.1.1 Global FOUP for Thin Wafer Production by Materials (2018-2023)
5.1.2 Global FOUP for Thin Wafer Production by Materials (2024-2029)
5.1.3 Global FOUP for Thin Wafer Production Market Share by Materials (2018-2029)
5.2 Global FOUP for Thin Wafer Production Value by Materials (2018-2029)
5.2.1 Global FOUP for Thin Wafer Production Value by Materials (2018-2023)
5.2.2 Global FOUP for Thin Wafer Production Value by Materials (2024-2029)
5.2.3 Global FOUP for Thin Wafer Production Value Market Share by Materials (2018-2029)
5.3 Global FOUP for Thin Wafer Price by Materials (2018-2029)
6 Segment by Application
6.1 Global FOUP for Thin Wafer Production by Application (2018-2029)
6.1.1 Global FOUP for Thin Wafer Production by Application (2018-2023)
6.1.2 Global FOUP for Thin Wafer Production by Application (2024-2029)
6.1.3 Global FOUP for Thin Wafer Production Market Share by Application (2018-2029)
6.2 Global FOUP for Thin Wafer Production Value by Application (2018-2029)
6.2.1 Global FOUP for Thin Wafer Production Value by Application (2018-2023)
6.2.2 Global FOUP for Thin Wafer Production Value by Application (2024-2029)
6.2.3 Global FOUP for Thin Wafer Production Value Market Share by Application (2018-2029)
6.3 Global FOUP for Thin Wafer Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Entegris
7.1.1 Entegris FOUP for Thin Wafer Corporation Information
7.1.2 Entegris FOUP for Thin Wafer Product Portfolio
7.1.3 Entegris FOUP for Thin Wafer Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Entegris Main Business and Markets Served
7.1.5 Entegris Recent Developments/Updates
7.2 Shin-Etsu Polymer
7.2.1 Shin-Etsu Polymer FOUP for Thin Wafer Corporation Information
7.2.2 Shin-Etsu Polymer FOUP for Thin Wafer Product Portfolio
7.2.3 Shin-Etsu Polymer FOUP for Thin Wafer Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Shin-Etsu Polymer Main Business and Markets Served
7.2.5 Shin-Etsu Polymer Recent Developments/Updates
7.3 Miraial
7.3.1 Miraial FOUP for Thin Wafer Corporation Information
7.3.2 Miraial FOUP for Thin Wafer Product Portfolio
7.3.3 Miraial FOUP for Thin Wafer Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Miraial Main Business and Markets Served
7.3.5 Miraial Recent Developments/Updates
7.4 Chuang King Enterprise
7.4.1 Chuang King Enterprise FOUP for Thin Wafer Corporation Information
7.4.2 Chuang King Enterprise FOUP for Thin Wafer Product Portfolio
7.4.3 Chuang King Enterprise FOUP for Thin Wafer Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Chuang King Enterprise Main Business and Markets Served
7.4.5 Chuang King Enterprise Recent Developments/Updates
7.5 Dainichi Shoji
7.5.1 Dainichi Shoji FOUP for Thin Wafer Corporation Information
7.5.2 Dainichi Shoji FOUP for Thin Wafer Product Portfolio
7.5.3 Dainichi Shoji FOUP for Thin Wafer Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Dainichi Shoji Main Business and Markets Served
7.5.5 Dainichi Shoji Recent Developments/Updates
7.6 Gudeng Precision
7.6.1 Gudeng Precision FOUP for Thin Wafer Corporation Information
7.6.2 Gudeng Precision FOUP for Thin Wafer Product Portfolio
7.6.3 Gudeng Precision FOUP for Thin Wafer Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Gudeng Precision Main Business and Markets Served
7.6.5 Gudeng Precision Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 FOUP for Thin Wafer Industry Chain Analysis
8.2 FOUP for Thin Wafer Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 FOUP for Thin Wafer Production Mode & Process
8.4 FOUP for Thin Wafer Sales and Marketing
8.4.1 FOUP for Thin Wafer Sales Channels
8.4.2 FOUP for Thin Wafer Distributors
8.5 FOUP for Thin Wafer Customers
9 FOUP for Thin Wafer Market Dynamics
9.1 FOUP for Thin Wafer Industry Trends
9.2 FOUP for Thin Wafer Market Drivers
9.3 FOUP for Thin Wafer Market Challenges
9.4 FOUP for Thin Wafer Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Published By : QY Research

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